Role of grain-boundary diffusion in the grain growth in nanocrystalline nickel

2008 ◽  
Vol 2008 (4) ◽  
pp. 286-293 ◽  
Author(s):  
A. N. Aleshin
1999 ◽  
Vol 601 ◽  
Author(s):  
B.-N. Kim ◽  
K. Hiraga

AbstractSuperplastic tensile deformation is simulated in 2 dimensions by incorporating grain boundary diffusion and concurrent grain growth derived from static and dynamic growth mechanisms. The following relationship is found between microstructural changes and deformation behavior for constant stress conditions. Grain boundary diffusion produces an increase in the aspect ratio of the matrix grains during deformation and the increased aspect ratio causes a change in creep rate parameters: the stress exponent is decreased from the initial value of 1.0 for equiaxed grains and the grain size exponent is increased from the initial value of 3.0. Accelerated grain growth is also found by the present simulation.


2007 ◽  
Vol 266 ◽  
pp. 13-28 ◽  
Author(s):  
Alan F. Jankowski

Thermal anneal treatments are used to identify the temperature range of the two dominant diffusion mechanisms – bulk and grain boundary. To assess the transition between mechanisms, the low temperature range for bulk diffusion is established utilizing the decay of static concentration waves in composition-modulated nanolaminates. These multilayered structures are synthesized using vapor deposition methods as thermal evaporation and magnetron sputtering. However, at low temperature the kinetics of grain-boundary diffusion are much faster than bulk diffusion. The synthesis of Au-Cu alloys (0-20 wt.% Cu) with grain sizes as small as 5 nm is accomplished using pulsed electro-deposition. Since the nanocrystalline grain structure is thermally unstable, these structures are ideal for measuring the kinetics of grain boundary diffusion as measured by coarsening of grain size with low temperature anneal treatments. A transition in the dominant mechanism for grain growth from grain boundary to bulk diffusion is found with an increase in temperature. The activation energy for bulk diffusion is found to be 1.8 eV·atom-1 whereas that for grain growth at low temperatures is only 0.2 eV·atom-1. The temperature for transitioning from the dominant mechanism of grain boundary to bulk diffusion is found to be 57% of the alloy melt temperature and is dependent on composition.


In measurements of grain boundary transport it is the product of the grain boundary enrichment ratio and the grain boundary diffusivity that is usually obtained. This work presents the first study in which these two terms are separated and in which the role of the grain boundary composi­tion in grain boundary diffusion is analysed in detail. This leads to the general prediction that the grain boundary diffusion of solute and solvent will be reduced by strongly segregating solutes if they do not simultaneously enhance the bulk diffusivities. The converse occurs if the solute weakly segregates but strongly enhances the bulk diffusivities. The diffusion measurements are made in iron–tin alloys in the tempera­ture range 563–750 °C by using radiotracers, and the segregation measure­ments, similarly, by Auger electron spectroscopy. The measured bulk diffusivities are similar to those found previously. The grain boundary diffusivities, determined via Suzuoka’s (1964) analysis, for iron and tin in pure iron have pre-exponential coefficients of 225 x 10 -4 and 9.2 x 10 -4 m 2 s -1 and activation energies of 165770 and 166600 J mol -1 respectively. Contrary to the increase in the bulk diffusivity produced by the ‘fast’ diffuser, tin, both grain boundary diffusivities are sharply reduced as the tin content rises. These and earlier results are interpreted through the effect of tin segregation on the grain boundary energy described by the theory of Borisov et al . (1964).


Sign in / Sign up

Export Citation Format

Share Document