Cu-Direct Laser Drilling of Blind Via-Hole in Multi-Layer PWBs: Process Visualization Using High-Speed Camera Images

2012 ◽  
Vol 516 ◽  
pp. 30-35 ◽  
Author(s):  
Kuniyoshi Obata ◽  
Toshiki Hirogaki ◽  
Eiichi Aoyama ◽  
Keiji Ogawa
Keyword(s):  
High Speed ◽  
Substrate Surface ◽  
Laser Drilling ◽  
Drilling Process ◽  
Positional Accuracy ◽  
Board Density ◽  
Process Visualization ◽  
Direct Laser ◽  
Via Holes ◽  
Direct Drilling

Electrical circuits of Printed Wiring Boards (PWBs) have become multi-layered. Therefore, the formation of micro-blind holes for interlayer electrical connections (blind via holes: BVH) is required. As a result, Cu-direct laser drilling is attracting attention. However, Cu-direct drilling is problematic in that it produces a copper overhang as a result of copper and resin, which have different decomposition points, being melted simultaneously. In addition, the state of PWB surface after the laser drilling is very important. However, this procedure restricts the board density that can be achieved as a result of the limited positional accuracy of the etching process. Consequently, using a Cu-direct drilling process, which does not require etching of the copper foil, to drill BVHs to connect copper foils using a CO2 laser beam has been receiving considerable attention for the next-generation high density PWB manufacturing. However, in the Cu process of generating a direct and overhang problem, there is the problem of accuracy on the substrate surface. In contrast, in-depth research on quality companies has not been performed. Thus, we observe the removal process. Furthermore, we demonstrated reduced overhang.

Cu-Direct Laser Drilling of Blind Via-Hole in Multi-Layer PWBs: Influence of Surface Treatment on Drilled Hole Quality

2009 ◽  
Author(s):  
Toshiki Hirogaki ◽  
Eiichi Aoyama ◽  
Keiji Ogawa ◽  
Tsukasa Ayuzawa
Keyword(s):  
Surface Treatment ◽  
Co2 Laser ◽  
Copper Foil ◽  
Laser Energy ◽  
Copper Surface ◽  
Laser Drilling ◽  
Hole Quality ◽  
Direct Laser ◽  
Overhang Length ◽  
Direct Drilling

This report describes the quality assessment of Blind Via Holes (BVHs) of Printed Wiring Boards (PWBs) drilled by a CO2 laser using Cu-direct drilling. In the Cu-direct drilling method, the copper foil and the build-up layer are melted at the same time, and the surface is treated to increase the laser energy absorbed by the copper foil since an untreated copper surface reflects most of the 10.6-μm-wavelength CO2 laser beam. However, there are few reports dealing with Cu-direct laser drilling of PWBs. In addition, when copper and resin with different processing thresholds are drilled at the same time, occurrences of a defect called overhang have been observed. So, in this report, first we propose a new method using thermography to measure the absorptance of a PWB surface for a CO2 laser. Moreover, we investigate how surface treatment of the outer copper foil influences the quality of a laser-drilled hole. Then, we observe the circumference of a point irradiated with the CO2 laser and explain how melting processes are different from surface treatment. Finally, based on the research we establish a method in order to cut down the overhang length as a parameter of drilled-hole quality. We also show that a high absorptance improves BVH quality.

A Parameters Optimization of the CO2 Laser Drilling Process for HDI Microvia Fabrication

2012 ◽  
Vol 214 ◽  
pp. 451-454 ◽  
Author(s):  
You Zuo Hu ◽  
Wei He ◽  
Wei Dong Xue ◽  
Zhi Hua Tao ◽  
Yu Xing Huang ◽  
...  
Keyword(s):  
Pulse Width ◽  
Printed Circuit Boards ◽  
Laser Energy ◽  
Experimental Parameter ◽  
Laser Drilling ◽  
Parameters Optimization ◽  
Laser Source ◽  
Drilling Process ◽  
Beam Diameter ◽  
Via Holes

The blind via holes formation by laser drilling is one of the key technologies for demanding high density interconnect printed circuit boards. In this paper , the drilling conditions of drilling the blind via holes and the quality of the drilled holes are examined using a CO2 laser source against the FR4 board without copper foil.We chose laser energy,pulse shot,pulse width and diameter of beam as the experimental parameter . The results showed that laser energy and beam diameter played a more important role on changing the blind vias’ diameter than pulse shot and pulse width .While the pulse shot and pulse width take more important role in changing the depth of vias.

