Modelling sound wave propagation through corrugated macro-geometry arrangement of porous material for combined heat sink and noise reduction applications

2021 ◽  
Vol 263 (2) ◽  
pp. 4863-4870
Author(s):  
Harshavardhan Ronge ◽  
Shankar Krishnan ◽  
Sripriya Ramamoorthy
Keyword(s):  
Wave Propagation ◽  
Sound Wave ◽  
Heat Sink ◽  
Flow Resistance ◽  
Sound Propagation ◽  
Transmission Loss ◽  
Duct Flow ◽  
Prior Model ◽  
Acoustic Performance ◽  
Porous Walls

In convective air-cooled heat sink applications with space constraints, corrugated geometries can be used as in-duct sound absorbing structures offering lower duct-flow resistance than other geometries such as block-shape, wedge-shape geometries. Sound wave propagation through this geometry is presented using a simple 1-D acoustic model. Using the model, acoustic performance of corrugated sample is evaluated in terms of its transmission loss in dB. Thermal resistance and pressure drop values are also reported and compared with acoustic performance as function of number of corrugations and length of corrugated sample. A rectangular corrugated geometry has alternate inlet and outlet channels separated by porous walls. Sound propagation across this arrangement is modelled by extending prior model from literature with similar geometries. Prior model by Allam and Åbom (2005) is highly symmetric about the channels and porous walls are modelled by simple steady flow resistance equation. In current work, appropriate considerations are taken into account for the configuration of corrugated geometries suitable to general heat sink applications and sound wave propagation through porous walls is predicted by using Johnson-Champoux-Allard (jca) model. The porous walls at ends of the geometry are modelled as in acoustically series-parallel network combinations. Further, effect of heat sink temperature on sound wave propagation is also explored using the model.

Simulation of Sound Wave Propagation With Damping for Realistic Sound rendering for Games and Interactive Applications

2012 ◽  
Author(s):  
Bruno Moreira ◽  
Mauricio Kischinhevsky ◽  
Marcelo Zamith ◽  
Esteban Clua ◽  
Diego Brandao
Keyword(s):  
Wave Propagation ◽  
Sound Wave ◽  
Interactive Applications ◽  
Sound Rendering

scholarly journals Novel Heat-Mitigating Chip-on-Probe for Brain Stimulation Behavior Experiments

Sensors ◽  
2020 ◽  
Vol 20 (24) ◽  
pp. 7334
Author(s):  
Seongwoog Oh ◽  
Jungsuek Oh
Keyword(s):  
Brain Stimulation ◽  
Heat Sink ◽  
Transmission Loss ◽  
Maximum Output Power ◽  
Circuit Board ◽  
Oxide Semiconductor ◽  
Normal Operation ◽  
Cmos Process ◽  
Maximum Output ◽  
The Brain

This paper proposes a novel design for a chip-on-probe with the aim of overcoming the heat dissipation effect during brain stimulations using modulated microwave signals. The temperature of the stimulus chip during normal operation is generally 40 °C–60 °C, which is sufficient to cause unintended temperature effects during stimulation. This effect is particularly fatal in brain stimulation applications that require repeated stimulation. This paper proposes, for the first time, a topology that vertically separates the stimulus chip generating the stimulus signal and the probe delivering the signal into the brain to suppress the heat transfer while simultaneously minimizing the radio frequency (RF) transmission loss. As the proposed chip-on-probe should be attached to the head of a small animal, an auxiliary board with a heat sink was carefully designed considering the weight that does not affect the behavior experiment. When the transition structures are properly designed, a heat sink can be mounted to maximize the cooling effect, reducing the temperature by more than 13 °C in a simulation when the heat generated by the chip is transferred to the brain, while the transition from the chip to the probe experiences a loss of 1.2 dB. Finally, the effectiveness of the proposed design is demonstrated by fabricating a chip with the 0.28 μm silicon-on-insulator (SOI) complementary metal–oxide–semiconductor (CMOS) process and a probe with a RT6010 printed-circuit board (PCB), showing a temperature reduction of 49.8 °C with a maximum output power of 11 dBm. In the proposed chip-on-probe device, the temperature formed in the area in contact with the brain is measured at 31.1 °C.

Sound-wave propagation in a rarefied gas

1979 ◽  
Vol 8 (4) ◽  
pp. 219-240 ◽  
Author(s):  
J. R. Thomas ◽  
C. E. Siewert
Keyword(s):  
Wave Propagation ◽  
Sound Wave ◽  
Rarefied Gas
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