Copper Filling of Deep Sub-μm Through-Holes and Trenches by Using High-Vacuum Magnetron Sputtering and Supercritical Carbon Dioxide
2011 ◽
Vol 54
(3)
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pp. 173-176
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Keyword(s):
2016 ◽
Vol 3
(1)
◽
pp. 1-10
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Keyword(s):
2017 ◽
2019 ◽
Vol 20
(5)
◽
pp. 402-409
◽
Keyword(s):
2006 ◽
Vol 35
(10)
◽
pp. 1439-1443