Thermal Simulation of Four Die-Attach Materials

2008 ◽  
Author(s):  
Gregory K. Ovrebo
Keyword(s):  
Thermal Simulation ◽  
Die Attach

SPACE THERMAL SIMULATION FOR SATELLITE HEAT TRANSFER DESIGN EVALUATION

1974 ◽  
Author(s):  
Vasily D. Prian ◽  
Andy T. Calimbas ◽  
Edward A. LaBlanc
Keyword(s):  
Heat Transfer ◽  
Thermal Simulation ◽  
Design Evaluation

Analysis of Two Electrical Failures Caused by Die Attach of Exposed Pad Package

2014 ◽  
Author(s):  
Jinglong Li ◽  
Motohiko Masuda ◽  
Yi Che ◽  
Miao Wu
Keyword(s):  
Bonding Process ◽  
Die Attach ◽  
Die Bonding ◽  
Generic Analysis

Abstract Die attach is well known in die bonding process. Its electrical character is simple. But some failures caused by die attach are not so simple. And it is not proper to analyze by a generic analysis flow. The analysis of two failures caused by die attach are presented in this paper.

scholarly journals Thermal Simulation and Warping Deformation Experimental Study of PEEK in Material Extrusion

2021 ◽  
Vol 30 (2) ◽  
pp. 2170003
Author(s):  
Jiang Han ◽  
Ju Tong ◽  
Xiaoqing Tian ◽  
Lian Xia ◽  
Dingyifei Ma
Keyword(s):  
Experimental Study ◽  
Thermal Simulation ◽  
Material Extrusion

Pore Evolution of Lacustrine Organic-Rich Shales: Insights from Thermal Simulation Experiments

2021 ◽  
Vol 35 (4) ◽  
pp. 3079-3094
Author(s):  
Jingqiang Tan ◽  
Ruining Hu ◽  
Wenbin Luo ◽  
Zhongliang Ma ◽  
Guangmang He
Keyword(s):  
Thermal Simulation ◽  
Simulation Experiments ◽  
Pore Evolution
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