Low-Pressure Fast Growth and Characterization of 4H-SiC Epilayers

2010 ◽  
Vol 645-648 ◽  
pp. 77-82 ◽  
Author(s):  
Hidekazu Tsuchida ◽  
Masahiko Ito ◽  
Isaho Kamata ◽  
Masahiro Nagano ◽  
Tetsuya Miyazawa ◽  
...  
Keyword(s):  
Room Temperature ◽  
Deep Level ◽  
Fast Growth ◽  
Extended Defects ◽  
System Pressure ◽  
Transient Spectroscopy ◽  
Annealing Method ◽  
Fast Growth Rate

Fast and thick 4H-SiC epitaxial growth is demonstrated in a vertical-type reactor under a low system pressure within the range 13-40 mbar. A very fast growth rate of up to 250 m/h is obtained. The material quality of the epilayers grown in the reactor is evaluated by low-temperature photoluminescence, deep level transient spectroscopy, microwave photoconductive decay, synchrotron topography and room temperature PL imaging. The carrier lifetime of thick epilayers with or without the application of the C+-implantation/annealing method and extended defects in the epilayers grown on 8º and 4º off substrates are discussed.

Evidence and Characterization of Crystallographic Defect and Material Quality after SLIM-Cut Process

2011 ◽  
Vol 1323 ◽  
Author(s):  
Alex Masolin ◽  
Jan Vaes ◽  
Frederic Dross ◽  
Roberto Martini ◽  
Amaia Pesquera Rodriguez ◽  
...  
Keyword(s):  
Defect Density ◽  
Negative Impact ◽  
Deep Level ◽  
Silicon Substrates ◽  
Crystallographic Defect ◽  
Transient Spectroscopy ◽  
Electronic Activity ◽  
Crystallographic Defects

ABSTRACTThe SLIM-Cut process is a kerf-free wafering technique to obtain silicon substrates as thin as 50μm. The quality of the resulting material must be assessed to ensure that this innovative Si-foil approach does not jeopardize the potential efficiency of the final solar cell in terms of electronic activity, defect density and location. For that reason, we performed Microwave-Detected Photoconductance Decay (MW-PCD), Deep-Level Transient Spectroscopy (DLTS) and optical inspections after defect etching of the foils surface. Analyses indicate that SLIM-Cut generates crystallographic defects which create deep level traps that have a negative impact on the lifetime of the silicon foil. Nonetheless, a decrease of the thermal budget will lead to a reduction of plasticity and hence lower the amount of defects and increase the foil quality.

Characterization of Deep Levels in High-Resistive 6H-SiC by Current Deep Level Transient Spectroscopy

2009 ◽  
Vol 615-617 ◽  
pp. 381-384 ◽  
Author(s):  
Masashi Kato ◽  
Kosuke Kito ◽  
Masaya Ichimura
Keyword(s):  
Temperature Dependence ◽  
Deep Level Transient Spectroscopy ◽  
Room Temperature ◽  
Deep Level ◽  
Deep Levels ◽  
Donor Level ◽  
Acceptor Level ◽  
Transient Spectroscopy ◽  
Lower Resistivity

We measured the temperature dependence of the electrical resistivity for two high-purity undoped 6H-SiC bulk wafers with resistivities of 1.5103 cm and 8.3108 cm at room temperature. We also characterized the deep levels affecting the semi-insulating property by current deep level transient spectroscopy (I-DLTS) and photo induced current level transient spectroscopy (PICTS) measurements. The activation energies of the resistivity were 0.11 eV and 0.59 eV for the samples with lower and higher resistivities, respectively. In I-DLTS and PICTS spectra, the sample with lower resistivity shows a donor level at Ec0.17 eV and two acceptor levels around Ec0.40 eV, while the sample with higher resistivity shows acceptor levels at Ec0.77 eV and Ev+0.46 eV. We calculated the temperature dependence of the resistivity with a model considering one donor level and one acceptor level based on parameters from I-DLTS peaks. We reproduced the experimental results only for the sample with lower resistivity. The acceptor level near the valence band needs to be considered to explain the resistivity for the sample with higher resistivity.

The Characterization of Germanium and Silicon for Nuclear Radiation Detectors.

