Liquid cooling system for a high power light emitting diode of an automotive headlamp and its effect on light intensity

2019 ◽  
Vol 228 (12) ◽  
pp. 2495-2509 ◽  
Author(s):  
Rammohan A. ◽  
Ramesh Kumar C.
Keyword(s):  
Light Intensity ◽  
High Power ◽  
Cooling System ◽  
Light Emitting Diode ◽  
Liquid Cooling ◽  
Light Emitting ◽  
Liquid Cooling System

COMPACT LIQUID COOLING SYSTEM FOR HIGH POWER IGBT MODULES IN EV/HEV APPLICATIONS

2018 ◽  
Author(s):  
Seokkan Ki ◽  
Jooyoung Lee ◽  
Seunggeol Ryu ◽  
Youngsuk Nam
Keyword(s):  
High Power ◽  
Cooling System ◽  
Liquid Cooling ◽  
Igbt Modules ◽  
Liquid Cooling System

757 Development of a Forced-Liquid Cooling System for High Power Electronic Chips Using ECF

2005 ◽  
Vol 2005 (0) ◽  
pp. 219-220
Author(s):  
Woo-Suk SEO ◽  
Kazuhiro YOSHIDA ◽  
Shinichi YOKOTA ◽  
Kazuya EDAMURA
Keyword(s):  
High Power ◽  
Cooling System ◽  
Power Electronic ◽  
Liquid Cooling ◽  
Liquid Cooling System

Heat Transfer Enhancement of the Liquid-Cooled LED Illumination Module

2013 ◽  
Vol 284-287 ◽  
pp. 768-772 ◽  
Author(s):  
Rong Yuan Jou
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Light Sources ◽  
The Finite Element Method ◽  
Liquid Cooling ◽  
Light Emitting ◽  
A Tec ◽  
Heat Sink Design ◽  
Temperature And Flow Fields

High-power light emitting diode (LED) modules offer several advantages over conventional light sources, but require effective thermal management for optimal performance, such as liquid cooling or thermoelectric cooling (TEC). This study compared the thermal performance of high-power LEDs with liquid cooling and TEC using both the finite element method and experiments. We considered a mutichip module in which the LEDs are immersed in one of three different cooling fluids in a metal enclosure with passive cooling or a TEC module. In the experiments, temperatures were measured by thermocouples. The temperature and flow fields of the liquid-cooled package inside the enclosure were analyzed in detail using a numerical model, and the results were validated against the experimental measurements. In this paper, we discuss the major design considerations when using liquid cooling and TEC. Our results show that for the illumination module considered in this study, appropriate heat sink design is crucial to optimizing performance with TEC, which can enhance the heat dissipation for small and compact LED modules.

P-173: Improved Liquid Cooling System for Ultra High Power LED Projector

2010 ◽  
Vol 41 (1) ◽  
pp. 1915
Author(s):  
Mao-Yi Lee ◽  
Alex Wang ◽  
Jung-Hsien Yen ◽  
Jung-Hua Chou
Keyword(s):  
High Power ◽  
Cooling System ◽  
Liquid Cooling ◽  
High Power Led ◽  
Liquid Cooling System

Study on the Heat Sink Structure and Heat Transfer Effect of Liquid Cooling System for High Power LEDs

2015 ◽  
Vol 35 (3) ◽  
pp. 0323003
Author(s):  
田立新 Tian Lixin ◽  
文尚胜 Wen Shangsheng ◽  
黄伟明 Huang Weiming ◽  
夏云云 Xia Yunyun ◽  
姚日晖 Yao Rihui
Keyword(s):  
Heat Transfer ◽  
High Power ◽  
Heat Sink ◽  
Cooling System ◽  
Transfer Effect ◽  
Liquid Cooling ◽  
Liquid Cooling System

