Diffusion of Implanted Metals in Tantalum Silicide

2007 ◽  
Vol 264 ◽  
pp. 151-154
Author(s):  
F. Salman ◽  
Peng Zhang ◽  
Fred A. Stevie ◽  
Lee Chow
Keyword(s):  
Author(s):  
D.S. Yaney ◽  
T.N. Fogarty ◽  
R.A. Porter ◽  
D.B. Fraser ◽  
S.P. Murarka
Keyword(s):  

1980 ◽  
Vol 66 (2) ◽  
pp. 191-196 ◽  
Author(s):  
K. Hieber ◽  
E. Lautenbacher
Keyword(s):  

2020 ◽  
Vol 46 (4) ◽  
pp. 4595-4601 ◽  
Author(s):  
Jiaying Chen ◽  
Xudong Zhang ◽  
Dongzhi Li ◽  
Cong Liu ◽  
He Ma ◽  
...  

1983 ◽  
Vol 25 ◽  
Author(s):  
K. T. Ho ◽  
C.-D. Lien ◽  
M-A. Nicolet ◽  
D. M. Scott

ABSTRACTTantalum, being a refractory metal, is sensitive to ambient impurities when forming a silicide. By introducing nitrogen and oxygen impurities into a tantalum-silicon system, interesting chemical and physical effects are observed in their subsequent reactions. Nitrogen and oxygen behave similarly in such a system. If initially present in Ta, they segregate into the still unreacted Ta as the silicide layer grows at a somewhat retarded rate. The same impurities, initially present in Si, are immobile in the form of stable compouis and suppress TaSi2 growth. The rare isotopes 15N and 18O are introduced bY implantation and Profiled by 15N(P,α)12C and 18O(P,α)15N nuclear reaction analyses, respectively. In addition, unintentionally incorporated 18O is checked by the 16O(d,α) 14N nuclear reaction. The results are explained in terms of the moving species Si, and of the chemical affinity, solubility and diffusivity of the impurities in their host lattice.


2005 ◽  
Vol 37 (2) ◽  
pp. 129-132 ◽  
Author(s):  
J. H. Liang ◽  
W. M. Ruan

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