scholarly journals Copper Plating on Through Glass Via(TGV)Using Both High-speed Sputtering Process and Wet Process

2021 ◽  
Vol 72 (9) ◽  
pp. 503-507
Author(s):  
Masatoshi TAKAYAMA ◽  
Kotoku INOUE ◽  
Mitsuhiro WATANABE
2001 ◽  
Vol 13 (4) ◽  
pp. 323-336 ◽  
Author(s):  
T H Hou ◽  
H L Belvin ◽  
N J Johnston

LARC™-PETI-5 is a PhenylEthynyl-Terminated Imide resin developed at NASA Langley Research Center (LARC) during the 1990s. It offers a combination of attractive composite and adhesive properties. IM7/LARC™-PETI-5 composites exhibit thermal and thermo-oxidative stability typical of polyimides, superior chemical resistance and processability, excellent mechanical properties, toughness and damage tolerance. It was selected for study in the High Speed Research program aimed at developing technologies for a future supersonic aircraft, the High Speed Civil Transport, with a projected life span of 60 000 h at a cruise speed up to March 2.4. Robust autoclave processing cycles for LARC™-PETI-5 composites have been thoroughly designed and demonstrated, which involved hand lay-up of solvent-ladened ‘wet’ prepregs. However, this type of processing is not only costly but also environmentally unfriendly. Volatile management and shrinkage could become serious problems in the fabrication of large complex airframe structural subcomponents. Robotic tow placement technology utilizing ‘dry’ material forms represents a new fabrication process which overcomes these deficiencies. This work evaluates and compares mechanical properties of composites fabricated by heated head automated tow placement (dry process) with those obtained by hand lay-up/autoclave fabrication (wet process). Thermal and rheological properties of the robotically as-placed uncured composites were measured. A post-cure cycle was designed due to the requirement of the PETI-5 resin for a 370 °C/1 h hold to reach full cure, conditions which cannot be duplicated during heated head robotic placement. Mechanical properties such as 0° flexural strength and modulus, open hole tensile and compressive strength and moduli, reduced section compression dogbone compressive strength, and modified zippora-medium small (MZ-MS) tensile and compressive properties were obtained on the post-cured panels. These properties compared favourably with those obtained from the wet process.


Author(s):  
Rosemary Bell ◽  
Joseph Lachowski ◽  
Mitsuru Haga ◽  
Inho Lee ◽  
Regina Cho ◽  
...  

Advanced packaging technologies require materials which will allow for better resolution of patterns associated with the ever more challenging device architecture, along with materials that will allow for higher throughput. Device throughput can be increased with imaging materials that have higher sensitivity and metallization chemistries with faster electrodeposition rates. Chemically amplified photoresists offer the advantages of excellent sensitivity and resolution with good process margins, coupled with excellent stripping performance and plating bath compatibility for the film thicknesses that are required in packaging applications. Electrolytic copper plating products with fast deposition rates are a key factor in decreasing wafer plating time and increasing throughput. However, it is the integration of the photoimaging material and the subsequent plating chemistry that is essential in producing metallized structures for copper pillar and solder applications. Because the profile of the resist image is directly transferred during the electroplating process, it is critical to have a well formed image that is resistant to the plating chemistry. Plating bath contamination and resist strippability are other key factors in producing void-free, defect-free structures. Dow's newly introduced chemically amplified material is capable of film thicknesses from 30um to 80um by a single coating process with good uniformity. Imaging and process latitude are demonstrated at 40um and 65um thicknesses with emphasis on sidewall profiles and sensitivity. Further, the photoresist compatibility with INTERVIA™ Cu 8540 Electroplating Copper Chemistry is shown, along with NIKAL™ BP Ni plating chemistry and SOLDERON™ BP TS 6000 SnAg plating chemistry compatibility. The improvements in product line from Dow's INTERVIA™ Cu 8540 to INTERVIA™ 9000 Electroplating Copper Chemistry is also demonstrated in the paper, with thickness uniformity, high plating speed, and tunable morphology highlighted for various applications. The power of integration has enabled the development of this suite of products designed for compatibility and superior performance for advanced packaging technologies. ™ Trademark of The Dow Chemical Company


1963 ◽  
Vol 14 (9) ◽  
pp. 350-354 ◽  
Author(s):  
Yoshihiko KUWA ◽  
Takashi SUZUKI ◽  
Yasuo NODA

Author(s):  
A A Tikhonov ◽  
D A Filippov ◽  
S I Arendateleva ◽  
V A Popov ◽  
T I Perepelitsa
Keyword(s):  

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