Joining of Tungsten-Copper Using Pulse Electric Current Sintering Method

2005 ◽  
pp. 443-448
Author(s):  
Yasushi Fukuzawa ◽  
Shigeru Nagasawa ◽  
Masahiro Watanabe ◽  
Shigehiko Takaoka
Keyword(s):  
Electric Current ◽  
Pulse Electric Current ◽  
Pulse Electric ◽  
Sintering Method

Joining of Tungsten-Copper Using Pulse Electric Current Sintering Method

2005 ◽  
Vol 502 ◽  
pp. 443-448
Author(s):  
Yasushi Fukuzawa ◽  
Shigeru Nagasawa ◽  
Masahiro Watanabe ◽  
Shigehiko Takaoka
Keyword(s):  
Heat Treatment ◽  
Electric Current ◽  
Bonding Temperature ◽  
Bonding Pressure ◽  
Pulse Electric Current ◽  
Layer 2 ◽  
Bonding Method ◽  
Pulse Electric ◽  
Sintering Method ◽  
Plating Layer

To develop the new bonding method under low bonding temperature and short holding duration, pulse electric current sintering (PECS) method is applied. The Ni plating layer was used as the interlayer. The following experimental factors were researched:(1) Thickness of Ni plating layer, (2) Bonding temperature, (3) Bonding pressure and (4) Heat treatment after plating. The bonding strength of W-Ni plate-Cu joint could be obtained under low bonding temperature of 773 K and short bonding duration of 10 min.

Heterogeneous of Non-Conductive Materials Sintering by Pulse Electric Current

2002 ◽  
Vol 224-226 ◽  
pp. 729-734 ◽  
Author(s):  
Dong Ming Zhang ◽  
Zheng Yi Fu ◽  
Yung Cheng Wang ◽  
Qing Jie Zhang ◽  
Jing Kun Guo
Keyword(s):  
Electric Current ◽  
Conductive Materials ◽  
Pulse Electric Current ◽  
Pulse Electric
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