Based on Taguchi Analysis for High Power LED Liquid-Cooling System Design

2011 ◽  
Vol 130-134 ◽  
pp. 3967-3971
Author(s):  
San Shan Hung ◽  
Hsing Cheng Chang ◽  
Jhih Wei Huang
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Cooling System ◽  
Thermal Dissipation ◽  
Liquid Cooling ◽  
K Value ◽  
Control Factors ◽  
Pump Flow Rate ◽  
High Power Led ◽  
Liquid Cooling System

The main result of this study is to propose a liquid-cooling system for high power LED heat dissipation treatment. By using thermal dissipation mechanism and based on ANSYS CFX numerical analysis of change the parameters of cold plat. We will get the optimal heat dissipation structure. The experimental results show that the Taguchi method of thermal mechanisms in this study of the four control factors affecting the order: k value of thermal compound > fan power > liquid type > pump flow rate, and to identify the best combination of factor levels. When the heat source is 90 W, the best factor of the experimental cooling system thermal resistance is 0.563K/W. Nomenclature

Design of the Liquid-Cooling System for High Power LED Modules Using Taguchi Analysis

2011 ◽  
Vol 383-390 ◽  
pp. 6416-6421
Author(s):  
San Shan Hung ◽  
Hsing Cheng Chang ◽  
Chan Ming Liang
Keyword(s):  
Flow Rate ◽  
High Power ◽  
Cooling System ◽  
Liquid Cooling ◽  
K Value ◽  
Pump Flow ◽  
Pump Flow Rate ◽  
High Power Led ◽  
Liquid Type ◽  
Liquid Cooling System

To optimize thermal dissipation efficiency for cooling high power LED modules is studied and analyzed using ANSYS CFX software and Taguchi method. In liquid-cooling system, four control factors are tested and compared in order to find the best cooling arrangement that are pump flow rate, fan power, cooling liquid type and k- value of thermal compound. The experimental results show that the importance of these cooling parameters applied to high power LED module are k-value of thermal compound, fan power, liquid type and pump flow rate in sequence. For a constant heating power of 90W from an LED lighting module, an optimal thermal resistance of 0.563K/W is obtained that shows a significant improved result then the conventional LED module’s. It has high potential in future high power LED applications.

Advanced Natural Convection Cooling Designs for Light-Emitting Diode Bulb Systems

2014 ◽  
Vol 136 (4) ◽  
Author(s):  
James Petroski
Keyword(s):  
Natural Convection ◽  
Heat Sink ◽  
Energy Savings ◽  
Cooling System ◽  
Light Emitting Diode ◽  
Point Of View ◽  
Light Bulb ◽  
Light Emitting ◽  
Size And Shape ◽  
Liquid Cooling System

The movement to light-emitting diode (LED) lighting systems worldwide is accelerating quickly as energy savings and reduction in hazardous materials increase in importance. Government regulations and rapidly lowering prices help to further this trend. Today's strong drive is to replace light bulbs of common outputs (60 W, 75 W, and 100 W) without resorting to compact fluorescent (CFL) bulbs containing mercury while maintaining the standard industry bulb size and shape referred to as A19. For many bulb designs, this A19 size and shape restriction forces a small heat sink which is barely capable of dissipating heat for 60 W equivalent LED bulbs with natural convection for today's LED efficacies. 75 W and 100 W equivalent bulbs require larger sizes, some method of forced cooling, or some unusual liquid cooling system; generally none of these approaches are desirable for light bulbs from a consumer point of view. Thus, there is interest in developing natural convection cooled A19 light bulb designs for LEDs that cool far more effectively than today's current designs. Current A19 size heat sink designs typically have thermal resistances of 5–7 °C/W. This paper presents designs utilizing the effects of chimney cooling, well developed for other fields that reduce heat sink resistances by significant amounts while meeting all other requirements for bulb system design. Numerical studies and test data show performance of 3–4 °C/W for various orientations including methods for keeping the chimney partially active in horizontal orientations. Significant parameters are also studied with effects upon performance. The simulations are in good agreement with the experimental data. Such chimney-based designs are shown to enable 75 W and 100 W equivalent LED light bulb designs critical for faster penetration of LED systems into general lighting applications.

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