Temperature Sensor Allocation Strategy and Full Thermal Reconstruction for Microprocessors

2013 ◽  
Vol 380-384 ◽  
pp. 2986-2989
Author(s):  
Xin Li ◽  
Meng Tian Rong

On-chip thermal sensors are employed by dynamic thermal management techniques to measure runtime thermal behavior of microprocessors so as to prevent the on-set of high temperatures. The allocation and the placement of thermal sensors directly impact the effectiveness of the dynamic thermal management mechanisms. In this paper, we propose systematic and effective strategies for determining the optimal locations for temperature sensors based on thermal gradient analysis to provide the trade-off between hot spot estimation and full thermal reconstruction. Experimental results indicate the superiority of our techniques and confirm that our proposed methods are able to create a sensor distribution for a given microprocessor architecture.

Author(s):  
Peng Wang ◽  
Avram Bar-Cohen

Thermal management of on-chip hot spots has become an increasing challenge in recent years because such localized high flux hot spots can not be effectively removed by conventional cooling techniques. The authors have recently explored the novel use of the silicon chip itself as a solid state thermoelectric micrcooler (μTEC) for hot spot thermal management. This paper describes the development and application of a thermo-electric design tool based on closed-form equations for the primary variables. This tool can be used to effectively reduce the complexity and required time for the design and optimization of the silicon microcooler geometry and material properties for on-chip hot spot remediation.


Author(s):  
K. Srivathsa Sudheendra ◽  
B. Suresh Vikram ◽  
Pavan Panchapakeshan ◽  
Sandip Kundu

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