scholarly journals THE BALANCED PRODUCTION LOAD OF A MACHINE-ENGINEERING ORGANIZATION

Author(s):  
Andrei A. Pertsev ◽  
◽  
Aleksandr N. Podobrii ◽  
Iuliia A. Radionova ◽  
◽  
...  

The article deals with an approach to calculation of equipment, employee or work centers load during the production plan forming by machine engineering organizations. The calculations are based on the duration of manufacturing operations and the electronic structure of items, and provide the most balanced workload at the shortest time of production. The article describes the model of item production and the technique of production plan forming according to each work center with the set of calculation constraints. It also calculates the efficiency of an equipment load and time of production based on the current production plan. The calculation of load plan for work centers is provided by auxiliary software module of an interactive web-resource using the T-SQL.

Author(s):  
Tullio Tolio ◽  
Marcello Urgo ◽  
Arianna Alfieri

Long and medium-term production planning are tools to match production orders and resources capability but can also be used as baseline for material procurement. In some systems, however, to reduce the complexity of the planning problem, distinct production operations are aggregated into activities which normally represent production phases. This is the case of some Manufacturing-to-Order and Engineering-to-Order Systems. The lack of a detailed schedule of the manufacturing operations can cause difficulties in providing a proper Material Requirements Planning and can affect the feasibility of the production plan. The paper proposes an approach to extract scheduling information from a production plan, grounding on the knowledge of the production process, to support material procurement. Once a criterion to aggregate operations is chosen and the plan devised, the description of production operations and their precedence relations are used to obtain temporal ranges for production operations and, hence, deadline ranges are provided for the MRP. The proposed approach is applied to an industrial environment producing machining centers.


Author(s):  
S.J. Splinter ◽  
J. Bruley ◽  
P.E. Batson ◽  
D.A. Smith ◽  
R. Rosenberg

It has long been known that the addition of Cu to Al interconnects improves the resistance to electromigration failure. It is generally accepted that this improvement is the result of Cu segregation to Al grain boundaries. The exact mechanism by which segregated Cu increases service lifetime is not understood, although it has been suggested that the formation of thin layers of θ-CuA12 (or some metastable substoichiometric precursor, θ’ or θ”) at the boundaries may be necessary. This paper reports measurements of the local electronic structure of Cu atoms segregated to Al grain boundaries using spatially resolved EELS in a UHV STEM. It is shown that segregated Cu exists in a chemical environment similar to that of Cu atoms in bulk θ-phase precipitates.Films of 100 nm thickness and nominal composition Al-2.5wt%Cu were deposited by sputtering from alloy targets onto NaCl substrates. The samples were solution heat treated at 748K for 30 min and aged at 523K for 4 h to promote equilibrium grain boundary segregation. EELS measurements were made using a Gatan 666 PEELS spectrometer interfaced to a VG HB501 STEM operating at 100 keV. The probe size was estimated to be 1 nm FWHM. Grain boundaries with the narrowest projected width were chosen for analysis. EDX measurements of Cu segregation were made using a VG HB603 STEM.


Author(s):  
J. Fink

Conducting polymers comprises a new class of materials achieving electrical conductivities which rival those of the best metals. The parent compounds (conjugated polymers) are quasi-one-dimensional semiconductors. These polymers can be doped by electron acceptors or electron donors. The prototype of these materials is polyacetylene (PA). There are various other conjugated polymers such as polyparaphenylene, polyphenylenevinylene, polypoyrrole or polythiophene. The doped systems, i.e. the conducting polymers, have intersting potential technological applications such as replacement of conventional metals in electronic shielding and antistatic equipment, rechargable batteries, and flexible light emitting diodes.Although these systems have been investigated almost 20 years, the electronic structure of the doped metallic systems is not clear and even the reason for the gap in undoped semiconducting systems is under discussion.


2019 ◽  
Vol 21 (44) ◽  
pp. 24478-24488 ◽  
Author(s):  
Martin Gleditzsch ◽  
Marc Jäger ◽  
Lukáš F. Pašteka ◽  
Armin Shayeghi ◽  
Rolf Schäfer

In depth analysis of doping effects on the geometric and electronic structure of tin clusters via electric beam deflection, numerical trajectory simulations and density functional theory.


2020 ◽  
Vol 10 (18) ◽  
pp. 6266-6273
Author(s):  
Yalan Zhang ◽  
Zebin Yu ◽  
Ronghua Jiang ◽  
Jung Huang ◽  
Yanping Hou ◽  
...  

Excellent electrochemical water splitting with remarkable durability can provide a solution to satisfy the increasing global energy demand in which the electrode materials play an important role.


2020 ◽  
Author(s):  
Richard M. Martin
Keyword(s):  

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