scholarly journals Electroless Platinum Deposition Using Co3+/Co2+ Redox Couple as a Reducing Agent

Materials ◽  
2021 ◽  
Vol 14 (8) ◽  
pp. 1893
Author(s):  
Loreta Tamasauskaite-Tamasiunaite ◽  
Yezdi Dordi ◽  
Eugenijus Norkus ◽  
Ina Stankeviciene ◽  
Aldona Jagminiene ◽  
...  
Keyword(s):  
Deposition Rate ◽  
Electroless Deposition ◽  
Quartz Crystal ◽  
Additional Data ◽  
Redox System ◽  
Electrochemical Quartz Crystal Microbalance ◽  
Reducing Agent ◽  
Plating Solution ◽  
Pt Films ◽  
Kinetics Of

In the present work, the kinetics of electroless deposition of Pt, using a cobalt ion redox system (Co3+/Co2+) as a reducing agent, has been investigated. The deposition rate of Pt depends on the pH, concentration of reactants, and temperature. The deaeration and bubbling of the plating solution with argon play an essential role. It was found that 0.11 mg cm−2 of Pt films could be deposited on the surface of a roughed glass sheet in one hour without replenishing the solution. Additional data have been obtained on the grounds of electrochemical quartz crystal microbalance experiments. The bubbling (agitation) of the electroless Pt plating solution with argon during the deposition of Pt results in a higher deposition rate and is ca. 3 µg cm−2 min−1. The Pt deposition rate is far less, and is as low as 0.14 µg cm−2 min−1 when the electroless Pt plating solution is not bubbled with argon during the deposition of Pt.

scholarly journals Electroless deposition of nickel boron coatings using morpholine borane as a reducing agent

Chemija ◽  
2020 ◽  
Vol 31 (1) ◽  
Author(s):  
Zita Sukackienė ◽  
Kornelija Antanavičiūtė ◽  
Jūratė Vaičiūnienė ◽  
Loreta Tamašauskaitė-Tamašiūnaitė ◽  
Arnas Naujokaitis ◽  
...  
Keyword(s):  
Deposition Rate ◽  
Electroless Deposition ◽  
Reducing Agent ◽  
Plating Bath ◽  
Plating Solution

Nickel boron (NiB) coatings were deposited onto copper using a nickelglycine (Ni-Gly) plating solution and morpholine borane (MB) as a reducing agent. It has been determined that using MB as a reducing agent in the Ni-Gly plating solution produces NiB coatings, which exhibit typical cauliflower-like textures. The deposition rate of the NiB coatings and their composition depend on the concentrations of the reducing agent (MB) and the ligand (Gly), in addition to the pH and temperature of the plating solution. The highest deposition rate (3.42 mg cm–2 h–1) of the NiB coating was obtained when the plating bath was operated at pH 5 and 60°C temperature. Using this method, NiB coatings containing 10–20 at.% of boron can be obtained.

scholarly journals Studying the effects of bismuth on the electrochemical properties of lead dioxide layers by using the in situ EQCM technique

2020 ◽  
Vol 24 (11-12) ◽  
pp. 2733-2739
Author(s):  
Balázs Broda ◽  
György Inzelt
Keyword(s):  
Sulfuric Acid ◽  
Quartz Crystal ◽  
Lead Dioxide ◽  
Electrochemical Quartz Crystal Microbalance ◽  
Lead Sulfate ◽  
Acid Media ◽  
Sulfuric Acid Solutions ◽  
Kinetics Of ◽  
Thick Lead

Abstract The charge-discharge characteristics and the aging mechanism of PbO2 layers doped with bismuth in contact with sulfuric acid solutions were studied by using combined cyclic voltammetry and electrochemical quartz crystal microbalance (EQCM) techniques. For this purpose, thick lead dioxide layers (non-doped and doped with Bi) were electrodeposited on gold substrate from aqueous solutions of Pb(NO3)2 dissolved in nitric acid and they were investigated in sulfuric acid media. Based on the electrochemical and the mass change responses, it is concluded that during the electrodeposition, bismuth influences the structure of the PbO2 formed. Bi(III) also inhibits the oxidation of lead sulfate and affects the reduction kinetics of lead dioxide. During successive cyclization (aging), the presence of bismuth accelerates the hydration of PbO2.

Kinetics of viscoelasticity in the electric double layer following steps in the electrode potential studied by a fast electrochemical quartz crystal microbalance (EQCM)

The Analyst ◽  
2021 ◽  
Author(s):  
Christian Leppin ◽  
Astrid Peschel ◽  
Frederick Sebastian Meyer ◽  
Arne Langhoff ◽  
Diethelm Johannsmann
Keyword(s):  
Double Layer ◽  
Quartz Crystal Microbalance ◽  
Electric Double Layer ◽  
Electrode Potential ◽  
Quartz Crystal ◽  
Electrochemical Quartz Crystal Microbalance ◽  
Kinetics Of ◽  
Viscosity Changes

A fast EQCM measures the kinetics of the viscosity changes inside the double layer following voltage jumps.

Hole Formation in Gold Films

1972 ◽  
Vol 30 ◽  
pp. 510-511
Author(s):  
R. W. Vook ◽  
R. Cook ◽  
R. Ziemer
Keyword(s):  
Deposition Rate ◽  
Quartz Crystal ◽  
Evaporation Rate ◽  
Gold Films ◽  
Hole Density ◽  
Hole Formation ◽  
Microscope Slide ◽  
Crystal Film ◽  
Glass Microscope Slide ◽  
Glass Microscope

During recent experiments on Au films, a qualitative correlation between hole formation and deposition rate was observed. These early studies were concerned with films 80 to 1000A thick deposited on glass at -185°C and annealed at 170°C. In the present studies this earlier work was made quantitative. Deposition rates varying between 5 and 700 A/min were used. The effects of deposition rate on hole density for two films 300 and 700A thick were investigated.Au was evaporated from an outgassed W filament located 10 cm from a glass microscope slide substrate and a quartz crystal film thickness monitor. A shutter separating the filament from the substrate and monitor made it possible to obtain a constant evaporation rate before initiating deposition. The pressure was reduced to less than 1 x 10-6 torr prior to cooling the substrate with liquid nitrogen. The substrate was cooled in 15 minutes during which the pressure continued to drop to the mid 10-7 torr range, where deposition was begun.

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