On the generalized VIP time integral methodology for transient thermal problems

1993 ◽  
Author(s):  
YOUPING MEI ◽  
XIAOQIN CHEN ◽  
KUMAR TAMMA ◽  
DESONG SHA
Keyword(s):  
Time Integral ◽  
Transient Thermal

Comparison of Ion-Milling Techniques For Cross-Sectional TEM of Semiconductors

1985 ◽  
Vol 43 ◽  
pp. 166-167
Author(s):  
Julia T. Luck ◽  
C. W. Boggs ◽  
S. J. Pennycook
Keyword(s):  
Analytical Techniques ◽  
Sample Surface ◽  
Ion Milling ◽  
Cross Sectional ◽  
Reliable Technique ◽  
Near Surface ◽  
Transmission Electron ◽  
Thin Region ◽  
Transient Thermal

The use of cross-sectional Transmission Electron Microscopy (TEM) has become invaluable for the characterization of the near-surface regions of semiconductors following ion-implantation and/or transient thermal processing. A fast and reliable technique is required which produces a large thin region while preserving the original sample surface. New analytical techniques, particularly the direct imaging of dopant distributions, also require good thickness uniformity. Two methods of ion milling are commonly used, and are compared below. The older method involves milling with a single gun from each side in turn, whereas a newer method uses two guns to mill from both sides simultaneously.

NUMERICAL AND EXPERIMENTAL STUDY OF TRANSIENT THERMAL BEHAVIOR OF ELECTRONIC INFRARED RADIATION CONTROL MODULE

2019 ◽  
Vol 50 (17) ◽  
pp. 1721-1736
Author(s):  
Kaiqiang Hou ◽  
Xiaolong Weng ◽  
Wei Luo ◽  
Le Yuan ◽  
Wei Duan ◽  
...  
Keyword(s):  
Experimental Study ◽  
Thermal Behavior ◽  
Infrared Radiation ◽  
Control Module ◽  
Radiation Control ◽  
Transient Thermal
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