scholarly journals Tensile strength of sintered silicon nitride at room and high temperatures.

1987 ◽  
Vol 36 (405) ◽  
pp. 563-569 ◽  
Author(s):  
Tsuneshichi TANAKA ◽  
Nagatoshi OKABE ◽  
Akiyoshi SAKAIDA
Keyword(s):  
Tensile Strength ◽  
Silicon Nitride ◽  
High Temperatures ◽  
Sintered Silicon

scholarly journals Fracture Toughness Test of Sintered Silicon Nitride at Room and High Temperatures

1989 ◽  
Vol 38 (426) ◽  
pp. 261-267 ◽  
Author(s):  
Tsuneshichi TANAKA ◽  
Nagatoshi OKABE ◽  
Akiyoshi SAKAIDA ◽  
Hideaki NAKAYAMA
Keyword(s):  
Fracture Toughness ◽  
Silicon Nitride ◽  
High Temperatures ◽  
Fracture Toughness Test ◽  
Toughness Test ◽  
Sintered Silicon

scholarly journals Fracture Energy and Tensile strength of Silicon Nitride at High Temperatures

1990 ◽  
Vol 98 (1135) ◽  
pp. 235-242 ◽  
Author(s):  
Tatsuki OHJI ◽  
Seisuke SAKAI ◽  
Masaru ITO ◽  
Yukihiko YAMAUCHI ◽  
Wataru KANEMATSU ◽  
...  
Keyword(s):  
Tensile Strength ◽  
Silicon Nitride ◽  
Fracture Energy ◽  
High Temperatures

scholarly journals Crack Growth and Crack-Tip Blunting of Sintered Silicon Nitride at High Temperatures

1985 ◽  
Vol 93 (1080) ◽  
pp. 426-432 ◽  
Author(s):  
Akira OKADA ◽  
Masaji MATSUNAGA ◽  
Yoshiaki AKOH
Keyword(s):  
Silicon Nitride ◽  
Crack Growth ◽  
High Temperatures ◽  
Crack Tip ◽  
Sintered Silicon ◽  
Crack Tip Blunting

Tensile Strength Properties of Sintered Silicon Nitride

1988 ◽  
pp. 1022-1027
Author(s):  
Tatsuki Ohji ◽  
Seisuke Sakai ◽  
Masaru Ito ◽  
Yukihiko Yamauchi ◽  
Wataru Kanematsu ◽  
...  
Keyword(s):  
Tensile Strength ◽  
Silicon Nitride ◽  
Strength Properties ◽  
Sintered Silicon

Tensile properties of finger-jointed lumber under high-temperature and oxygen-free conditions

Holzforschung ◽  
2021 ◽  
Vol 0 (0) ◽  
Author(s):  
Kong Yue ◽  
Feng Wang ◽  
Weidong Lu ◽  
Zhongqiu Tang ◽  
Zhangjing Chen ◽  
...  
Keyword(s):  
Tensile Strength ◽  
Tensile Properties ◽  
High Temperatures ◽  
Variable Temperature ◽  
Physical Property ◽  
Solid Wood ◽  
Nitrogen Atmosphere ◽  
Thermal Physical Property ◽  
Electron Microscopy Analysis ◽  
Increasing Temperature

Abstract A model for engineered wood was developed that considers the parallel-to-grain tensile strength of finger-jointed lumber at high temperatures relevant to fire conditions. The finger-jointed lumber was composed of Douglas fir, larch, and poplar wood with phenol-resorcinol-formaldehyde (PRF) as an adhesive. The tensile properties of the finger-jointed lumber were evaluated at high temperatures under oxygen-free conditions, i.e. in a nitrogen atmosphere. A combination of chemical and thermal-physical property analysis of the PRF adhesive and microscopic observations on the glueline was used to discuss the reduction of tensile strength of the parallel-to-grain finger-jointed lumber at variable temperature. The results show that the tensile strength of the finger-jointed lumber decreased linearly with increasing temperature. The parallel-to-grain tensile strength of the PRF finger-jointed samples at 20 and 280 °C were 84 and 5% of the tensile strength of the solid wood at 20 °C, respectively. The thermal-physical properties and scanning electron microscopy analysis revealed that the pyrolysis intensity of the PRF adhesive was lower than that of the wood at 220 °C or higher.

ChemInform Abstract: OXIDATION OF THIN SHEET REACTION-SINTERED SILICON NITRIDE

1978 ◽  
Vol 9 (24) ◽  
Author(s):  
J. B. WARBURTON ◽  
J. E. ANTILL ◽  
R. W. M. HAWES
Keyword(s):  
Silicon Nitride ◽  
Thin Sheet ◽  
Sintered Silicon
Sign in / Sign up

Export Citation Format

Share Document