scholarly journals Special issue/Three-dimensional molded circuit boards. Flat patterned circuit board.

1990 ◽  
Vol 41 (7) ◽  
pp. 728-732
Author(s):  
Yoshio OKADA ◽  
Takashi ANDOH ◽  
Shingo NISHIKI
Keyword(s):  
Three Dimensional ◽  
Circuit Board ◽  
Circuit Boards ◽  
Special Issue

scholarly journals TECHNOLOGY FOR CREATING THE TOPOLOGY OF PRINTED CIRCUIT BOARDS USING POLYMER 3D MASKS

2021 ◽  
pp. 120-131
Author(s):  
Igor Nevliudov ◽  
Evgeny Razumov-Fryzyuk ◽  
Dmytro Nikitin ◽  
Danila Bliznyuk ◽  
Roman Strelets
Keyword(s):  
3D Printing ◽  
Regression Models ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Experimental Studies ◽  
Three Dimensional ◽  
Circuit Board ◽  
Work Piece ◽  
Circuit Boards ◽  
Printed Circuit

The subject of research is the influence of factors of exposure of two-dimensional images on the topology of conductors in the manufacture of printed circuit boards by the method of three-dimensional polymer photomasks. The purpose of the work is ensuring the accuracy and preservation of the geometric dimensions of the conductors of printed circuit boards during LCD exposure of masks on the work piece. To achieve this goal, it is necessary to solve the following tasks: to analyze photolithography technology and types of polymer 3D printing; to develop a technological process for exposing photopolymer masks to a printed circuit board blank using 3D printing technologies; to conduct experimental studies to determine the optimal exposure parameters; on the basis of the empirical results obtained, to calculate the correlation coefficients of the factors for recall; to construct a linear regression model of the dependence of the deviations of the geometric dimensions of the printed conductors on the parameters of solutions for etching and exposure conditions. Results: The constructed regression models will become the basis for creating a software database that optimizes the initial images of the topology of printed conductors in the automated production of printed circuit boards. This will simplify the process of developing the topology of printed circuit boards, taking into account the real influence of the parameters of the technological operations of etching and exposure on the thickness of the tracks of the conductors of the printed circuit boards, which will reduce the proportion of rejects in the manufacture of single- and double-sided printed circuit boards. Conclusions: an LCD exposure technology and a method for studying the effects of exposure factors on the quality of printed circuit board topology are proposed, which provide sufficient empirical data to create regression models for calculating the influence of technological factors on the final dimensions of conductive paths in the production of printed circuit boards. Further development of the proposed technology will make it possible to manufacture rigid and flexible printed circuit boards completely, with conductive paths, a dielectric base, electronic elements that can be used in various devices.

Development of High Permeability Core Materials for Embeddable Inductors in Flexible Organic Substrates

2003 ◽  
Vol 769 ◽  
Author(s):  
C. K. Liu ◽  
P. L. Cheng ◽  
S. Y. Y. Leung ◽  
T. W. Law ◽  
D. C. C. Lam
Keyword(s):  
Low Temperature ◽  
Sol Gel ◽  
Circuit Board ◽  
Organic Substrates ◽  
Circuit Boards ◽  
High Permeability ◽  
Electrical Measurements ◽  
Different Temperatures ◽  
Spiral Inductors ◽  
Ceramic Tape

AbstractCapacitors, resistors and inductors are surface mounted components on circuit boards, which occupy up to 70% of the circuit board area. For selected applications, these passives are packaged inside green ceramic tape substrates and sintered at temperatures over 700°C in a co-fired process. These high temperature processes are incompatible with organic substrates, and low temperature processes are needed if passives are to be embedded into organic substrates. A new high permeability dual-phase Nickel Zinc Ferrite (DP NZF) core fabricated using a low temperature sol-gel route was developed for use in embedded inductors in organic substrates. Crystalline NZF powder was added to the sol-gel precursor of NZF. The solution was deposited onto the substrates as thin films and heat-treated at different temperatures. The changes in the microstructures were characterized using XRD and SEM. Results showed that addition of NZF powder induced low temperature transformation of the sol-gel NZF phase to high permeability phase at 250°C, which is approximately 350°C lower than transformation temperature for pure NZF sol gel films. Electrical measurements of DP NZF cored two-layered spiral inductors indicated that the inductance increased by three times compared to inductors without the DP NZF cores. From microstructural observations, the increase is correlated with the changes in microstructural connectivity of the powder phase.

