THE MEASUREMENT OF THERMAL PARAMETERS BY CHANGING FREQUENCY OF EMBEDDED RING OSCILLATOR
The article describes a brief analysis of linear thermal models of digital integrated circuits (DIC) and algorithms for determining the parameters of thermal equivalent circuits of DIC-based on transient thermal characteristics (TTC). It distinguishes the difficulties in implementing the algorithm for determining the thermal parameters of the DIC-based on the method of structure functions according to the JESD51-14 document and describes a new method for measuring the FPGA TTC by changing the frequency of a ring oscillator embedded in the FPGA logic elements. It also considers the hardware-software complex used for measuring the thermal parameters of FPGAs and proposes a simple algorithm for calculating the thermal parameters of FPGAs based on the analysis of the FPGA TTC using methods of numerical differentiation. The specified algorithm for calculating thermal parameters has been tested on the example of FPGA TTC EPM240T100C5 and Lattice M4A5-64/32.