Fracture Behavior of a Brittle Thin Film on an Elastic Substrate under Residual Stress and Uniaxial Tensile Loading

2012 ◽  
Vol 190-191 ◽  
pp. 487-490 ◽  
Author(s):  
Ban Quan Yang ◽  
Xue Jun Chen ◽  
Wei Hai Sun ◽  
Hong Qian Chen ◽  
Jing Wen Pan ◽  
...  
Keyword(s):  
Thin Film ◽  
Residual Stress ◽  
Shear Stress ◽  
Fracture Behavior ◽  
Tensile Loading ◽  
Interfacial Shear ◽  
Uniaxial Tensile ◽  
Elastic Substrate ◽  
Uniaxial Tensile Loading ◽  
Film Substrate

The fracture behavior of a brittle thin film on an elastic substrate under residual stress and uniaxial tensile loading is investigated. It is assumed that the residual stress in the thin film is not large enough to cause the thin film to fracture. Using a mechanical model presented in this work, the analytical solutions for the distribution laws of the tensile stress developed in the thin film, the shear stress developed along the interface and the relationship between the crack density of the thin film and the applied strain of the substrate can be obtained. The results presented in this work can provide a new analytic solution to the interfacial shear stress for characterizing the interfacial shear strength of the thin film/substrate system when the uniaxial tensile test is adopted to evaluate the mechanical properties of the thin film/substrate system.

Effect of the Mechanical Properties and Geometric Parameters on the Crack Density of the Thin Film/Substrate System under Residual Stress and Uniaxial Tensile Loading

2013 ◽  
Vol 470 ◽  
pp. 521-524
Author(s):  
Ban Quan Yang ◽  
Jun Du ◽  
Xue Jun Chen ◽  
Wei Hai Sun ◽  
Hong Qian Chen ◽  
...  
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Residual Stress ◽  
Crack Density ◽  
Tensile Loading ◽  
Interface Layer ◽  
Geometric Parameters ◽  
Uniaxial Tensile ◽  
Uniaxial Tensile Loading ◽  
Film Substrate

The effect of the mechanical properties and geometric parameters on the crack density of the thin film/substrate system under residual stress and uniaxial tensile loading is investigated in this work. The numerical results show that the crack density of the thin film increases with the increase of the Youngs modulus of the thin film and (or) the shear modules of the interface layer, and it decreases with the increase of the thickness of the thin film and (or) the fracture strength of the thin film. These results can help us more deeply understand the fracture behavior of the brittle thin film on the substrate under residual stress and external tensile loading.

Failure Analysis of Laminates Single-Lap Adhesive Joints under Uniaxial Tensile Loading

2012 ◽  
Vol 490-495 ◽  
pp. 2201-2204
Author(s):  
Yin Huan Yang
Keyword(s):  
Shear Stress ◽  
Tensile Loading ◽  
Adhesive Joints ◽  
Experimental Results ◽  
Uniaxial Tensile ◽  
Tension Tests ◽  
Different Types ◽  
Uniaxial Tensile Loading ◽  
Overlap Area ◽  
Main Factor

Tension tests on three different types of T700/EXOPY unidirectional laminates single-lap adhesive joints under uniaxial tensile loading were performed and effect of adherend thickness and spew fillets on strength of single-lap adhesive joints were analyzed in this paper. According to the experimental results, it is found that joint strength was not linear with the adherend thickness and much affected by spew fillets in overlap ends. At the same time, finite element simulations are carried out to analyze the peel/shear stress fields along joint interfaces and the intermediate layer of adhesive. The simulation results show that it is the main factor to leading to joint failure that the maximum peel/shear stress is occurred at overlap area edges and peel/shear stress of joints with spew fillet at the overlap area edges is less than that of joints with no spew fillet. Good agreements between the present simulations and the experimental results are found.

scholarly journals Study on fracture behavior of individual InAs nanowires using an electron-beam-drilled notch

