scholarly journals Sensors for Thermal Characterization of Solid and Liquid Samples by 3-Omega Method

Proceedings ◽  
2018 ◽  
Vol 2 (13) ◽  
pp. 883
Author(s):  
Kestutis Grigoras ◽  
Aapo Varpula ◽  
Corinna Grosse ◽  
Daniel May ◽  
Mohamad Abo Ras ◽  
...  
Keyword(s):  
Porous Silicon ◽  
Thermal Characterization ◽  
Back Side ◽  
Silicon Chips ◽  
Liquid Samples ◽  
Omega Method ◽  
3 Omega ◽  
3 Omega Method ◽  
Glass Chips

Microchips have been designed and fabricated for the fast thermal characterization of samples by extension of the 3-omega method. Both solid and liquid samples can be measured by applying a small amount of material under investigation on the chip containing a micro heater/sensor. Two types of chips have been fabricated and tested: silicon chips with porous silicon (PS) layer as thermal isolator and glass chips with through glass vias (TGVs) for the back side contacting of the top side heater/sensor.

Near-surface thermal characterization of plasma facing components using the 3-omega method

2014 ◽  
Vol 455 (1-3) ◽  
pp. 56-60 ◽  
Author(s):  
Edward Dechaumphai ◽  
Joseph L. Barton ◽  
Joseph R. Tesmer ◽  
Jaeyun Moon ◽  
Yongqiang Wang ◽  
...  
Keyword(s):  
Thermal Characterization ◽  
Near Surface ◽  
Plasma Facing Components ◽  
Omega Method ◽  
3 Omega ◽  
3 Omega Method

Thermal Characterization of Polymer Composites by Using the 3-Omega Method

2013 ◽  
Author(s):  
Dong-Wook Oh ◽  
Young Kim ◽  
Jun Seok Choi ◽  
Ook Joong Kim ◽  
Kong Hoon Lee
Keyword(s):  
Thermal Conductivity ◽  
Polymer Composites ◽  
Thermal Characterization ◽  
Mechanical And Thermal Properties ◽  
Additive Concentration ◽  
3Ω Method ◽  
Omega Method ◽  
3 Omega ◽  
Property Measurement

Polymer composites having comparable thermal conductivity to stainless steel at room temperature are commercially available nowadays. Metal or carbon fiber and particles are added to base polymers to enhance mechanical and thermal performance. However for polymer composites having high additive concentration, characterizing mechanical and thermal properties of the composite may be a challenging problem due to an-isotropic natural and non-homogeneity. In this paper, a novel thermal property measurement method based on the 3-omega (3ω) is proposed for thermal analysis of polymer composites. Sensitivity and feasible limit of the 3ω method with “boundary mismatch assumption” is analyzed for measurement of polymer composites having broad range of thermal conductivity.

scholarly journals Microfabricated sensor platform with through-glass vias for bidirectional 3-omega thermal characterization of solid and liquid samples

2018 ◽  
Vol 278 ◽  
pp. 33-42 ◽  
Author(s):  
Corinna Grosse ◽  
Mohamad Abo Ras ◽  
Aapo Varpula ◽  
Kestutis Grigoras ◽  
Daniel May ◽  
...  
Keyword(s):  
Thermal Characterization ◽  
Liquid Samples ◽  
Sensor Platform ◽  
3 Omega

Thermal conductivity study of porous low K dielectric materials

1999 ◽  
Vol 565 ◽  
Author(s):  
Chuan Hu ◽  
Michael Morgen ◽  
Paul S. Ho ◽  
Anurag Jain ◽  
William. N. Gill ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Materials ◽  
Porous Films ◽  
Low Dielectric ◽  
Omega Method ◽  
3 Omega ◽  
Low Dielectric Constant Materials ◽  
Low K ◽  
Method Analysis

AbstractA quantitative characterization of the thermal properties is required to assess the thermal performance of low dielectric constant materials. Recently we have developed a technique based on the 3-omega method for measuring the thermal conductivity of porous dielectric thin films. In this paper we present the results on the measurements of thermal conductivity of thin porous films using this method. A finite element method analysis is used to evaluate the approximations used in the measurement. Two porosity-weighted thermal resistor models are proposed to interpret the results. By studying the dependence of the thermal conductivity on porosity, we are able to discuss the scaling rule of thermal conductivity. Additionally, a steady state layered heater model is used for evaluating the significance of introducing porous ILDs into an interconnect structure.

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