scholarly journals Silver-seed Plating Technique for fabricating Low-Loss Transmission Lines

2021 ◽  
Vol 72 (7) ◽  
pp. 381-385
Author(s):  
Norimasa FUKAZAWA ◽  
Wataru FUJIKAWA ◽  
Jun SHIRAKAMI
2016 ◽  
Vol 2016 (CICMT) ◽  
pp. 000191-000198 ◽  
Author(s):  
A. Isapour ◽  
D. Bahloul ◽  
A. B. Kouki

Abstract The wireless telecommunication systems have an undeniable role in today's society. The rapid progress of wireless services and applications accelerates demands for high data-rate reliable systems. The 60 GHz band with its 5 GHz globally unlicensed available spectrum, provides a great opportunity for the next generation of high data-rate wireless communication. Despite this attractive bandwidth surrounding 60 GHz, there are still many challenges to be addressed such as the loss performance and the integration with other systems. Low Temperature Cofired Ceramic (LTCC) technology, with its unique and mature multilayer fabrication process, has excellent capability of realizing miniaturized 3D low loss structures to overcome these challenges. Since, one of the key components in any communication system for both interconnecting and designing components is Low loss transmission lines, in this article we overview the performances and challenges for four different most practical transmission lines at 60 GHz in LTCC: Microstrip, Stripline, Coplanar Waveguide (CPW), and LTCC Integrated Waveguide (LIW).


2007 ◽  
Vol 55 (3) ◽  
pp. 561-570 ◽  
Author(s):  
Luuk F. Tiemeijer ◽  
Ralf M. T. Pijper ◽  
Ramon J. Havens ◽  
Olivier Hubert

1999 ◽  
Author(s):  
H. Ishii ◽  
N. Sahri ◽  
T. Nagatsuma ◽  
K. Machida ◽  
K. Saito ◽  
...  

2007 ◽  
Vol 55 (8) ◽  
pp. 1811-1811
Author(s):  
Luuk F. Tiemeijer ◽  
Ralf M. T. Pijper ◽  
Ramon J. Havens ◽  
Olivier Hubert

1998 ◽  
Vol 123 (1-4) ◽  
pp. 291-300 ◽  
Author(s):  
David Cai ◽  
Niels Grønbech-Jensen ◽  
A.R. Bishop ◽  
A.T. Findikoglu ◽  
D. Reagor

2019 ◽  
Vol 14 (1) ◽  
pp. 119-130 ◽  
Author(s):  
Darine Kaddour ◽  
Hamza Issa ◽  
Marwa Abdelaziz ◽  
Florence Podevin ◽  
Emmanuel Pistono ◽  
...  

2006 ◽  
Vol 969 ◽  
Author(s):  
Dong-Young Kim ◽  
Jae Kyoung Mun ◽  
Dong-Suk Jun ◽  
Haechoen Kim

AbstractThe effects of wire and ribbon bond interconnection on the transmission characteristics at millimeter wave frequency range was presented. The insertion loss and return loss was closely related with the ratio of the signal line width to that of bonded wire or ribbon. The most promise condition for low loss interconnection was that the width of bonded wire or ribbon should be compatible to the width of signal lines. In the actual fabrication of LTCC amp module, the insertion loss of packaging is very small which means that the loss due to bonding is nearly negligible. However, the S11 and S22 degraded severely due to the difference of the types of transmission lines between chip and packaging module. A new transition structure was introduced in order to compensate this difference of transmission lines.


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