The Influence of Alloy Composition and Heat-Treatments on the Shape Memory Properties in a Cu-Sn-X Alloy

2018 ◽  
Vol 941 ◽  
pp. 1282-1287
Author(s):  
Daisuke Kaneko ◽  
Mahoto Takeda ◽  
Takanari Nakajima ◽  
Naokuni Muramatsu
Keyword(s):  
Shape Memory ◽  
Room Temperature ◽  
Elastic Recovery ◽  
Ternary Alloys ◽  
Bending Tests ◽  
Three Point Bending ◽  
Shape Memory Properties ◽  
Room Temperature Aging ◽  
Temperature Aging ◽  
Better Than

We have focused on shape-memory properties of Cu-Sn based ternary alloys in this study. We have attempted to suppress degradation at room temperature aging and to improve the amount of shape recovery by adding the third element to a binary Cu-Sn alloy. The attempt has successfully conducted in Cu-Sn-Mn alloy, the degradation due to aging at room temperature was suppressed and the thermal stability was improved. Furthermore, the present study revealed that Cu-Sn-Mn alloy exhibited a large super elastic recovery in three point bending tests. We have also investigated the shape-memory properties of Cu-Sn-Si alloys and revealed that the ternary alloy has achieved super-elastic recovery better than the Cu-Sn-Mn alloy in the three-point bending tests.

scholarly journals Effects of Room Temperature Aging on Adhesion of Electroless Plating Film on Silicon Using Gold Nanoparticle Catalysts

2019 ◽  
Vol 70 (3) ◽  
pp. 174-176
Author(s):  
Yuichi TAKASAKA ◽  
Ryo FUJII ◽  
Naoki YAMADA ◽  
Naoki FUKUMURO ◽  
Susumu SAKAMOTO ◽  
...  
Keyword(s):  
Gold Nanoparticle ◽  
Electroless Plating ◽  
Room Temperature ◽  
Nanoparticle Catalysts ◽  
Room Temperature Aging ◽  
Temperature Aging

scholarly journals Effects of various pre-treatments and cold rolling on room temperature aging of 6000 series aluminum alloys

2009 ◽  
Vol 59 (5) ◽  
pp. 254-260
Author(s):  
Takahiko Nakamura ◽  
Kenji Muramatsu ◽  
Masanori Nagai ◽  
Ryouhei Otsu ◽  
Shin-ya Komatsu
Keyword(s):  
Aluminum Alloys ◽  
Cold Rolling ◽  
Room Temperature ◽  
Room Temperature Aging ◽  
Temperature Aging

Sn Whisker Growth in Cu(Top)-Sn(Bottom) Bilayer System upon Room Temperature Aging

2013 ◽  
Vol 785-786 ◽  
pp. 918-923 ◽  
Author(s):  
Lin Huang ◽  
Xue Nian Lin ◽  
Ren Wu Chen ◽  
Jiang Yong Wang
Keyword(s):  
Room Temperature ◽  
Whisker Growth ◽  
X Ray Diffraction ◽  
Sn Whisker ◽  
X Ray ◽  
Bilayer System ◽  
Room Temperature Aging ◽  
Sublayer Thickness ◽  
Temperature Aging ◽  
Scanning Electron

The Sn whisker growth in Cu(top)-Sn(bottom) bilayer system upon room temperature aging was investigated by scanning electron microscope and X-ray diffraction techniques. The experimental observations indicate that the Sn whisker growth on the Cu surface in Cu-Sn bilayer system is different from that on the Sn surface in Sn-Cu bilayer system. When the Sn sublayer thickness is less than 0.5μm, the Sn whisker growth can take place in Cu-Sn system but not in Sn-Cu system. An explanation for Sn whisker growth in Cu-Sn bilayer system is given.

scholarly journals On the room-temperature aging effects in YBa 2 Cu 3 O 6+δ

2015 ◽  
Vol 515 ◽  
pp. 54-61 ◽  
Author(s):  
А.V. Fetisov ◽  
G.А. Kozhina ◽  
S.Kh. Estemirova ◽  
V.Ya. Mitrofanov
Keyword(s):  
Room Temperature ◽  
Aging Effects ◽  
Room Temperature Aging ◽  
Temperature Aging
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