The Role of Anisotropic Grain Boundary Parameters in Grain Growth

1996 ◽  
Vol 204-206 ◽  
pp. 361-370 ◽  
Author(s):  
Valerie Randle
Keyword(s):  
2010 ◽  
Vol 653 ◽  
pp. 87-130 ◽  
Author(s):  
Ankur Gupta ◽  
Samir Sharma ◽  
Milind R. Joshi ◽  
Parnika Agarwal ◽  
Kantesh Balani

Emergence of engineering nanomaterials to render exceptional properties require understanding the thermodynamics and kinetics of grain growth and eliciting role of grain boundary mobility therein. Grain boundary mobility in alumina (Al2O3) has shown several repercussions on the evolution of microstructure to render drastic differences in the mechanical- (hardness, yield strength), optical- (transmittance), electrical- (conductivity), magnetic- (susceptibility), and electrochemical- (corrosion) properties. Consequently, the role of surface energy and the effect of temperature in equilibrating the grain shape and size are presented herewith. Several statistical or deterministic computational modeling have been attempted by researchers to elicit the dominating grain growth mechanisms. But, the limitations extend from the memory of computer and number of atoms in a simulation, or feeding the boundary conditions without incorporation of the initial microstructure to arrive at the dominating growth mechanism parameters. Contrastingly, the role of dopants in Al2O3 to either enhance or impede the grain growth is presented via various complexions responsible for transitions at the grain boundary interface. Six complexions resulting various grain boundary interface, strongly affect the grain boundary mobility, and sideline the dopant contributions in deciding the overall grain boundary mobility. It has also been presented that grain growth exponent increases with decreasing grain size, and additionally, secondary reinforcement of carbon nanotube (CNT) in Al2O3 impedes the grain mobility by as much as four times. The effect of temperature is found to be more pronounced, and has shown to enhance the grain boundary mobility by as much as six orders of magnitude.


1992 ◽  
Vol 94-96 ◽  
pp. 391-398 ◽  
Author(s):  
I. Heckelmann ◽  
Giuseppe Carlo Abbruzzese ◽  
K. Lücke

1998 ◽  
Vol 13 (10) ◽  
pp. 2819-2832 ◽  
Author(s):  
Russell B. Rogenski ◽  
Kenneth H. Sandhage ◽  
Alexander L. Vasiliev ◽  
Eric P. Kvam

The grain growth of dense, fine-grained Nd1+xBa2−xCu3Oy (x = 0.1−0.4) specimens has been examined in pure O2(g) at 938 °C and 967 °C. No detectable change in average grain size was observed for Nd1.4Ba1.6Cu3Oy within 72 h at 967 °C; however, a significant increase in average grain size developed between 18 and 24 h at 967 °C for Nd1.3Ba1.7Cu3Oy, and within 8−12 h at ≤967 °C for Nd1.2Ba1.8Cu3Oy and Nd1.1Ba1.9Cu3Oy. Microstructural analyses revealed that sudden changes in average grain size coincided with the formation of relatively large (abnormal) grains. A broadening of the grain size distribution was also observed. TEM analyses revealed that grain boundaries were free of second phases. The possible role of anisotropy in grain boundary energy and/or mobility on grain growth is discussed.


2020 ◽  
Vol 188 ◽  
pp. 641-651 ◽  
Author(s):  
Hesham Salama ◽  
Julia Kundin ◽  
Oleg Shchyglo ◽  
Volker Mohles ◽  
Katharina Marquardt ◽  
...  

Author(s):  
A.H. Advani ◽  
L.E. Murr ◽  
D. Matlock

Thermomechanically induced strain is a key variable producing accelerated carbide precipitation, sensitization and stress corrosion cracking in austenitic stainless steels (SS). Recent work has indicated that higher levels of strain (above 20%) also produce transgranular (TG) carbide precipitation and corrosion simultaneous with the grain boundary phenomenon in 316 SS. Transgranular precipitates were noted to form primarily on deformation twin-fault planes and their intersections in 316 SS.Briant has indicated that TG precipitation in 316 SS is significantly different from 304 SS due to the formation of strain-induced martensite on 304 SS, though an understanding of the role of martensite on the process has not been developed. This study is concerned with evaluating the effects of strain and strain-induced martensite on TG carbide precipitation in 304 SS. The study was performed on samples of a 0.051%C-304 SS deformed to 33% followed by heat treatment at 670°C for 1 h.


Author(s):  
Jin Young Kim ◽  
R. E. Hummel ◽  
R. T. DeHoff

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.


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