RSC Advances ◽  
2017 ◽  
Vol 7 (27) ◽  
pp. 16655-16661 ◽  
Author(s):  
Suji Choi ◽  
Jong Hoon Lee ◽  
Min Wook Pin ◽  
Dong Won Jang ◽  
Seong-Gu Hong ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Electron Beam ◽  
Electron Microscope ◽  
Transmission Electron Microscope ◽  
Fracture Behavior ◽  
Tensile Loading ◽  
Uniaxial Tensile ◽  
Transmission Electron ◽  
Inas Nanowires ◽  
Uniaxial Tensile Loading

The mechanical properties and fracture behavior of individual InAs nanowires (NWs) were investigated under uniaxial tensile loading in a transmission electron microscope.

In-Situ Cathodoluminescence Spectroscopy of Silicon Oxide Thin Film Under Uniaxial Tensile Loading

2011 ◽  
Vol 11 (4) ◽  
pp. 2861-2866 ◽  
Author(s):  
Takahiro Namazu ◽  
Naoaki Yamashita ◽  
Shigeru Kakinuma ◽  
Kentaro Nishikata ◽  
Nobuyuki Naka ◽  
...  
Keyword(s):  
Thin Film ◽  
Silicon Oxide ◽  
Tensile Loading ◽  
Oxide Thin Film ◽  
Uniaxial Tensile ◽  
Cathodoluminescence Spectroscopy ◽  
Uniaxial Tensile Loading

A Semi-Quantitative Method for Thin Film Adhesion Measurement

1985 ◽  
Vol 107 (4) ◽  
pp. 472-477 ◽  
Author(s):  
Bond-Yen Ting ◽  
W. O. Winer ◽  
S. Ramalingam
Keyword(s):  
Thin Film ◽  
Shear Stress ◽  
Strain Difference ◽  
Interfacial Shear Stress ◽  
Interfacial Shear ◽  
Film Deposition ◽  
Quantitative Expression ◽  
Film Adhesion ◽  
Thin Film Adhesion ◽  
Film Substrate

Film deposition techniques are used in several applications. In tribology, wear and friction can be changed significantly by depositing a thin film on the contacting surfaces. A vital factor for this application is the adhesion between the film and the substrate. Due to high contact stresses in many tribological applications, high adhesion is required. Measurement of adhesion is therefore important if coated elements are to be used with confidence. A method has been developed for the measurement of adhesion which uses a composite model. This method is presented in this paper. A one-dimensional elastic analysis is sufficient to determine adhesion strength. In this method an interfacial shear stress is generated at the film-to-substrate interface by imposing a strain difference between the film and substrate. This interfacial shear stress is used to evaluate film adhesion. If the film-substrate adhesion is less than the shear stress applied to the interface the film will debond; otherwise, it will remain adhered to the substrate. The analysis developed yields a quantitative expression for the interfacial shear strength. Therefore the adhesion can be quantitatively determined.

Fracture Behavior of a Brittle Coating on an Elastic Substrate under Residual Stress

2011 ◽  
Vol 217-218 ◽  
pp. 595-599
Author(s):  
Ban Quan Yang ◽  
Peng Li
Keyword(s):  
Residual Stress ◽  
Shear Stress ◽  
Tensile Stress ◽  
Mechanical Model ◽  
Fracture Behavior ◽  
Crack Density ◽  
Elastic Substrate ◽  
Brittle Coating ◽  
Distribution Laws ◽  
The Relationship

The fracture behavior of a brittle coating on an elastic substrate under residual stress is investigated. Using a mechanical model, the analytical solutions for the distribution laws of the tensile stress developed in the coating, the shear stress developed along the interface and the relationship between the crack density of the coating and the residual stress can be obtained. The analytic relationship between the crack density and the residual stress can also be taken as a new expression to estimate the magnitude of the residual stress. A numerical example is presented to show how the crack density varies versus the residual stress.

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