Thermal Stability of Intermetallic Cu–Sn Interconnections for High Temperature Applications

2018 ◽  
Vol 15 (1) ◽  
pp. 35-40
Author(s):  
A. Novikov ◽  
M. Nowottnick
Keyword(s):  
Thermal Stability ◽  
High Temperature ◽  
Test Bench ◽  
Solder Joints ◽  
New Technology ◽  
Solder Paste ◽  
Special Test ◽  
Standard Alloy ◽  
Thermal Stability Of ◽  
Temperature Applications

New technology based on mixing of standard alloy SnCu in form of solder paste with copper paste was presented. This technology allows the production of solder joints with higher standoff consisting of intermetallic compounds. Such solder joints were qualified for high temperature applications by investigation of thermal stability of overlapped solder joints. For this purpose a special test bench for the investigation of remelting temperature up to 300°C was developed.

Intermetallic connections for high temperature applications

2017 ◽  
Vol 2017 (HiTEN) ◽  
pp. 000051-000056
Author(s):  
A. Novikov ◽  
M. Nowottnick
Keyword(s):  
Thermal Stability ◽  
High Temperature ◽  
Test Bench ◽  
Solder Joints ◽  
New Technology ◽  
Solder Paste ◽  
Special Test ◽  
Standard Alloy ◽  
Thermal Stability Of ◽  
Temperature Applications

Abstract New technology based on mixing of standard alloy SnCu in form of solder paste with copper paste was presented. This technology allows the production of solder joints with higher stand-off consisting of intermetallic compounds. Such solder joints were qualified for the high temperature applications by investigation of thermal stability of overlapped solder joints. For this purpose a special test bench for the investigation of remelting temperature up to 300 °C was developed.

Thermal stability of trihexyl(tetradecyl)phosphonium chloride

2018 ◽  
Vol 20 (4) ◽  
pp. 2444-2456 ◽  
Author(s):  
Clio Deferm ◽  
Arne Van den Bossche ◽  
Jan Luyten ◽  
Harald Oosterhof ◽  
Jan Fransaer ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Ionic Liquid ◽  
High Temperature ◽  
Experimental Conditions ◽  
Phosphonium Chloride ◽  
Cyphos Il 101 ◽  
Thermal Stability Of ◽  
Temperature Applications

The thermal stability of the ionic liquid Cyphos IL 101 was investigated under various experimental conditions for possible high-temperature applications.

The Ordered Phase Formation in Ti-Al-Ga Alloys

1970 ◽  
Vol 28 ◽  
pp. 440-441
Author(s):  
Shiro Fujishiro ◽  
Harold L. Gegel
Keyword(s):  
Thermal Stability ◽  
High Temperature ◽  
Titanium Alloys ◽  
Growth Kinetics ◽  
Stoichiometric Composition ◽  
Good Potential ◽  
Alpha Titanium ◽  
Cold Rolled ◽  
Kinetics Of ◽  
Thermal Stability Of

Ordered-alpha titanium alloys having a DO19 type structure have good potential for high temperature (600°C) applications, due to the thermal stability of the ordered phase and the inherent resistance to recrystallization of these alloys. Five different Ti-Al-Ga alloys consisting of equal atomic percents of aluminum and gallium solute additions up to the stoichiometric composition, Ti3(Al, Ga), were used to study the growth kinetics of the ordered phase and the nature of its interface.The alloys were homogenized in the beta region in a vacuum of about 5×10-7 torr, furnace cooled; reheated in air to 50°C below the alpha transus for hot working. The alloys were subsequently acid cleaned, annealed in vacuo, and cold rolled to about. 050 inch prior to additional homogenization

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