A Theoretical Analysis of the Fracture Behavior of a Multi-Layered Thin Film Structure under Residual Tensile Stress

2011 ◽  
Vol 239-242 ◽  
pp. 2179-2182 ◽  
Author(s):  
Ban Quan Yang ◽  
Fa Xin Li
Keyword(s):  
Thin Film ◽  
Residual Stress ◽  
Tensile Stress ◽  
Fracture Behavior ◽  
Crack Density ◽  
Film Structure ◽  
Geometric Parameters ◽  
Residual Tensile Stress ◽  
Layer Thin Film ◽  
Layered Thin Film

In this work, the fracture behavior of a multi-layered thin film structure under residual tensile stress is investigated theoretically. Using composite material theory and a modified shear-lag model, the analytical solutions for the distribution laws of the tensile stress developed in the first-layer thin film and the shear stress developed along the interface can be obtained. In addition, the crack density of the first-layer thin film can be derived from the residual stress and the mechanical and geometric parameters of the cracked system. This result also yields a measurement of the residual stress from the crack density and the mechanical and geometric parameters of the system. Finally, a numerical example is presented to show how the crack density varies versus the residual stress.

Effect of the Mechanical Properties and Geometric Parameters on the Crack Density of a Multi-Layered Thin Film Structure under Residual Tensile Stress

2014 ◽  
Vol 543-547 ◽  
pp. 1533-1536
Author(s):  
Ban Quan Yang ◽  
Xue Jun Chen ◽  
Wei Hai Sun ◽  
Hong Qian Chen ◽  
Jing Wen Pan ◽  
...  
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Tensile Stress ◽  
Fracture Behavior ◽  
Crack Density ◽  
Film Structure ◽  
Geometric Parameters ◽  
Residual Tensile Stress ◽  
Thin Film Structure ◽  
Layered Thin Film

The effect of the mechanical properties and geometric parameters on the crack density of a multi-layered thin film structure under residual tensile stress is investigated theoretically. The numerical results show that the crack density of the thin film decreases with the increase of the thickness of the thin film and (or) the fracture strength of the thin film. These results can help us more deeply understand the fracture behavior of the multi-layered thin film structure under residual tensile stress.

Effect of the Mechanical Properties and Geometric Parameters on the Crack Density of the Thin Film/Substrate System under Residual Stress and Uniaxial Tensile Loading

2013 ◽  
Vol 470 ◽  
pp. 521-524
Author(s):  
Ban Quan Yang ◽  
Jun Du ◽  
Xue Jun Chen ◽  
Wei Hai Sun ◽  
Hong Qian Chen ◽  
...  
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Residual Stress ◽  
Crack Density ◽  
Tensile Loading ◽  
Interface Layer ◽  
Geometric Parameters ◽  
Uniaxial Tensile ◽  
Uniaxial Tensile Loading ◽  
Film Substrate

The effect of the mechanical properties and geometric parameters on the crack density of the thin film/substrate system under residual stress and uniaxial tensile loading is investigated in this work. The numerical results show that the crack density of the thin film increases with the increase of the Youngs modulus of the thin film and (or) the shear modules of the interface layer, and it decreases with the increase of the thickness of the thin film and (or) the fracture strength of the thin film. These results can help us more deeply understand the fracture behavior of the brittle thin film on the substrate under residual stress and external tensile loading.

Fracture Behavior of a Brittle Coating on an Elastic Substrate under Residual Stress

2011 ◽  
Vol 217-218 ◽  
pp. 595-599
Author(s):  
Ban Quan Yang ◽  
Peng Li
Keyword(s):  
Residual Stress ◽  
Shear Stress ◽  
Tensile Stress ◽  
Mechanical Model ◽  
Fracture Behavior ◽  
Crack Density ◽  
Elastic Substrate ◽  
Brittle Coating ◽  
Distribution Laws ◽  
The Relationship

The fracture behavior of a brittle coating on an elastic substrate under residual stress is investigated. Using a mechanical model, the analytical solutions for the distribution laws of the tensile stress developed in the coating, the shear stress developed along the interface and the relationship between the crack density of the coating and the residual stress can be obtained. The analytic relationship between the crack density and the residual stress can also be taken as a new expression to estimate the magnitude of the residual stress. A numerical example is presented to show how the crack density varies versus the residual stress.

