scholarly journals Prevention of Tape-Induced Si3N4 Damage in Semiconductor Silicon Devices Encapsulated Utilizing Lead-on-Chip Packaging Technique

2021 ◽  
Vol 62 (1) ◽  
pp. 105-110
Author(s):  
Seong-Min Lee
Keyword(s):  
Semiconductor Silicon ◽  
Silicon Devices ◽  
On Chip ◽  
Packaging Technique

DNA On Silicon Devices: On-Chip Synthesis, Hybridization, and Charge Transfer

2002 ◽  
Vol 41 (4) ◽  
pp. 615-617 ◽  
Author(s):  
Andrew R. Pike ◽  
Lars H. Lie ◽  
Robert A. Eagling ◽  
Lyndsey C. Ryder ◽  
Samson N. Patole ◽  
...  
Keyword(s):  
Charge Transfer ◽  
Silicon Devices ◽  
On Chip

DNA On Silicon Devices: On-Chip Synthesis, Hybridization, and Charge Transfer

2002 ◽  
Vol 114 (4) ◽  
pp. 637-639 ◽  
Author(s):  
Andrew R. Pike ◽  
Lars H. Lie ◽  
Robert A. Eagling ◽  
Lyndsey C. Ryder ◽  
Samson N. Patole ◽  
...  
Keyword(s):  
Charge Transfer ◽  
Silicon Devices ◽  
On Chip

On-Chip Diffusion Bonding creates Stable Interconnections Usable at Temperatures over 300°C

2019 ◽  
Vol 2019 (1) ◽  
pp. 000530-000534
Author(s):  
Jessica Richter ◽  
Anna Steenmann ◽  
Benjamin Schellscheidt ◽  
Thomas Licht
Keyword(s):  
Melting Point ◽  
Mechanical Stability ◽  
Transient Liquid Phase ◽  
Isothermal Solidification ◽  
Process Temperature ◽  
High Melting ◽  
Silicon Devices ◽  
Thin Region ◽  
On Chip ◽  
Almost All

Abstract In this paper, we present a conceptual design of an on-chip solder stack to connect silicon devices faster and more reliable. Almost all electronic devices rely on solder layers to provide electrical, mechanical, and thermal connections between components. We improve the solder connection with industry-standard solder parameters of 300°C and some minutes of soldering time. An ideal solder connection is composed of intermetallic phases (IMPs) at the interfaces between device and solder, and substrate and solder. Typically, a thin region of Sn-based solder remains between the two IMP layers at the interfaces. IMPs of copper (Cu) and tin (Sn) are Cu6Sn5 and Cu3Sn. The formation of IMPs is decisive for a good mechanical connection because of their high melting point and mechanical stability. To achieve these requirements, we implement the solder stack as a transient liquid phase bonding (TLPB) system. To realize durable interconnections, we use the diffusion of a high-melting first component in a second component, which is liquid at solder process temperature. Ongoing diffusion leads to the formation of IMPs with a melting point above process temperature, resulting in a solidification of the connection at constant temperature. By this isothermal solidification, the solder connection becomes more durable against mechanical and thermal load and is usable at temperatures exceeding 300°C.

Microstructures of Al(Pd, Nb) and Al(Ti) lines for VLSI

1992 ◽  
Vol 50 (2) ◽  
pp. 1388-1389
Author(s):  
C. Stanis ◽  
D. Smith ◽  
P. Blauner ◽  
M. Small
Keyword(s):  
Large Scale ◽  
Thermal Stresses ◽  
Feature Size ◽  
Silicon Devices ◽  
Large Scale Integration ◽  
Thermal Expansivities ◽  
Current Densities ◽  
And Performance ◽  
On Chip ◽  
Scale Integration

Very Large Scale Integration necessitated an ongoing and rapid decrease in the minimum feature size which must be made on silicon devices with the aims of improving productivity and performance. Conductor lines are commonly made from Al(Cu). Widths of 1.5 μm for conductor lines are common today, submicron lines are in late stages of development and 0.25 μm lines will be needed. These dimensions present new issues since the feature size is of the same order as the grain size of the Al and other metal alloys presently used for chip wiring. In order to make on-chip wiring reliable at these dimensions it is necessary to optimise the resistance to the stresses placed on them: electromigration due to increasing current densities; thermal stresses due to differences in thermal expansivities. The kinetics of both processes are dominated by interface transport. The resistance of the metal to both stresses can be modified by alloying.

A Microfluidic Packaging Technique for Lab-on-Chip Applications

2009 ◽  
Vol 32 (2) ◽  
pp. 410-416 ◽  
Author(s):  
Ebrahim Ghafar-Zadeh ◽  
Mohamad Sawan ◽  
Daniel Therriault
Keyword(s):  
Lab On Chip ◽  
On Chip ◽  
Packaging Technique

Gut microbiome a promising target for management of respiratory diseases

2020 ◽  
Vol 477 (14) ◽  
pp. 2679-2696
Author(s):  
Riddhi Trivedi ◽  
Kalyani Barve
Keyword(s):  
Respiratory Diseases ◽  
New Technology ◽  
Bacterial Flora ◽  
Systemic Circulation ◽  
The Body ◽  
Lung Pathology ◽  
Promising Target ◽  
Current Therapies ◽  
Intestinal Microbial Flora ◽  
On Chip

The intestinal microbial flora has risen to be one of the important etiological factors in the development of diseases like colorectal cancer, obesity, diabetes, inflammatory bowel disease, anxiety and Parkinson's. The emergence of the association between bacterial flora and lungs led to the discovery of the gut–lung axis. Dysbiosis of several species of colonic bacteria such as Firmicutes and Bacteroidetes and transfer of these bacteria from gut to lungs via lymphatic and systemic circulation are associated with several respiratory diseases such as lung cancer, asthma, tuberculosis, cystic fibrosis, etc. Current therapies for dysbiosis include use of probiotics, prebiotics and synbiotics to restore the balance between various species of beneficial bacteria. Various approaches like nanotechnology and microencapsulation have been explored to increase the permeability and viability of probiotics in the body. The need of the day is comprehensive study of mechanisms behind dysbiosis, translocation of microbiota from gut to lung through various channels and new technology for evaluating treatment to correct this dysbiosis which in turn can be used to manage various respiratory diseases. Microfluidics and organ on chip model are emerging technologies that can satisfy these needs. This review gives an overview of colonic commensals in lung pathology and novel systems that help in alleviating symptoms of lung diseases. We have also hypothesized new models to help in understanding bacterial pathways involved in the gut–lung axis as well as act as a futuristic approach in finding treatment of respiratory diseases caused by dysbiosis.

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