Investigation of Thick Film Technology for High Temperature Applications

2012 ◽  
Vol 2012 (HITEC) ◽  
pp. 000184-000191 ◽  
Author(s):  
Zhangming Zhou ◽  
Jinzi Cui ◽  
Fang Yu ◽  
Kun Fang ◽  
Zhenzhen Shen ◽  
...  

For electronics operating at 300°C, thick film technology has been proposed as a suitable interconnection technology to create modules. This work examines the leakage current with constant bias (100V) at 300°C. The leakage current increased significantly within the first few hours of aging. The effect of 300°C aging with dc bias on the adhesion of multilayer thick film test structures was also studied. The aged adhesion was a function of bias polarity. Fracture surface analysis results are presented. Bi in the PtPdAu conductor appears to play a role in both the leakage current and adhesion phenomena observed.

Fiber Optics ◽  
1979 ◽  
pp. 187-208 ◽  
Author(s):  
J. J. Mecholsky ◽  
S. W. Freiman ◽  
S. M. Morey

2011 ◽  
Vol 314-316 ◽  
pp. 1210-1213
Author(s):  
Fang Po Li ◽  
Yong Gang Liu ◽  
Wang Yong

The failure cause of Φ127mm G105 IEU drill pipe upset was investigated through mechanical properties testing, optical morphologies and fracture surface analysis. The result show that drill pipe upset’s failure reason is the elephant hide and decarburization layer in its out-surface caused by improper upset treatment in forging process. Elephant hide and decarburization layer existing in drill pipe upset changed seriously reduced its strength and fatigue property. Under the effect of alternating stresses, the crack first initiated from the deepest position of elephant hide and developed quickly. In the end, it leaded the drill pipe to early piecing failure.


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