Coupled Thermal-Mechanical Analysis of CO2 Laser Irradiation on Fused Silica

2016 ◽  
Vol 1136 ◽  
pp. 531-536
Author(s):  
Run Qiang Li ◽  
Peng Yao ◽  
Hao Meng ◽  
Jun Wang ◽  
Ke Zhang ◽  
...  
Keyword(s):  
Residual Stress ◽  
Tensile Stress ◽  
Laser Irradiation ◽  
Laser Energy ◽  
Viscoelastic Behavior ◽  
Mechanical Analysis ◽  
Fused Silica ◽  
Depth Of Cut ◽  
Residual Tensile Stress ◽  
Thermally Induced

To grind fused silica in ductile mode, it was proposed to repair surface and subsurface micro cracks of fused silica by CO2 laser irradiation. However, excessive residual stress remains on the surface because the melt fused silica on the surface quenches in air. It causes the critical depth of cut for ductile grinding fused silica to be smaller than 0.2μm. To investigate the distribution of the residual stress and look for an optimal manner of irradiation to control residual tensile stress, a numerical model of was built for simulating the dynamic behavior of fused silica when irradiated by CO2 laser. Laser energy absorption, heat transmission, viscoelastic behavior of fused silica and thermally induced stress were considered in the numerical simulation. The results show how the residual stress is formed and distributed. We found that an appropriate control of the temperature field as a function of time and position in the laser process is the key to reduce the residual stress. Therefore, three kinds of processes were proposed to reduce residual tensile stress on the surface of fused silica introduced by laser irradiation. The residual stress distributions of these three processes were compared by numerical analysis to decide a better method of laser irradiation.

Residual Stress Distribution in Pure Bending Beam Subjected to Tensile Failure on One Side

2006 ◽  
Vol 524-525 ◽  
pp. 253-258
Author(s):  
X.B. Wang
Keyword(s):  
Residual Stress ◽  
Tensile Strength ◽  
Stress Distribution ◽  
Tensile Stress ◽  
Strain Localization ◽  
Tensile Strain ◽  
Residual Stress Distribution ◽  
Neutral Axis ◽  
Residual Tensile Stress ◽  
Pure Bending

The stress distribution on the midsection of a pure bending beam where tensile strain localization band initiates on the tensile side of the beam and propagates within the beam is analyzed. Using the static equilibrium condition on the section of the midspan of the beam and the assumption of plane section as well as the linear softening constitutive relation beyond the tensile strength, the expressions for the length of tensile strain localization band and the distance from the tip of the band to the neutral axis are derived. After superimposing a linear unloading stress distribution over the initial stress distribution, the residual stress distribution on the midsection of the beam is investigated. In the process of strain localization band’s propagation, strain-softening behavior of the band occurs and neutral axis will shift. When the unloading moment is lower, the length of tensile strain localization band remains a constant since the stress on the base side of the beam is tensile stress. While, for larger unloading moment, with an increase of unloading moment, the length of tensile strain localization band decreases and the distance from the initial neutral axis to the unloading neutral axis increases. The neutral axis of midsection of the beam will shift in the unloading process. The present analysis is applicable to some metal materials and many quasi-brittle geomaterials (rocks and concrete, etc) in which tensile strength is lower than compressive strength. The present investigation is limited to the case of no real crack. Moreover, the present investigation is limited to the case that the length of strain localization band before unloading is less than half of depth of the beam. Otherwise, the residual tensile stress above the elastic neutral axis will be greater than the tensile strength, leading to the further development of tensile strain localization band in the unloading process.

