Joining of Tungsten-Copper Using Pulse Electric Current Sintering Method

2005 ◽  
Vol 502 ◽  
pp. 443-448
Author(s):  
Yasushi Fukuzawa ◽  
Shigeru Nagasawa ◽  
Masahiro Watanabe ◽  
Shigehiko Takaoka

To develop the new bonding method under low bonding temperature and short holding duration, pulse electric current sintering (PECS) method is applied. The Ni plating layer was used as the interlayer. The following experimental factors were researched:(1) Thickness of Ni plating layer, (2) Bonding temperature, (3) Bonding pressure and (4) Heat treatment after plating. The bonding strength of W-Ni plate-Cu joint could be obtained under low bonding temperature of 773 K and short bonding duration of 10 min.

2007 ◽  
Vol 127 ◽  
pp. 271-276 ◽  
Author(s):  
Yasushi Fukuzawa ◽  
Shigeru Nagasawa ◽  
Shigehiko Takaoka

To make the tungsten and copper joint, several methods has been tried using the diffusion bonding system. When the thin plating Ni layer was used as the interlayer on tungsten surface, it bonded with copper under low bonding temperature and short holding duration by the pulse electric current sintering (PECS) machine. The effects of bonding temperature, bonding duration time, bonding pressure and the difference of specimen shape on the bonding strength were investigated. The tensile strength of joints depended on these factors. Highest strength attained to the copper tensile strength.


2002 ◽  
Vol 224-226 ◽  
pp. 729-734 ◽  
Author(s):  
Dong Ming Zhang ◽  
Zheng Yi Fu ◽  
Yung Cheng Wang ◽  
Qing Jie Zhang ◽  
Jing Kun Guo

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