Biomineralization of Titanium Alloy with Surface Micro - and Nanoscaled Modifications

The aim of the present study was to characterize two kinds of TiN/TiO2 coatings in terms of topography, composition, and electrochemical stability after immersion in simulated body fluid (SBF). Micropatterning of the substrate (Ti-5Al-4V alloy) was done by using electron beam modification (EBM) by scanning electron beam while nanostructured TiN/TiO2 films were deposited over EBM Ti5Al4V substrates using two physical vapor deposition techniques: 1) magnetron sputtering, and 2) cathodic arc and glow-discharge methods. When immersed for 7 and 14 days in SBF at static conditions (37±0.05 °C, pH 7.4), Ca/P ratio of the apatite deposits increased from approximately 1.5 up to near stoichiometric (1.67), respectively. After the initial decrease, the pH of the solution during soaking increased gradually reaching values close to 7.7 for both coatings. However, the weight gain of the samples with Arc coatings after the immersion period in SBF was nearly three times more than those with magnetron deposited coating. The electrochemical potentiodynamic tests performed in SBF indicated a shift in the corrosion potentials towards nobler direction after 7 and 14 days of immersion compared to non-immersed samples, whereas the corrosion current density was slightly increased.

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Delamination of Electron-Beam Physical-Vapor Deposition Thermal Barrier Coatings using Luminescent Layers

AIAA Scitech 2021 Forum ◽

10.2514/6.2021-0432 ◽

2021 ◽

Author(s):

Quentin P. Fouliard ◽

Ranajay Ghosh ◽

Seetha Raghavan

Keyword(s):

Electron Beam ◽

Thermal Barrier Coatings ◽

Vapor Deposition ◽

Physical Vapor Deposition ◽

Thermal Barrier ◽

Barrier Coatings

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Titanium carbide coatings deposited by reactive ion beam-assisted, electron beam–physical vapor deposition

Surface and Coatings Technology ◽

10.1016/s0257-8972(99)00644-1 ◽

2000 ◽

Vol 124 (2-3) ◽

pp. 142-153 ◽

Cited By ~ 40

Author(s):

Douglas E. Wolfe ◽

Jogender Singh

Keyword(s):

Electron Beam ◽

Titanium Carbide ◽

Vapor Deposition ◽

Physical Vapor Deposition ◽

Ion Beam ◽

Carbide Coatings

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Extendibility of Cu Damascene to 0.1 μm Wide Interconnections

MRS Proceedings ◽

10.1557/proc-514-287 ◽

1998 ◽

Vol 514 ◽

Cited By ~ 4

Author(s):

C-K. Hu ◽

K. Y. Lee ◽

L. Gignac ◽

S. M. Rossnagel ◽

C. Uzoh ◽

...

Keyword(s):

Diffusion Barrier ◽

Vapor Deposition ◽

Chemical Mechanical Polishing ◽

Seed Layer ◽

Physical Vapor Deposition ◽

Ion Etching ◽

Damascene Process ◽

Effective Resistivity ◽

Ionized Physical Vapor Deposition ◽

Deposition Techniques

ABSTRACTWe demonstrate the extendibility of the Cu damascene process to 0.1 μm wide lines. Cu interconnects, 0.1 - 1 μm wide, were fabricated by a damascene process that produced planarized lines and vias, imbedded in insulators. This process was defined by 1) trench and via formation in blanket dielectrics using e-beam lithography and reactive ion etching, 2) trench fill using a series of metal depositions, and 3) chemical mechanical polishing to remove the field metals. Physical vapor and ionized physical vapor deposition techniques were used to deposit the adhesion/diffusion barrier liner and the Cu seed layer, respectively. The main Cu conductor was deposited by an electroplating method. The width of lines and vias were varied from 0.1 μm to 1 μm while the thicknesses were held constant at 0.45 μm. A near bamboo-like structure was observed in the sub-μm wide lines. The effective resistivity of the Cu lines was found to be about 2.3 μΩ-cm and was independent of width after annealing at 400 °C.

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Strain Tolerance and Microstructure of Thermal Barrier Coatings Produced by Electron Beam Physical Vapor Deposition Process

Materials Science Forum ◽

10.4028/www.scientific.net/msf.522-523.267 ◽

2006 ◽

Vol 522-523 ◽

pp. 267-276 ◽

Cited By ~ 1

Author(s):

Kunihiko Wada ◽

Yutaka Ishiwata ◽

Norio Yamaguchi ◽

Hideaki Matsubara

Keyword(s):

Electron Beam ◽

High Temperature ◽

Thermal Barrier Coatings ◽

Vapor Deposition ◽

Physical Vapor Deposition ◽

Aging Treatment ◽

Nanoindentation Test ◽

Thermal Barrier ◽

Barrier Coatings ◽

Strain Tolerance

Several kinds of thermal barrier coatings (TBCs) deposited by electron beam physical vapor deposition (EB-PVD) were produced as a function of electron beam power in order to evaluate their strain tolerance. The deposition temperatures were changed from 1210 K to 1303 K depending on EB power. In order to evaluate strain tolerances of the EB-PVD/TBCs, a uniaxial compressive spallation test was newly proposed in this study. In addition, the microstructures of the layers were observed with SEM and Young’s moduli were measured by a nanoindentation test. The strain tolerance in as-deposited samples decreased with an increase in deposition temperature. In the sample deposited at 1210 and 1268 K, high-temperature aging treatment at 1273 K for 10 h remarkably promoted the reduction of the strain tolerance. The growth of thermally grown oxide (TGO) layer generated at the interface between topcoat and bondcoat layers was the principal reason for this strain tolerance reduction. We observed TGO-layer growth even in the as-deposited sample. Although the thickness of the initial TGO layer in the sample deposited at high temperature was thicker, the growth rate during aging treatment was smaller than those of the other specimens. This result suggests that we can improve the oxidation resistance of TBC systems by controlling the processing parameters in the EB-PVD process.

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