Effects of Different Package Structures on Thermal Properties of High Power White LED

2012 ◽  
Vol 503 ◽  
pp. 397-401 ◽  
Author(s):  
Zhe Ran Sun ◽  
Da Ming Wu ◽  
Ya Jun Zhang ◽  
Jian Zhuang ◽  
Kai Fang Dang

The characteristics of several package structures of high power white Light emitting diode (LED) are described in this paper. The influence of different structures on thermal properties is analyzed. Forward voltage method is used to test the thermal resistance of LED chips.

2010 ◽  
Author(s):  
Kyung-Mi Moon ◽  
Se-Hwan An ◽  
Hyung-Kun Kim ◽  
Jung-Hye Chae ◽  
Yong-Jo Park

2017 ◽  
Vol 28 (23) ◽  
pp. 17557-17569 ◽  
Author(s):  
Jiajie Fan ◽  
Mengni Zhang ◽  
Xiao Luo ◽  
Cheng Qian ◽  
Xuejun Fan ◽  
...  

2005 ◽  
Vol 892 ◽  
Author(s):  
Hong Luo ◽  
Jong Kyu Kim ◽  
Yangang Xi ◽  
E. Fred Schubert ◽  
Jaehee Cho ◽  
...  

AbstractAn optimized packaging configuration for high-power white-light-emitting diode (LED) lamps that employs a diffuse reflector cup, a remote phosphor and a hemi-spherically-shaped encapsulation is presented. Ray tracing simulations for this configuration show that the phosphor efficiency can be enhanced by up to 50% over conventional packages. It is experimentally shown that dichromatic LED lamps with remote phosphor and diffuse reflector cup configuration have higher phosphor efficiency by 15.4% for blue-pumped yellow phosphor and by 27% for ultraviolet-pumped blue phosphor over conventional packages. Those improvements are attributed to reduced absorption of the phosphorescence by the LED chip and the reduction of deterministic optical modes trapped inside the encapsulant.


2019 ◽  
Vol 39 (6) ◽  
pp. 2149-2154 ◽  
Author(s):  
Xin Liu ◽  
Xinglu Qian ◽  
Zewang Hu ◽  
Xiaopu Chen ◽  
Yun Shi ◽  
...  

Nanoscale ◽  
2016 ◽  
Vol 8 (2) ◽  
pp. 1117-1122 ◽  
Author(s):  
Chin-Wei Sher ◽  
Chin-Hao Lin ◽  
Huang-Yu Lin ◽  
Chien-Chung Lin ◽  
Che-Hsuan Huang ◽  
...  

In this study, a liquid-type QD white LED is demonstrated as an efficient color-conversion layer in UV LED packages.


2006 ◽  
Vol 510-511 ◽  
pp. 106-109 ◽  
Author(s):  
Chang Sik Son ◽  
Ho Jung Chang ◽  
Kang Hyun Jaekal ◽  
Young Chol Chang ◽  
Soo Wohn Lee

We prepared the surface mounted white light emitting diode (LED) chips by using yellow phosphors on the blue LED chip. The optical and electrical properties of prepared white LED chips were investigated. The yellow phosphor mixed with transparent epoxy was coated on the prepared LED chip. The optimum mixing conditions with epoxy and yellow phosphor is obtained at the mixing ration of epoxy: yellow phosphor = 97 : 3 wt %. The maximum luminance and light emitting efficiency are above 80,000 cd/m2 and 23.2 lm/W, respectively, at the bias voltage of 2.9 V. There was no distinct change in the luminance strength with changing of the yellow phosphor ratios. The flowing current of the white LED chip is about 30 mA at 2.9 V.


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