Degradation Analysis of Thick Film Chip Resistors

2009 ◽  
Author(s):  
Bhanu Sood ◽  
Diganta Das ◽  
Michael H. Azarian ◽  
Michael Pecht
Keyword(s):  
Thick Film ◽  
Printed Circuit Board ◽  
Negative Resistance ◽  
Circuit Board ◽  
High Humidity ◽  
Circuit Boards ◽  
Chemical Modifications ◽  
Current Leakage ◽  
Printed Circuit ◽  
Degradation Analysis

Abstract Negative resistance drift in thick film chip resistors in high temperature and high humidity application conditions was investigated. This paper reports on the investigation of possible causes including formation of current leakage paths on the printed circuit board, delamination between the resistor protective coating and laser trim, and the possibility of silver migration or copper dendrite formation. Analysis was performed on a set of circuit boards exhibiting failures due to this phenomenon. Electrical tests after mechanical and chemical modifications showed that the drift was most likely caused by moisture ingress that created a conductive path across the laser trim.

Dielectric Breakdown in Printed Circuit Boards at Elevated Temperatures

1996 ◽  
Author(s):  
P. Singh ◽  
G.T. Galyon ◽  
J. Obrzut ◽  
W.A. Alpaugh
Keyword(s):  
Experimental Data ◽  
Thermal Degradation ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Elevated Temperatures ◽  
Dielectric Breakdown ◽  
Circuit Board ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Data Matching

Abstract A time delayed dielectric breakdown in printed circuit boards, operating at temperatures below the epoxy resin insulation thermo-electrical limits, is reported. The safe temperature-voltage operating regime was estimated and related to the glass-rubber transition (To) of printed circuit board dielectric. The TG was measured using DSC and compared with that determined from electrical conductivity of the laminate in the glassy and rubbery state. A failure model was developed and fitted to the experimental data matching a localized thermal degradation of the dielectric and time dependency. The model is based on localized heating of an insulation resistance defect that under certain voltage bias can exceed the TG, thus, initiating thermal degradation of the resin. The model agrees well with the experimental data and indicates that the failure rate and truncation time beyond which the probability of failure becomes insignificant, decreases with increasing glass-rubber transition temperature.

scholarly journals Special Issue: Application of Extracellular Matrix in Regenerative Medicine

2021 ◽  
Vol 11 (7) ◽  
pp. 3262
Author(s):  
Neill J. Turner
Keyword(s):  
Extracellular Matrix ◽  
Regenerative Medicine ◽  
Wound Repair ◽  
Three Dimensional ◽  
Dynamic Structure ◽  
Scaffold Material ◽  
Special Issue ◽  
Organ Regeneration ◽  
Scaffold Materials ◽  
The Many

The present Special Issue comprises a collection of articles addressing the many ways in which extracellular matrix (ECM), or its components parts, can be used in regenerative medicine applications. ECM is a dynamic structure, composed of a three-dimensional architecture of fibrous proteins, proteoglycans, and glycosaminoglycans, synthesized by the resident cells. Consequently, ECM can be considered as nature’s ideal biologic scaffold material. The articles in this Special Issue cover a range of topics from the use of ECM components to manufacture scaffold materials, understanding how changes in ECM composition can lead to the development of disease, and how decellularization techniques can be used to develop tissue-derived ECM scaffolds for whole organ regeneration and wound repair. This editorial briefly summarizes the most interesting aspects of these articles.

Three Dimensional Detection of the via in the PCB CT Image Using Morphology Operation

2015 ◽  
Vol 752-753 ◽  
pp. 1406-1412
Author(s):  
Lei Zeng ◽  
Jian Chen ◽  
Han Ning Li ◽  
Bin Yan ◽  
Yi Fu Xu ◽  
...  
Keyword(s):  
Nondestructive Testing ◽  
Printed Circuit Board ◽  
Three Dimensional ◽  
Detection Algorithm ◽  
Circuit Board ◽  
Dimensional Structure ◽  
Three Dimension ◽  
Shape Information ◽  
Printed Circuit ◽  
Testing Technology

In modern industry, the nondestructive testing of printed circuit board (PCB) can prevent effectively the system failure and is becoming more and more important. As a vital part of the PCB, the via connects the devices, the components and the wires and plays a very important role for the connection of the circuits. With the development of testing technology, the nondestructive testing of the via extends from two dimension to three dimension in recent years. This paper proposes a three dimensional detection algorithm using morphology method to test the via. The proposed algorithm takes full advantage of the three dimensional structure and shape information of the via. We have used the proposed method to detect via from PCB images with different size and quality, and found the detection performances to be very encouraging.

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