High-Frequency TSV Failure Detection Method with Z Parameter

As the TSV count increases, chip yield can be severely degraded due to failures during the TSV or die-stacking processes. This paper will present and discuss on the usage of failure masks designed to detect and differentiate failure types such as connection failure and insulator failure based on frequency-domain one point probing measurement. The failure masks are proposed on the basis of the frequency domain analysis of TSV failures with Z11 magnitudes.