Microvia Formation for Multi-Layer PWB by Laser Direct Drilling: Improvement of Drilled Hole Quality of GFRP Plates

2012 ◽  
Author(s):  
Keiji Ogawa ◽  
Toshiki Hirogaki ◽  
Eiichi Aoyama ◽  
Tsukasa Ayuzawa
Keyword(s):  
High Speed ◽  
Fiber Reinforced ◽  
Hole Quality ◽  
Reinforced Plastics ◽  
Glass Fiber Reinforced ◽  
Via Holes ◽  
Overhang Length ◽  
Fiber Reinforced Plastics ◽  
Direct Drilling

Microvia formation technology using lasers has become the dominant method for drilling microvia that are called blind via-holes (BVHs) in printed wiring boards (PWBs). Laser direct drilling (LDD), which is direct drilling of the outer copper foil by laser, has attracted attention as a novel method. In particular, when copper and resin with different processing thresholds are simultaneously drilled, an overhang defect occurs on the drilled hole. On the other hand, aramid fiber reinforced plastics (AFRP) have been replaced by glass fiber reinforced plastics (GFRP) as the material used for the build-up layer because of its cost performance. Moreover, the PWB quality of the particle incrustations around the drilled holes has problems in the manufacturing process. However, the LDD process of such a composite has not been clarified. Therefore, we investigated it by detailed observation using a high-speed camera. We estimated the overhang length using the finite element method (FEM) and experimentally and analytically evaluated the effects of filler contented build-up layers. As a result, we improved drilled-hole quality by using prototype PWBs made of GFRP with filler in the build-up layer.

Monitoring Method for Laser Via Hole Processing of Printed Circuit Boards Based on Two-Color Method With a High-Speed Video Camera

2020 ◽  
Author(s):  
Wataru Nakagawa ◽  
Ryuta Yamaguchi ◽  
Toshiki Hirogaki ◽  
Eiichi Aoyama
Keyword(s):  
High Speed ◽  
Printed Circuit Boards ◽  
Color Image ◽  
Irradiation Time ◽  
Single Pulse ◽  
Video Camera ◽  
Image Method ◽  
Drilling Process ◽  
Monitoring Method ◽  
Direct Laser

Abstract A build-up process is used to manufacture printed wiring boards (PWBs) for high-density circuits. Presently, CO2 laser beams are used to drill blind via holes (BVHs) that connect copper foils. The Cu-direct drilling process has received considerable attention but is problematic because it produces a copper overhang due to the complex processing phenomena. This report focuses on monitoring scattered matter by Cu-direct laser drilling with a high-speed camera and clarifying the factors related to processing quality while verifying the results by CFD (Computational Fluid Dinamics) analysis. Previous research has shown that processing progress can be made from temperature information using the two-color image method that can measure temperature without contact. However, the two-color image method generates noise in the temperature range (500–3000 °C) which is treated in this research. Filtering was possible by using the RGB data of each pixel on the image. By focusing on laser fluence, it became possible to estimate the laser irradiation time that can guarantee the quality in the drilled hole (BVH) in single pulse continuous irradiation.

Process Design and Control Method of Laser Via Hole Drilling of Printed Wiring Boards Based on High Speed Camera Monitor

2017 ◽  
Author(s):  
Koji Kanki ◽  
Toshiki Hirogaki ◽  
Eiichi Aoyama ◽  
Keiji Ogawa
Keyword(s):  
High Speed ◽  
Copper Foil ◽  
Control Method ◽  
Irradiation Time ◽  
Hole Drilling ◽  
Drilling Process ◽  
High Speed Camera ◽  
Printed Wiring Boards ◽  
Laser Method ◽  
Direct Laser

In recent years, the performance and miniaturization of portable information devices have rapidly advanced. The build-up process is often used in the manufacturing of printed wiring boards (PWBs) for high-density circuits. At present, CO2 laser beams are generally used in the build-up process to drill blind via holes (BVHs) that connect copper foils. The Cu direct-laser method is often used in this process, which irradiates laser to drill the copper foil and insulation layer simultaneously. Cu direct-laser involves a complex phenomenon because it drills copper and resin, with different decomposition points, at the same time. However, only few studies have been made in this field. This report focuses on monitoring Cu direct-laser drilling with a high-speed camera. We drilled holes with four different laser power outputs, 25 W, 50 W, 75 W, and 95 W and measured the size of the drilled holes. During the drilling process, the camera captured the emission of scattering materials in the PWBs. We have processed the images obtained from the camera to observe the scattering material. As a result, we found out that changes in the amount of scattering occur on four occasions: when the outer copper foil is drilled through, when the drilled depth reaches the inner copper foil, when the increase rate of the hole diameter is reduced, and when the inner copper foil is drilled through. Based on these results, the suitable laser irradiation time can be determined for different drilling conditions.

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