Fabrication Processes of SOI Structure for Optical Nonreciprocal Devices

2018 ◽  
Vol 777 ◽  
pp. 107-112
Author(s):  
Salinee Choowitsakunlert ◽  
Kenji Takagiwa ◽  
Takuya Kobashigawa ◽  
Nariaki Hosoya ◽  
Rardchawadee Silapunt ◽  
...  
Keyword(s):  
Adhesive Bonding ◽  
Mode Conversion ◽  
Silicon On Insulator ◽  
Radiation Mode ◽  
Optical Isolator ◽  
Optic Waveguide ◽  
Iron Garnet ◽  
Relationship Of ◽  
The Relationship ◽  
Magneto Optic

Fabrication processes of a magneto-optic waveguide with a Si guiding layer for an optical isolator employing a nonreciprocal guided-radiation mode conversion are investigated. The optical isolator is constructed on a silicon-on-insulator (SOI) structure. The magneto-optic waveguide is fabricated by bonding the Si guiding layer with a cerium-substituted yttrium iron garnet (Ce:YIG). The relationship of waveguide geometric parameters is determined at a wavelength of 1550 nm. The results show that larger tolerance for isolator operation can be obtained at smaller gaps between Si and Ce:YIG. Bonding processes including photosensitive adhesive bonding and surface activated bonding are then compared. It is found that the surface activated bonding process is easier to control and more promising than the photosensitive adhesive bonding.

scholarly journals Ce:YIG/Silicon-on-Insulator waveguide optical isolator realized by adhesive bonding

2012 ◽  
Vol 20 (2) ◽  
pp. 1839 ◽  
Author(s):  
S. Ghosh ◽  
S. Keyvavinia ◽  
W. Van Roy ◽  
T. Mizumoto ◽  
G. Roelkens ◽  
...  
Keyword(s):  
Adhesive Bonding ◽  
Silicon On Insulator ◽  
Optical Isolator

scholarly journals Optical Isolator for TE Polarized Light Realized by Adhesive Bonding of Ce:YIG on Silicon-on-Insulator Waveguide Circuits

2013 ◽  
Vol 5 (3) ◽  
pp. 6601108-6601108 ◽  
Author(s):  
S. Ghosh ◽  
S. Keyvaninia ◽  
Y. Shirato ◽  
T. Mizumoto ◽  
G. Roelkens ◽  
...  
Keyword(s):  
Adhesive Bonding ◽  
Polarized Light ◽  
Silicon On Insulator ◽  
Optical Isolator

An Effect of Friction Bonding Parameters to Delamination Defect

2016 ◽  
Vol 872 ◽  
pp. 73-77
Author(s):  
Thanarat Yupapornsopa ◽  
Suksan Prombanpong ◽  
Jessada Juntawongso
Keyword(s):  
Stainless Steel ◽  
Optimal Condition ◽  
Adhesive Bonding ◽  
Bonding Process ◽  
Bonding Parameters ◽  
Bonding Material ◽  
Defect Rate ◽  
Study Case ◽  
Relationship Of ◽  
The Relationship

One of the advance adhesion methods is a friction bonding process which two or more materials are welded by a combination of heat and force to soften and attain an atomic adhesion between the two work layers. Using the insufficient heat and force, it can result in a delamination, which their layers do not completely sealed after the process. On the other hand, too much heat and force can result in an overflow of inserted aluminum and weak adhesive strength. This paper aims at revealing the effect of work temperature and force on the delamination defect. A blank stainless steel 430 with a dimension of 145 mm and 0.5 mm thickness is bonded with an Al 3003. The dimension of Al 3003 blank is 255 mm in diameter and 0.5 mm thickness. An aluminum 1100 with a diameter of 130 mm and 2.5 mm thickness is used as an adhesive bonding material between the stainless steel and the Al 3003 blank. The results showed that a reduction in defect rate can be obtained by increasing the work temperature as well as the stamping force. In addition, the optimal condition of the study case is also obtained through the experimental design. It can be concluded from the analysis that at voltage of 580 Volt which is equivalent to 470 C and force of 1,000 Tons is the optimal condition providing the least defect rate. The regression model was also developed to show the relationship of factors to the delamination size. This equation can be used to predict the mentioned delamination rate at various conditions.

Design of Optical Isolator with TiO2/(CeY)3Fe5O12 Guiding Layer

2011 ◽  
Vol 1291 ◽  
Author(s):  
Hideki Yokoi ◽  
Shintaro Ikeya ◽  
Tsuyoshi Imada
Keyword(s):  
Magnetic Field ◽  
Phase Shift ◽  
Multimode Interference ◽  
Optical Isolator ◽  
Layer Structures ◽  
Optic Waveguide ◽  
Multimode Interference Coupler ◽  
Magneto Optic

ABSTRACTAn optical isolator with a TiO2/(CeY)3Fe5O12 guiding layer was studied. A nonreciprocal phase shift was calculated in the magneto-optic waveguide with the TiO2/(CeY)3Fe5O12 guiding layer at a wavelength of 1.55 μm. By employing a multimode interference coupler as coupling devices, the total device length of approximately 600 μm was achieved. An interferometric optical isolator with distinct layer structures, which could be operated in a unidirectional magnetic field, was also designed.

Sign in / Sign up

Export Citation Format

Share Document