Design of the Liquid-Cooling System for High Power LED Modules Using Taguchi Analysis

To optimize thermal dissipation efficiency for cooling high power LED modules is studied and analyzed using ANSYS CFX software and Taguchi method. In liquid-cooling system, four control factors are tested and compared in order to find the best cooling arrangement that are pump flow rate, fan power, cooling liquid type and k- value of thermal compound. The experimental results show that the importance of these cooling parameters applied to high power LED module are k-value of thermal compound, fan power, liquid type and pump flow rate in sequence. For a constant heating power of 90W from an LED lighting module, an optimal thermal resistance of 0.563K/W is obtained that shows a significant improved result then the conventional LED module’s. It has high potential in future high power LED applications.

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Based on Taguchi Analysis for High Power LED Liquid-Cooling System Design

Applied Mechanics and Materials ◽

10.4028/www.scientific.net/amm.130-134.3967 ◽

2011 ◽

Vol 130-134 ◽

pp. 3967-3971

Author(s):

San Shan Hung ◽

Hsing Cheng Chang ◽

Jhih Wei Huang

Keyword(s):

High Power ◽

Heat Dissipation ◽

Cooling System ◽

Thermal Dissipation ◽

Liquid Cooling ◽

K Value ◽

Control Factors ◽

Pump Flow Rate ◽

High Power Led ◽

Liquid Cooling System

The main result of this study is to propose a liquid-cooling system for high power LED heat dissipation treatment. By using thermal dissipation mechanism and based on ANSYS CFX numerical analysis of change the parameters of cold plat. We will get the optimal heat dissipation structure. The experimental results show that the Taguchi method of thermal mechanisms in this study of the four control factors affecting the order: k value of thermal compound > fan power > liquid type > pump flow rate, and to identify the best combination of factor levels. When the heat source is 90 W, the best factor of the experimental cooling system thermal resistance is 0.563K/W. Nomenclature

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P-173: Improved Liquid Cooling System for Ultra High Power LED Projector

SID Symposium Digest of Technical Papers ◽

10.1889/1.3500391 ◽

2010 ◽

Vol 41 (1) ◽

pp. 1915

Author(s):

Mao-Yi Lee ◽

Alex Wang ◽

Jung-Hsien Yen ◽

Jung-Hua Chou

Keyword(s):

High Power ◽

Cooling System ◽

Liquid Cooling ◽

High Power Led ◽

Liquid Cooling System

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A novel liquid cooling system for high power LED street lamp

29th IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/semi-therm.2013.6526820 ◽

2013 ◽

Cited By ~ 3

Author(s):

Chien-Yuh Yang ◽

Wei-Chi Liu ◽

Chun-Ta Yeh ◽

Shao-Nong Tsai

Keyword(s):

High Power ◽

Cooling System ◽

Liquid Cooling ◽

High Power Led ◽

Street Lamp ◽

Liquid Cooling System

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COMPACT LIQUID COOLING SYSTEM FOR HIGH POWER IGBT MODULES IN EV/HEV APPLICATIONS

10.1615/ihtc16.ctm.023833 ◽

2018 ◽

Author(s):

Seokkan Ki ◽

Jooyoung Lee ◽

Seunggeol Ryu ◽

Youngsuk Nam

Keyword(s):

High Power ◽

Cooling System ◽

Liquid Cooling ◽

Igbt Modules ◽

Liquid Cooling System

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757 Development of a Forced-Liquid Cooling System for High Power Electronic Chips Using ECF

The Proceedings of Yamanashi District Conference ◽

10.1299/jsmeyamanashi.2005.219 ◽

2005 ◽

Vol 2005 (0) ◽

pp. 219-220

Author(s):

Woo-Suk SEO ◽

Kazuhiro YOSHIDA ◽

Shinichi YOKOTA ◽

Kazuya EDAMURA

Keyword(s):

High Power ◽

Cooling System ◽

Power Electronic ◽

Liquid Cooling ◽

Liquid Cooling System

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Development of a Mini Liquid Cooling System for High Heat Flux Electronic Devices

ASME 2009 7th International Conference on Nanochannels, Microchannels and Minichannels ◽

10.1115/icnmm2009-82156 ◽

2009 ◽

Author(s):

Chien-Yuh Yang ◽

Chun-Ta Yeh ◽

Kou-Chung Huang ◽

Shao-Nong Tsai

Keyword(s):

Flow Rate ◽

Cooling System ◽

Maximum Flow ◽

Maximum Pressure ◽

High Heat Flux ◽

Cold Plate ◽

Liquid Cooling ◽

Commercial Products ◽

Micro Pump ◽

Liquid Cooling System

The size of the most of the current commercialized liquid cooling systems is apparently too large to be easily adapted in a notebook or a mini size desk top computer. This study incorporated the authors’ previous micro heat exchanger design with an extra slim pump concept proposed by a local manufacturer to develop a high performance miniature liquid cooling system. An integrated pump and cold plate assembly was also developed for further reducing the overall size of the system. In comparing to the commercial products, the test results show that the micro pump provides a higher maximum pressure head and maximum flow rate performance. The cold plate has the lowest thermal resistance at moderate and high flow rate region. And the performed of the entire liquid system is similar to that of the recently announced product. It is emphasized that the size of the present developed cold plate, pump and liquid cooling system is much smaller than that of all commercial products.

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