Bonding-Based Wafer-Level Vacuum Packaging Using Atomic Hydrogen Pre-Treated Cu Bonding Frames
2018 ◽
Vol 9
(4)
◽
pp. 181
◽
Koki Tanaka
◽
Hideki Hirano
◽
Masafumi Kumano
◽
Joerg Froemel
◽
Shuji Tanaka
2015 ◽
Vol 15
(9)
◽
pp. 24257-24268
◽
Bo Xie
◽
Yonghao Xing
◽
Yanshuang Wang
◽
Jian Chen
◽
Deyong Chen
◽
...
Masashi Okada
◽
Isao Sugaya
◽
Hajime Mitsuishi
◽
Hidehiro Maeda
◽
Toshimasa Shimoda
◽
...
2014 ◽
Vol 64
(5)
◽
pp. 297-304
◽
M. Wu
◽
J. Moulin
◽
G. Agnus
◽
A. Bosseboeuf
2013 ◽
Vol 20
(2)
◽
pp. 47-51
◽
Minjae Lee
◽
Sarah Eunkyung Kim
◽
Sungdong Kim
Honglin Zhang
◽
Bing An
◽
Chenxu Niu
2018 ◽
Vol 28
(4)
◽
pp. 044002
◽
Teruhisa Akashi
◽
Hirofumi Funabashi
◽
Hideki Takagi
◽
Yoshiteru Omura
◽
Yoshiyuki Hata
2013 ◽
Vol 60
◽
pp. 251-259
◽
Fredrik Forsberg
◽
Niclas Roxhed
◽
Andreas C. Fischer
◽
Björn Samel
◽
Per Ericsson
◽
...
2016 ◽
Vol 75
(9)
◽
pp. 291-297
◽
C. Liu
◽
H. Hirano
◽
J. Froemel
◽
S. Tanaka
2015 ◽
Vol 62
(12)
◽
pp. 4154-4160
◽
Isao Sugaya
◽
Masashi Okada
◽
Hajime Mitsuishi
◽
Hidehiro Maeda
◽
Toshimasa Shimoda
◽
...