scholarly journals U--0.83 wt% Ti alloy: cooling rates of gamma-quenched alloy, resulting microstructure and response to aging

1974 ◽  
Author(s):  
C.A. Javorsky
Keyword(s):  
Ti Alloy ◽  
2022 ◽  
Vol 276 ◽  
pp. 125318
Author(s):  
Zhiying Zheng ◽  
Linjiang Chai ◽  
Zhihao Li ◽  
Weijiu Huang ◽  
Lin Tian ◽  
...  

Author(s):  
Naresh N. Thadhani ◽  
Thad Vreeland ◽  
Thomas J. Ahrens

A spherically-shaped, microcrystalline Ni-Ti alloy powder having fairly nonhomogeneous particle size distribution and chemical composition was consolidated with shock input energy of 316 kJ/kg. In the process of consolidation, shock energy is preferentially input at particle surfaces, resulting in melting of near-surface material and interparticle welding. The Ni-Ti powder particles were 2-60 μm in diameter (Fig. 1). About 30-40% of the powder particles were Ni-65wt% and balance were Ni-45wt%Ti (estimated by EMPA).Upon shock compaction, the two phase Ni-Ti powder particles were bonded together by the interparticle melt which rapidly solidified, usually to amorphous material. Fig. 2 is an optical micrograph (in plane of shock) of the consolidated Ni-Ti alloy powder, showing the particles with different etching contrast.


Author(s):  
J. Liu ◽  
N. D. Theodore ◽  
D. Adams ◽  
S. Russell ◽  
T. L. Alford ◽  
...  

Copper-based metallization has recently attracted extensive research because of its potential application in ultra-large-scale integration (ULSI) of semiconductor devices. The feasibility of copper metallization is, however, limited due to its thermal stability issues. In order to utilize copper in metallization systems diffusion barriers such as titanium nitride and other refractory materials, have been employed to enhance the thermal stability of copper. Titanium nitride layers can be formed by annealing Cu(Ti) alloy film evaporated on thermally grown SiO2 substrates in an ammonia ambient. We report here the microstructural evolution of Cu(Ti)/SiO2 layers during annealing in NH3 flowing ambient.The Cu(Ti) films used in this experiment were prepared by electron beam evaporation onto thermally grown SiO2 substrates. The nominal composition of the Cu(Ti) alloy was Cu73Ti27. Thermal treatments were conducted in NH3 flowing ambient for 30 minutes at temperatures ranging from 450°C to 650°C. Cross-section TEM specimens were prepared by the standard procedure.


2001 ◽  
Vol 11 (PR6) ◽  
pp. Pr6-151-Pr6-159 ◽  
Author(s):  
R. Guérin ◽  
M. El Ganaoui ◽  
P. Haldenwang ◽  
P. Bontoux

HortScience ◽  
1998 ◽  
Vol 33 (3) ◽  
pp. 545a-545
Author(s):  
M.D. Boyette

Prompt cooling to remove field heat is an essential part of proper postharvest handling for many types of fresh fruits and vegetables. Growers, consultants, and horticultural agents are often encouraged to collect cooling data (time vs. temperature) in order to compare cooling rates for different systems, containers, etc. These data can be misleading and confusing and seldom yield much useful information. With proper analysis, cooling data can yield a large amount of information. The problem is not the fault of the data, as much as the lack of simple methods to analyze these data. This presentation will demonstrate several simple methods to extract useful information from cooling data.


2020 ◽  
Author(s):  
Yitian Zhao ◽  
Mingyuan Lu ◽  
Zhiqi Fan ◽  
Qiyang Tan ◽  
Han Huang

2020 ◽  
Author(s):  
Chi-Toan Nguyen ◽  
Alistair Garner ◽  
Javier Romero ◽  
Antoine Ambard ◽  
Michael Preuss ◽  
...  

2020 ◽  
Author(s):  
Claire Puleio ◽  
◽  
Catherine Cooper ◽  
Erika Rader
Keyword(s):  

Sign in / Sign up

Export Citation Format

Share Document