scholarly journals Heat conduction in rectangular solids with internal heat generation

2020 ◽  
pp. 235-235
Author(s):  
Zhipeng Duan ◽  
Hao Ma
Keyword(s):  
Heat Conduction ◽  
Heat Generation ◽  
Shape Factor ◽  
Heat Conduction Problem ◽  
Rectangular Cross Section ◽  
Internal Heat ◽  
Engineering Practice ◽  
Constant Wall Temperature ◽  
Temperature Boundary ◽  
Steady State Heat

A representative steady-state heat conduction problem in rectangular solids with uniformly distributed heat generation has been investigated analytically. An analytical solution is provided by solving a nonhomogeneous partial differential equation. A simple and accurate model is proposed to predict the dimensionless shape factor parameter for the first time. The dimensionless shape factor is obtained in the light of the solution of Poisson equation with constant wall temperature boundary conditions. The area-mean temperature is found by integration on the rectangular cross-section. The model is very concise and nice for quick real world approximations, and it provides acceptable accuracy for engineering practice.

Conduction in Rings With Internal Heat Generation

2021 ◽  
Vol 143 (5) ◽  
Author(s):  
C. Y. Wang
Keyword(s):  
Cross Section ◽  
Heat Generation ◽  
Cross Sections ◽  
Rectangular Cross Section ◽  
Ritz Method ◽  
Circular Cross Section ◽  
Internal Heat ◽  
Internal Heat Generation ◽  
Convective Boundary ◽  
Steady State Heat

Abstract The basic problem of steady-state heat conduction in a ring with internal heat generation and convective boundary conditions is considered. An exact solution is found for the ring with a rectangular cross section and an efficient Ritz method is presented for general cross sections. The latter is applied to the torus or the ring with a circular cross section. Hot spots and cold spots are determined.

Integral Solutions of Phase Change With Internal Heat Generation

2004 ◽  
Author(s):  
Ali Siahpush ◽  
John Crepeau
Keyword(s):  
Differential Equation ◽  
Phase Change ◽  
Heat Generation ◽  
Numerical Solutions ◽  
Internal Heat ◽  
Melting Rate ◽  
Internal Heat Generation ◽  
Stefan Number ◽  
Temperature Boundary ◽  
Solid Liquid

This paper presents solutions to a one-dimensional solid-liquid phase change problem using the integral method for a semi-infinite material that generates internal heat. The analysis assumed a quadratic temperature profile and a constant temperature boundary condition on the exposed surface. We derived a differential equation for the solidification thickness as a function of the internal heat generation (IHG) and the Stefan number, which includes the temperature of the boundary. Plots of the numerical solutions for various values of the IHG and Stefan number show the time-dependant behavior of both the melting and solidification distances and rates. The IHG of the material opposes solidification and enhances melting. The differential equation shows that in steady-state, the thickness of the solidification band is inversely related to the square root of the IHG. The model also shows that the melting rate initially decreases and reaches a local minimum, then increases to an asymptotic value.

Numerical investigation of fast precooling of a cylindrical food product based on the hyperbolic heat conduction model

2013 ◽  
Vol 23 (6) ◽  
pp. 960-978 ◽  
Author(s):  
Mohammed Q. Al‐Odat
Keyword(s):  
Heat Conduction ◽  
Heat Generation ◽  
Internal Heat ◽  
Food Product ◽  
Heat Diffusion ◽  
Numerical Code ◽  
Hyperbolic Model ◽  
Hyperbolic Heat Conduction ◽  
Conduction Model ◽  
Content Type

PurposeIn this study, the purpose was to introduce two‐dimensional hyperbolic heat conduction equations in order to simulate the fast precooling process of a cylindrically shaped food product with internal heat generation. A modified model for internal heat generation due to respiration in the food product was proposed to take the effect of relaxation time into account. The obtained governing equations were solved numerically using an efficient finite difference technique. The influence of Biot number and heat generation parameters on thermal characteristics was examined and discussed. The results based on hyperbolic model were compared with the classical parabolic heat diffusion model. The present numerical code was validated via comparison with analytical solution and a good agreement was found.Design/methodology/approachThe obtained governing equations were solved numerically using an efficient finite difference technique.FindingsThe influence of Biot number and heat generation parameters on thermal characteristics was examined and discussed. The results based on hyperbolic model were compared with the classical parabolic heat diffusion model. The present numerical code was validated via comparison with analytical solution and a good agreement was found.Originality/valueTwo‐dimensional analysis of fast precooling of cylindrical food product based on hyperbolic heat conduction model has not been investigated yet.

Heat Conduction in Three Dimensional Stacked Packages

2005 ◽  
Author(s):  
Anand Desai ◽  
James Geer ◽  
Bahgat Sammakia
Keyword(s):  
Heat Conduction ◽  
Thermal Management ◽  
Heat Generation ◽  
Analytical Study ◽  
Three Dimensional ◽  
The Other ◽  
Heat Generation Rate ◽  
Potential Applications ◽  
Steady State Heat ◽  
Spatially Varying

This paper presents the results of an analytical study of steady state heat conduction in multiple rectangular domains. Any finite number of such domains may be considered in the current study. The thermal conductivity and thickness of these domains may be different. The entire geometry composed of these connected domains is considered as adiabatic on the lateral surfaces and can be subjected to uniform convective cooling at one end. The other end of the geometry may be adiabatic and a specified, spatially varying heat generation rate can be applied in each of the domains. The solutions are found to be in agreement with known solutions for simpler geometries. The analytical solution presented here is very general in that it takes into account the interface resistances between the layers. One application of this analytical study relates to the thermal management of a 3-D stack of devices and interconnect layers. Another possible application is to the study of hotspots in a chip stack with non uniform heat generation. Many other potential applications may also be simulated.

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