Fabrication High Aspect Ratio Nanometer Holes on the Alumina Based on Self-Organization Technology

In this paper, a nanofabrication technology of alumina self-organization method for deep and self-arranged nanometer holes on high purity aluminum is presented. Deep and self-arranged nanometer holes can be used as antireflection structures, polarizing elements, guided-mode resonance filters and high efficiency diffraction optical elements. The fabrication technology provided an effective method for low-cost, large-scale manufacturing high aspect ratio nanoholes.The deep nanoholes structure is fabricated by two anodizing processes on aluminum. The theoretical calculation of reflectivity for the fabricated deep holes G-solver sofeware while the measurement setup for the reflectivity of the deep nanoholes is self-made optical parameter test system.The results show that the calculated reflectivity of the deep holes is below 8.0% within the visible wavelength range, while the measured reflectivity of the fabricated nanometer holes is under 8.30% within the wavelength range of 400-760nm and it agrees well with the theoretical analysis result.

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Large‐scale Micropillar 3D Patterning with High‐aspect Ratio Using a Theta‐pipette

Advanced Engineering Materials ◽

10.1002/adem.202100990 ◽

2021 ◽

Author(s):

Xiaobo Liao ◽

Jian Zhuang ◽

Jiulin Yang ◽

Lei Cheng ◽

Qiangqiang Zheng ◽

...

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio ◽

Large Scale

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EFAB: High Aspect Ratio, Arbitrary 3-D Metal Microstructures Using a Low-Cost Automated Batch Process

10.1115/imece1999-0245 ◽

1999 ◽

Author(s):

Fan-Gang Tseng ◽

Gang Zhang ◽

Uri Frodis ◽

Adam Cohen ◽

Florian Mansfeld ◽

...

Keyword(s):

Low Temperature ◽

Aspect Ratio ◽

High Aspect Ratio ◽

Low Cost ◽

Batch Process ◽

Unlimited Number ◽

Metal Layers ◽

Electrochemical Fabrication ◽

Low Temperature Process

Abstract EFAB (“Electrochemical FABrication”) is a new micromachining process utilizing an innovative “Instant Masking” (IM) technique to electrochemically deposit an unlimited number of metal layers for microfabrication. Through this approach, high-aspect-ratio microstructures with arbitrary 3-D geometry can be rapidly and automatically batch-fabricated at low temperature (< 60 °C) using an inexpensive desktop machine. IC-MEMS integration can also be carried out by this low temperature process.

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Technology chain for production of low-cost high aspect ratio optical structures

Recent Advances in Mechatronics ◽

10.1007/978-3-540-73956-2_129 ◽

2007 ◽

pp. 658-662

Author(s):

R. Krajewski ◽

J. Krezel ◽

M. Kujawinska ◽

O. Parriaux ◽

S. Tonchev ◽

...

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio ◽

Low Cost

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High Aspect Ratio TSV Formation by Using Low-Cost, Electroless-Ni as Barrier and Seed Layers for 3D-LSI Integration and Packaging Applications

10.7567/ssdm.2019.j-2-03 ◽

2019 ◽

Author(s):

M. Mariappan ◽

K. Mori ◽

A. Nakamura ◽

H. Hashimoto ◽

J.C. Bea ◽

...

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio ◽

Low Cost ◽

Electroless Ni ◽

Seed Layers

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Multi-Layer Photopolymer Micromachining

MRS Proceedings ◽

10.1557/proc-872-j11.5 ◽

2005 ◽

Vol 872 ◽

Cited By ~ 1

Author(s):

J. R. Huang ◽

B. Bai ◽

J. Shaw ◽

T. N. Jackson ◽

C. Y. Wei ◽

...

Keyword(s):

Aspect Ratio ◽

Integrated Circuits ◽

High Aspect Ratio ◽

Low Cost ◽

Solution Process ◽

Microfluidic Channel ◽

Width Ratio ◽

Large Area ◽

Additive Process ◽

Infiltration Process

AbstractThis paper presents a novel method to create and integrate micro-machined devices and high aspect-ratio (height-to-width ratio) microstructures in which the microstructures are built up using multiple layers of photopolymer film and/or viscous solution. Very high aspect-ratio 2-and 3-dimensional (2-D and 3-D) microstructures were constructed by stacking photo-imageable polymer films. Such films may be dry films applied by lamination or solution layers applied by bar coating, or doctor blade coating. Photolithography is used in both cases to define the microstructure. This additive process of thin-film micromachining facilitates high aspect-ratio microstructure fabrication. We have demonstrated structures of up to 12-layers comprising 2-D arrays of deep trenches (180 μm deep and 25 μm wide) and a 2-layer SU-8 micro-trench array with an aspect ratio up to 36 on glass substrates. Miniaturized structures of interconnected reservoirs as small as 50 μm × 50 μm × 15 μm (∼38 pico liter storage capacity) are also being fabricated, along with a novel 5-layer microfluidic channel array and a vacuum-infiltration process for fluid manipulation. This method has the potential to create functional large-area micro-devices at low-cost and with increased device flexibility, durability, prototyping speed, and reduced process complexity for applications in optoelectronics, integrated detectors, and bio-devices. The novel multi-layer photopolymer dry film and solution process also allows microstructures in micro-electro-mechanical systems (MEMS) to be built with ease and provides the functionality of MEMS integration with electronic devices and integrated circuits (ICs).

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Large-scale synthesis of AgNWs with ultra-high aspect ratio above 4000 and their application in conductive thin film

Journal of Materials Science Materials in Electronics ◽

10.1007/s10854-016-6188-4 ◽

2016 ◽

Vol 28 (7) ◽

pp. 5308-5314 ◽

Cited By ~ 4

Author(s):

Yongyun Mao ◽

Hongwei Yang ◽

Changyi Hu ◽

Junmei Guo ◽

Xianwei Meng ◽

...

Keyword(s):

Thin Film ◽

Aspect Ratio ◽

High Aspect Ratio ◽

Large Scale ◽

Large Scale Synthesis

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High-resolution combinatorial patterning of functional nanoparticles

Nature Communications ◽

10.1038/s41467-020-19771-0 ◽

2020 ◽

Vol 11 (1) ◽

Author(s):

Xing Xing ◽

Zaiqin Man ◽

Jie Bian ◽

Yadong Yin ◽

Weihua Zhang ◽

...

Keyword(s):

Large Scale ◽

High Efficiency ◽

Low Cost ◽

Dip Coating ◽

Colloidal Nanoparticles ◽

Pixel Size ◽

Functional Nanoparticles ◽

Error Ratio ◽

Scientists And Engineers ◽

Daunting Challenge

AbstractFast, low-cost, reliable, and multi-component nanopatterning techniques for functional colloidal nanoparticles have been dreamed about by scientists and engineers for decades. Although countless efforts have been made, it is still a daunting challenge to organize different nanocomponents into a predefined structure with nanometer precision over the millimeter and even larger scale. To meet the challenge, we report a nanoprinting technique that can print various functional colloidal nanoparticles into arbitrarily defined patterns with a 200 nm (or smaller) pitch (>125,000 DPI), 30 nm (or larger) pixel size/linewidth, 10 nm position accuracy and 50 nm overlay precision. The nanopatterning technique combines dielectrophoretic enrichment and deep surface-energy modulation and therefore features high efficiency and robustness. It can form nanostructures over the millimeter-scale by simply spinning, brushing or dip coating colloidal nanoink onto a substrate with minimum error (error ratio < 2 × 10−6). This technique provides a powerful yet simple construction tool for large-scale positioning and integration of multiple functional nanoparticles toward next-generation optoelectronic and biomedical devices.

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