Characterization for Viscoelasticity of Glass Fiber Reinforced Epoxy Composite and Application to Thermal Warpage Analysis in Printed Circuit Board

2010 ◽  
Vol 34 (2) ◽  
pp. 245-253 ◽  
Author(s):  
Woo-Jin Song ◽  
Tae-Wan Ku ◽  
Beom-Soo Kang ◽  
Jeong Kim
2010 ◽  
Vol 29 (20) ◽  
pp. 3104-3110 ◽  
Author(s):  
N. Merah ◽  
S. Nizamuddin ◽  
Z. Khan ◽  
F. Al-Sulaiman ◽  
M. Mehdi

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