Effect of the Mechanical Properties and Geometric Parameters on the Crack Density of the Thin Film/Substrate System under Residual Stress and Uniaxial Tensile Loading

2013 ◽  
Vol 470 ◽  
pp. 521-524
Author(s):  
Ban Quan Yang ◽  
Jun Du ◽  
Xue Jun Chen ◽  
Wei Hai Sun ◽  
Hong Qian Chen ◽  
...  

The effect of the mechanical properties and geometric parameters on the crack density of the thin film/substrate system under residual stress and uniaxial tensile loading is investigated in this work. The numerical results show that the crack density of the thin film increases with the increase of the Youngs modulus of the thin film and (or) the shear modules of the interface layer, and it decreases with the increase of the thickness of the thin film and (or) the fracture strength of the thin film. These results can help us more deeply understand the fracture behavior of the brittle thin film on the substrate under residual stress and external tensile loading.

2012 ◽  
Vol 190-191 ◽  
pp. 487-490 ◽  
Author(s):  
Ban Quan Yang ◽  
Xue Jun Chen ◽  
Wei Hai Sun ◽  
Hong Qian Chen ◽  
Jing Wen Pan ◽  
...  

The fracture behavior of a brittle thin film on an elastic substrate under residual stress and uniaxial tensile loading is investigated. It is assumed that the residual stress in the thin film is not large enough to cause the thin film to fracture. Using a mechanical model presented in this work, the analytical solutions for the distribution laws of the tensile stress developed in the thin film, the shear stress developed along the interface and the relationship between the crack density of the thin film and the applied strain of the substrate can be obtained. The results presented in this work can provide a new analytic solution to the interfacial shear stress for characterizing the interfacial shear strength of the thin film/substrate system when the uniaxial tensile test is adopted to evaluate the mechanical properties of the thin film/substrate system.


RSC Advances ◽  
2017 ◽  
Vol 7 (27) ◽  
pp. 16655-16661 ◽  
Author(s):  
Suji Choi ◽  
Jong Hoon Lee ◽  
Min Wook Pin ◽  
Dong Won Jang ◽  
Seong-Gu Hong ◽  
...  

The mechanical properties and fracture behavior of individual InAs nanowires (NWs) were investigated under uniaxial tensile loading in a transmission electron microscope.


2011 ◽  
Vol 11 (4) ◽  
pp. 2861-2866 ◽  
Author(s):  
Takahiro Namazu ◽  
Naoaki Yamashita ◽  
Shigeru Kakinuma ◽  
Kentaro Nishikata ◽  
Nobuyuki Naka ◽  
...  

2014 ◽  
Vol 543-547 ◽  
pp. 1533-1536
Author(s):  
Ban Quan Yang ◽  
Xue Jun Chen ◽  
Wei Hai Sun ◽  
Hong Qian Chen ◽  
Jing Wen Pan ◽  
...  

The effect of the mechanical properties and geometric parameters on the crack density of a multi-layered thin film structure under residual tensile stress is investigated theoretically. The numerical results show that the crack density of the thin film decreases with the increase of the thickness of the thin film and (or) the fracture strength of the thin film. These results can help us more deeply understand the fracture behavior of the multi-layered thin film structure under residual tensile stress.


2011 ◽  
Vol 239-242 ◽  
pp. 2179-2182 ◽  
Author(s):  
Ban Quan Yang ◽  
Fa Xin Li

In this work, the fracture behavior of a multi-layered thin film structure under residual tensile stress is investigated theoretically. Using composite material theory and a modified shear-lag model, the analytical solutions for the distribution laws of the tensile stress developed in the first-layer thin film and the shear stress developed along the interface can be obtained. In addition, the crack density of the first-layer thin film can be derived from the residual stress and the mechanical and geometric parameters of the cracked system. This result also yields a measurement of the residual stress from the crack density and the mechanical and geometric parameters of the system. Finally, a numerical example is presented to show how the crack density varies versus the residual stress.


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