Effects of Different Package Structures on Thermal Properties of High Power White LED
2012 ◽
Vol 503
◽
pp. 397-401
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Keyword(s):
The characteristics of several package structures of high power white Light emitting diode (LED) are described in this paper. The influence of different structures on thermal properties is analyzed. Forward voltage method is used to test the thermal resistance of LED chips.
Keyword(s):
2017 ◽
Vol 28
(23)
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pp. 17557-17569
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2006 ◽
Keyword(s):
2019 ◽
Vol 39
(6)
◽
pp. 2149-2154
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2011 ◽
Vol 11
(3)
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pp. 407-416
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2006 ◽
Vol 510-511
◽
pp. 106-109
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2012 ◽
Vol 51
(9S2)
◽
pp. 09MK05
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