Effect of external surface cooling of the plane-parallel layer on the temperature of the layer-base tribosystem

2008 ◽  
Vol 29 (6) ◽  
pp. 455-460 ◽  
Author(s):  
A. Evtushenko ◽  
M. Kutsey
Keyword(s):  
External Surface ◽  
Surface Cooling ◽  
Plane Parallel ◽  
Parallel Layer

Reflection of light from a plane-parallel layer modulated by ultrasound

2005 ◽  
Vol 98 (1) ◽  
pp. 84-88
Author(s):  
G. V. Kulak ◽  
T. V. Nikolaenko
Keyword(s):  
Plane Parallel ◽  
Parallel Layer ◽  
Reflection Of Light

Inelastic High-Energy Electron Spectrafrom Plane-Parallel Layer-Nonhomogeneous Surfaces

1991 ◽  
Vol 46 (10) ◽  
pp. 851-857 ◽  
Author(s):  
V. P. Afanas’ev ◽  
D. Naujoks
Keyword(s):  
Solid Angle ◽  
High Energy ◽  
Initial Energy ◽  
Energy Spectra ◽  
Invariant Imbedding ◽  
Adequate Description ◽  
Reflection Function ◽  
Plane Parallel ◽  
Parallel Layer ◽  
Method Of Invariant Imbedding

AbstractWe consider inelastic backscattering of electrons with initial energy of tens and hundreds of keV by plane-parallel homogeneous and sandwiched targets. Basing on the invariance principle, we find expressions that describe the dynamics of the changes in the energy spectra of electrons reflected into a given solid angle that occur with increase of the thickness of films of different materials on substrates of finite and infinite thickness. We substantiate a procedure of linearizing the equations for the reflection function obtained by the method of invariant imbedding. We obtain an analytical solution of linearized equations in the form of a series in Legendre polynomials. A comparison with experimental data shows that the theory developed gives an adequate description of the process of electron backscattering.

Nonlinear luminescence of a plane-parallel layer

1965 ◽  
Vol 3 (3) ◽  
pp. 172-179
Author(s):  
E. P. Zege ◽  
A. P. Ivanov
Keyword(s):  
Plane Parallel ◽  
Parallel Layer ◽  
Nonlinear Luminescence

scholarly journals Cooling of a Processor With the Use of a Heat Pump

2018 ◽  
Vol 28 (1) ◽  
pp. 16-25
Author(s):  
Zygmunt Lipnicki ◽  
Hanna Lechów ◽  
Katarzyna Pantoł
Keyword(s):  
Theoretical Analysis ◽  
Heat Pump ◽  
External Surface ◽  
Cooling System ◽  
Heat Distribution ◽  
Surface Cooling ◽  
Cooling Systems ◽  
Model Calculations ◽  
Systems Model ◽  
Liquid Evaporation

Abstract In this paper the problem of cooling a component, in the interior of which heat is generated due to its work, was solved analytically. the problem of cooling of a processor with the use of a heat pump was solved based on a earlier theoretical analysis of authors of external surface cooling of the cooled component by using the phenomenon of liquid evaporation. Cases of stationary and non-stationary cooling were solved as well. The authors of the work created a simplified non-stationary analytical model describing the phenomenon, thanks to which heat distribution within the component, contact temperature between the component and liquid layer, and the evaporating substance layer thickness in relation to time, were determined. Numerical calculations were performed and appropriate charts were drawn. The resulting earlier analytical solutions allowed conclusions to be drawn, which might be of help to electronics engineers when designing similar cooling systems. Model calculations for a cooling system using a compressor heat pump as an effective method of cooling were performed.

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