Room-temperature aging of hydrogen in α-Fe after cathodic charging

1991 ◽  
Vol 22 (1) ◽  
pp. 261-264
Author(s):  
K. F. Ha ◽  
Y. Liu ◽  
Z. Z. An
Keyword(s):  
Room Temperature ◽  
Room Temperature Aging ◽  
Temperature Aging ◽  
Cathodic Charging

scholarly journals Effects of Room Temperature Aging on Adhesion of Electroless Plating Film on Silicon Using Gold Nanoparticle Catalysts

2019 ◽  
Vol 70 (3) ◽  
pp. 174-176
Author(s):  
Yuichi TAKASAKA ◽  
Ryo FUJII ◽  
Naoki YAMADA ◽  
Naoki FUKUMURO ◽  
Susumu SAKAMOTO ◽  
...  
Keyword(s):  
Gold Nanoparticle ◽  
Electroless Plating ◽  
Room Temperature ◽  
Nanoparticle Catalysts ◽  
Room Temperature Aging ◽  
Temperature Aging

scholarly journals Effects of various pre-treatments and cold rolling on room temperature aging of 6000 series aluminum alloys

2009 ◽  
Vol 59 (5) ◽  
pp. 254-260
Author(s):  
Takahiko Nakamura ◽  
Kenji Muramatsu ◽  
Masanori Nagai ◽  
Ryouhei Otsu ◽  
Shin-ya Komatsu
Keyword(s):  
Aluminum Alloys ◽  
Cold Rolling ◽  
Room Temperature ◽  
Room Temperature Aging ◽  
Temperature Aging

Sn Whisker Growth in Cu(Top)-Sn(Bottom) Bilayer System upon Room Temperature Aging

2013 ◽  
Vol 785-786 ◽  
pp. 918-923 ◽  
Author(s):  
Lin Huang ◽  
Xue Nian Lin ◽  
Ren Wu Chen ◽  
Jiang Yong Wang
Keyword(s):  
Room Temperature ◽  
Whisker Growth ◽  
X Ray Diffraction ◽  
Sn Whisker ◽  
X Ray ◽  
Bilayer System ◽  
Room Temperature Aging ◽  
Sublayer Thickness ◽  
Temperature Aging ◽  
Scanning Electron

The Sn whisker growth in Cu(top)-Sn(bottom) bilayer system upon room temperature aging was investigated by scanning electron microscope and X-ray diffraction techniques. The experimental observations indicate that the Sn whisker growth on the Cu surface in Cu-Sn bilayer system is different from that on the Sn surface in Sn-Cu bilayer system. When the Sn sublayer thickness is less than 0.5μm, the Sn whisker growth can take place in Cu-Sn system but not in Sn-Cu system. An explanation for Sn whisker growth in Cu-Sn bilayer system is given.

scholarly journals Thermal cycling induced room temperature aging effect in Ni-rich NiTi shape memory alloy

2016 ◽  
Vol 113 ◽  
pp. 206-208 ◽  
Author(s):  
Xiebin Wang ◽  
Jan Van Humbeeck ◽  
Bert Verlinden ◽  
Sergey Kustov
Keyword(s):  
Shape Memory Alloy ◽  
Thermal Cycling ◽  
Shape Memory ◽  
Room Temperature ◽  
Aging Effect ◽  
Niti Shape Memory Alloy ◽  
Room Temperature Aging ◽  
Temperature Aging

scholarly journals On the room-temperature aging effects in YBa 2 Cu 3 O 6+δ

2015 ◽  
Vol 515 ◽  
pp. 54-61 ◽  
Author(s):  
А.V. Fetisov ◽  
G.А. Kozhina ◽  
S.Kh. Estemirova ◽  
V.Ya. Mitrofanov
Keyword(s):  
Room Temperature ◽  
Aging Effects ◽  
Room Temperature Aging ◽  
Temperature Aging

Atomic Force Microscope Manifestation of Heat-Resistant Polymer Thermal Stability

2014 ◽  
Vol 1073-1076 ◽  
pp. 2267-2271
Author(s):  
Tao Ping Chen ◽  
Biao Qiu ◽  
Na Wang ◽  
Ru He
Keyword(s):  
Thermal Stability ◽  
Atomic Force Microscope ◽  
Polymer Solution ◽  
Room Temperature ◽  
Branch Length ◽  
Status Change ◽  
Heat Resistant ◽  
Atomic Force ◽  
Room Temperature Aging ◽  
Temperature Aging

Aimed at BH heat-resistant polymer, 4500mg/L solution is compounded by oilfield sewage, and then diluted into 1500mg/L solution by oilfield sewage again under room temperature, aging in the constant temperature box of 95°C finally. Test slides are made of different aging time BH heat-resistance polymer solution, whose thermal stability is manifested by atomic force microscope. Results show the aggregation degree of BH heat-resistant polymer solution are different after aging for 30d, 60d, 90d under 95°C. They gather largely before aging, are into a loose branch distribution. After aging for 30d, their aggregation degree declines, branch length becomes shorter. After aging for 60d, their aggregation status change greatly, are into "╫╫" shape comb distribution. After aging for 90d, they gather into about 10μm in diameter short fat wafer, and are not easy to expand.

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