Development of a process modeling for residual stress assessment of multilayer thin film structure

2015 ◽  
Vol 584 ◽  
pp. 146-153 ◽  
Author(s):  
H.J. Wang ◽  
H.A. Deng ◽  
S.Y. Chiang ◽  
Y.F. Su ◽  
K.N. Chiang
Keyword(s):  
Thin Film ◽  
Residual Stress ◽  
Process Modeling ◽  
Film Structure ◽  
Multilayer Thin Film ◽  
Stress Assessment ◽  
Thin Film Structure

scholarly journals A two-step load-deflection procedure applicable to extract the Young's modulus and the residual tensile stress of circularly shaped thin-film diaphragms

2014 ◽  
Vol 116 (11) ◽  
pp. 114905 ◽  
Author(s):  
Roman Beigelbeck ◽  
Michael Schneider ◽  
Johannes Schalko ◽  
Achim Bittner ◽  
Ulrich Schmid
Keyword(s):  
Thin Film ◽  
Tensile Stress ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Residual Tensile Stress

scholarly journals Фотолюминесцентные и фотоэлектрические свойства тонкопленочной структуры ZnO-LiNbO-=SUB=-3-=/SUB=- в ультрафиолетовом и видимом диапазонах спектра

2020 ◽  
Vol 54 (3) ◽  
pp. 232
Author(s):  
Л.В. Григорьев ◽  
И.С. Морозов ◽  
Н.В. Журавлев ◽  
А.А. Семенов ◽  
А.А. Никитин
Keyword(s):  
Thin Film ◽  
Spectral Range ◽  
Spectral Dependence ◽  
Quartz Substrate ◽  
Film Structure ◽  
Visible Spectral Range ◽  
Oxide Thin Film ◽  
Zinc Oxide Thin Film ◽  
Photoelectric Properties ◽  
Layer Thin Film

In article are presebted the results of study the structural, optical, photoluminescent and photoelectric properties structure of the layer thin-film ZnO on the monocrystal LiNbO3 substrate. Presents the results of X-ray structural analysis of a zinc oxide thin film synthesized on a single-crystal lithium niobate substrate and on a KU-1 quartz substrate are presented. Are presented the results investigations of transmission spectra, reflection spectra and absorption spectra in the ultraviolet and visible spectral range. Are presented investigations spectral dependence of photoluminescence and the spectral dependence of the photoconductivity currents in the thin film structure of ZnO-LiNbO3 and the structure of ZnO-SiO2 in the ultraviolet and visible spectral range.

scholarly journals Effect of a Metal Thin Film's Residual Stress and Manufacturing Process on Thin Film Micro-Crack

2020 ◽  
Vol 58 (3) ◽  
pp. 175-181
Author(s):  
Byung-Kyu Cho ◽  
Seung-Chan Hong ◽  
Byung-Sam Kim ◽  
Jae-Kyung Cheon
Keyword(s):  
Thin Film ◽  
Tensile Stress ◽  
Manufacturing Process ◽  
Residual Tensile Stress ◽  
Process Technology ◽  
Chrome Plating ◽  
Touch Sensor ◽  
Micro Cracks ◽  
Thin Film Layer ◽  
Film Layer

In recent automobile trends, the functions of opening and closing the vehicle door are accomplished by touch sensor and smart-phone NFC (Near Field Communication) systems. These convenience features are incorporated into the outdoor handle. However, this function can’t be used when chrome plating is applied to this part for design purposes. To solve the problem of chrome plating, we studied a metal sputtering deposition process technology, which can preserve the metal feeling without interfering with NFC and touch sensor operation. To achieve this interface communication and sensing performance, we developed a surface treatment that can generate micro-cracks in the thin film layer. We also investigated how the door handle manufacturing process affected the shape of the micro-cracks in the thin film. Results showed that the thickness of the thin film and the target power played a crucial role in controlling the residual tensile stress in the thin film, which was one of major factors responsible for generating micro-cracks in the thin film layer. The shape of the micro-cracks in the thin film was affected by the adjacent layers of the thin film, the primer paint and UV top coat. The surface energy of the primer paint and the shear stress produced by the hardening of the UV top coat were found to affect the shape of the micro-cracks. In addition, we found that there was no change in the shape of the micro-cracks with additional heat treatment, if the residual tensile stress was sufficiently relieved by the micro-cracks formed in the thin film. The slits between the micro-cracks in the outdoor handle cover allowed the Capacitance Sensor and NFC to perform.

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