scholarly journals Prototipo limpiador de frijol aplicando dispositivos lógicos programables

2019 ◽  
pp. 7-13
Author(s):  
Jorge Sosa-Sales ◽  
Odalis Bernal-Navarro ◽  
Abraham Martinez-Vazquez ◽  
Juan Ruben Rodriguez-Machuca
Keyword(s):  
Small Farmers ◽  
Cleaning Process ◽  
Sensors And Actuators ◽  
Cleaning Procedure ◽  
Clean Product

The project focuses on the cleaning of beans through the separation of impurities by screening machines, with the aim of helping small farmers who grow and sell their beans. Beans are among the most comsumed foods; however, the cleaning process is tedious, so we want to develop a system that performs such process in different stages of selection. Grains vary in price and quality in different places due to the conditions in which they are sold. This is because when they are sold in a supermarket, the product must be considered first level, which means, they must be of a homogeneous size and clean of any type of garbage. The purpose of this prototype is to clean the beans in such a way that it separates the impurities they might have and obtain a clean product. We begin by defining the cleaning procedure, then performing the structure and placement of sensors and actuators, and finally the programming and adjustments necessary for its operation. With this prototype, people who cultivate and extract the seeds can perform the cleaning and generate greater profits.

SPFM Pre-Cleaning for formation of Silicon Interfaces by Wafer Bonding

1997 ◽  
Vol 477 ◽  
Author(s):  
Stefan Bengtsson ◽  
Karin Ljungberg
Keyword(s):  
Electrical Properties ◽  
Wafer Bonding ◽  
Silicon Surface ◽  
Room Temperature ◽  
Electrical Characterization ◽  
Preparation Procedure ◽  
Cleaning Process ◽  
Spreading Resistance ◽  
Cleaning Procedure

ABSTRACTThe use of H2SO4:H2O2:HF (SPFM) at low HF concentrations (10 to 1000 ppm) has been investigated as the preparation procedure prior to formation of Si/Si interfaces by wafer bonding. The SPFM cleaning process makes it possible to form a hydrophilic (OH terminated) silicon surface, thereby achieving a spontaneous and strong room temperature bond. Electrical characterization using current vs voltage and spreading resistance measurements shows that this cleaning procedure can be used to form Si/Si junctions with excellent electrical properties. Some of the problems related to hydrophobic wafer bonding can thus be circumvented by the proposed technique.

The Influence of Wafer Cleaning Process on the Silicon Surface Roughness

2015 ◽  
Vol 1109 ◽  
pp. 262-265
Author(s):  
S. Norhafiezah ◽  
R.M. Ayub ◽  
Mohd Khairuddin Md Arshad ◽  
A.H. Azman ◽  
M.A. Farehanim ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Silicon Wafer ◽  
Silicon Surface ◽  
Wafer Fabrication ◽  
Wafer Surface ◽  
Cleaning Process ◽  
Cleaning Procedure ◽  
Acidic Solutions ◽  
Wafer Cleaning ◽  
Semiconductor Fabrication

The cleaning process of the silicon wafer becomes one of the most important procedures in semiconductor fabrication. It is acknowledged to remove the contamination on the wafer surface as well as to promote an acceptable surface roughness, prior to performing various deposition methods. The wafer cleaning process which based on hot alkaline and acidic solutions is known as the RCA cleaning. The RCA is still the most important wafer cleaning method used in wafer fabrication industry. In this paper, the effects of various cleaning procedure to the silicon wafer surface roughness are measured using AFM. Subsequently, an optimum cleaning recipe is discussed and proposed.

Investigation of ferroelectrics using conventional and in situ electron microscopy

1994 ◽  
Vol 52 ◽  
pp. 586-587
Author(s):  
V. Saikumar ◽  
H. M. Chan ◽  
M. P. Harmer
Keyword(s):  
Nonvolatile Memory ◽  
Ferroelectric Materials ◽  
Gate Insulator ◽  
Sensors And Actuators ◽  
In Situ Electron Microscopy ◽  
Ferroelectric Domains ◽  
Domain Boundaries ◽  
Domain Interactions ◽  
Memory Applications

In recent years, there has been a growing interest in the application of ferroelectric thin films for nonvolatile memory applications and as a gate insulator in DRAM structures. In addition, bulk ferroelectric materials are also widely used as components in electronic circuits and find numerous applications in sensors and actuators. To a large extent, the performance of ferroelectric materials are governed by the ferroelectric domains (with dimensions in the micron to sub-micron range) and the switching of domains in the presence of an applied field. Conventional TEM studies of ferroelectric domains structures, in conjunction with in-situ studies of the domain interactions can aid in explaining the behavior of ferroelectric materials, while providing some answers to the mechanisms and processes that influence the performance of ferroelectric materials. A few examples from bulk and thin film ferroelectric materials studied using the TEM are discussed below.Figure 1 shows micrographs of ferroelectric domains obtained from undoped and Fe-doped BaTiO3 single crystals. The domain boundaries have been identified as 90° domains with the boundaries parallel to <011>.

Contextual analysis of dynamic drought perception among small farmers in Jamaica

2017 ◽  
Vol 74 (2) ◽  
pp. 109-120 ◽  
Author(s):  
DW Gamble ◽  
D Burrell ◽  
J Popke ◽  
S Curtis
Keyword(s):  
Contextual Analysis ◽  
Small Farmers

The effectiveness of waist-shaped and straight-shaped interdental brushes in cleaning implant overdenture attachments: a self-controlled clinical trial

2020 ◽  
Author(s):  
Qiuwen Chen ◽  
Yanjun Ge ◽  
Jinyou Chai ◽  
Hailan Feng ◽  
Jianzhang Liu ◽  
...  
Keyword(s):  
Clinical Trial ◽  
Oral Hygiene ◽  
Respiratory Diseases ◽  
The Other ◽  
Controlled Clinical Trial ◽  
Cleaning Procedure ◽  
Plaque Removal ◽  
Line Angle ◽  
Implant Overdenture ◽  
Interdental Brush

Elderly patients often find it challenging to remove plaque accumulated on the attachments of implant overdentures (IOD) using conventional cleaning instruments. Further, excessive plaque accumulation can lead to peri-implant diseases and occasionally to respiratory diseases. Therefore, here, we aimed to compare the effectiveness of waist-shaped interdental brushes (WIB) with that of straight-shaped ones (SIB) in plaque removal from the locator attachments of IOD. Twenty participants with two locator attachments retaining mandibular IOD participated in this study. After the baseline cleaning, the participants refrained from oral hygiene maintenance for 3 days. A dentist cleaned one of the attachments using the WIB and the other attachment using the SIB. The pre- and post-cleaning modified plaque index (mPLI) scores were recorded. Following another 3 days free from oral hygiene maintenance, the trained participants repeated the same cleaning procedure using the WIB and SIB. Pre- and post-cleaning mPLI scores were recorded. Regardless of the type of brush used, the post-cleaning mPLI scores were lower than the pre-cleaning ones. After the cleaning procedure, the overall mean mPLI score was lower in the WIB group than in the SIB group. The post-cleaning mPLI scores at the line-angles and on the axial surfaces of the attachments were also lower in the WIB group than in the SIB group. There was no difference in the cleaning effectiveness between the dentist and participants when they used the same type of interdental brush. The WIB was significantly more efficient in plaque removal than the SIB, especially at the line-angle sites.

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