1982 ◽  
Vol 16 ◽  
Author(s):  
L. S. Darken
Keyword(s):  
High Purity ◽  
Deep Level ◽  
Radiation Detectors ◽  
Nuclear Radiation ◽  
Extended Defects ◽  
Pure Material ◽  
Photothermal Ionization Spectroscopy ◽  
Transient Spectroscopy ◽  
Nuclear Radiation Detectors

ABSTRACTSemiconductor nuclear radiation detectors require deep depletion depths (0.03–3.0 cm) and effective charge collection distances which are several times longer than these depletion depths. These requirements place stringent limitations on the net electrically active impurity concentration, and on the concentration of deep centers which can trap carriers generated by the incident nuclear radiation. This need for extremely pure material distinguishes the interests and efforts of the semiconductor detector community from the rest of the semiconductor community. This paper reviews the characterization of shallow-level, deep-level, neutral, and extended defects in germanium and silicon for nuclear radiation detectors. Photothermal ionization spectroscopy has been used extensively to identify the residual hydrogenic impurities in high-purity (∣NA–ND∣ ≈ 1010–1011 cm−3 ) germanium and silicon. Deep level transient spectroscopy has been effectively used to detect and identify deeper levels in high-purity germanium. Residual neutral defects are not necessarily passive: they may complex to form deep or shallow levels, they may precipitate, or they may act as nucleation sites for precipitation. The properties of extended defects (dislocations, lineage, inclusions, precipitates) and their effects on device performance are fundamentally less well understood, as the origin of the electrical activity of these defects is uncertain. It has been found in numerous instances that chemical interactions among defects are important even in these high-purity semiconductors.

Characterization of a Metastable Defect Introduced In Epitaxially Grown Boron Doped Si by 5.4 Mev α-Particles

1998 ◽  
Vol 510 ◽  
Author(s):  
M. Mamor ◽  
F.D. Auret ◽  
S.A. Goodman ◽  
W.E. Meyer
Keyword(s):  
Room Temperature ◽  
Deep Level ◽  
Zero Bias ◽  
First Order Kinetics ◽  
Boron Doped ◽  
Particle Irradiation ◽  
Transient Spectroscopy ◽  
P Type ◽  
Metastable Defect

AbstractDeep level transient spectroscopy (DLTS) was used to examine the metastability of a defect configuration in epitaxially grown boron-doped p-type Si. We report the detection of a new metastable defect Hα2 in p-Si following room temperature alpha particle irradiation. DLTS measurements coupled with bias-on/bias-off cooling cycles were used to study the annealing and introduction kinetics of this metastable defect. After removing Hα2 by zero-bias annealing at room temperature, it was re-introduced by reverse bias annealing in the 240-265 K temperature range under predominantly first order kinetics. The energy level and apparent capture cross section, as determined by DLTS, were E,+ 0.43 eV and 1.4 × 10−15 cm2, respectively.

Deep level transient spectroscopy characterization of InAs self-assembled quantum dots

2001 ◽  
Vol 89 (2) ◽  
pp. 1172-1174 ◽  
Author(s):  
V. V. Ilchenko ◽  
S. D. Lin ◽  
C. P. Lee ◽  
O. V. Tretyak
Keyword(s):  
Quantum Dots ◽  
Deep Level Transient Spectroscopy ◽  
Deep Level ◽  
Self Assembled ◽  
Transient Spectroscopy

Capacitance-voltage and deep-level-transient spectroscopy characterization of defects near SiO2/SiC interfaces

2011 ◽  
Vol 109 (6) ◽  
pp. 064514 ◽  
Author(s):  
A. F. Basile ◽  
J. Rozen ◽  
J. R. Williams ◽  
L. C. Feldman ◽  
P. M. Mooney
Keyword(s):  
Deep Level Transient Spectroscopy ◽  
Deep Level ◽  
Capacitance Voltage ◽  
Transient Spectroscopy

Photoluminescence Characterization of SiGe/Si Quantum-Well Wire Structures

1995 ◽  
Vol 379 ◽  
Author(s):  
S. Nilsson ◽  
H. P. Zeindl ◽  
A. Wolff ◽  
K. Pressel
Keyword(s):  
Quantum Well ◽  
Room Temperature ◽  
Molecular Beam ◽  
Optical Quality ◽  
Photoluminescence Spectra ◽  
Single Quantum Well ◽  
Quantum Well Wire ◽  
Carbon Interstitial

ABSTRACTLow-temperature photoluminescence measurements were performed in order to probe the optical quality of SiGe/Si quantum-well wire structures fabricated by electron-beam lithography and subsequent reactive ion etching, having the patterned polymethylmethacrylate resist as an etch mask. In addition, one set of quantum-well wire structures was post-treated by means of annealing in a hydrogen environment. Our results show that even for the smallest wires of about 100nm in width, the wires exhibit phonon-resolved photoluminescence spectra, similar to that from the molecular beam eptitaxially grown SiGe single quantum well which was used as starting material for the patterning process. After the patterning process a new sharp peak appears in the photoluminescence spectra at 0.97eV in photon energy. Our investigation suggests that this feature is introduced by damage during the patterning process and most probably identical to the G-line, which previously was identified as originating from the dicarbon centre (substitutional carbon-interstitial carbon) in Si. This centre is known to be a very common endproduct of irradiating Si near room temperature which is the case at our patterning process.

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