Semeiconductor Packaging Trends and Materials Challenges
2013 ◽
Vol 2013
(DPC)
◽
pp. 000310-000333
Keyword(s):
Semiconductor advancements continue to enable many new applications to enable the Internet of Things and transform areas such as coud computing, health care, safety and security, and consumer electronics. As exciting new capabilities emerge, customers are demanding smaller, thinner, faster and more power efficient solutions. In his keynote presentation Dr. Mahadevan “Devan” Iyer will discuss these trends, and how packaging technology is playing an increasingly important role in delivering these benefits in IC products. Dr. Iyer will outline the materials requirements and challenges for increased electrical, thermal and reliability performance.
2018 ◽
Vol 87
◽
pp. 154-156
◽
2013 ◽
Vol 9
(1)
◽
pp. 86-116
◽
Keyword(s):
2018 ◽
Vol 7
(4.36)
◽
pp. 700
2019 ◽
Vol 7
(2)
◽
pp. 21-40
◽
2019 ◽
Vol 33
(2)
◽
pp. e4179
◽
2012 ◽
Vol 1
(2)
◽
pp. 23-23
◽
2015 ◽
Vol 61
(4)
◽
pp. 564-571
◽
Keyword(s):