scholarly journals Evaluation of Epoxy Resin Composites in Multilayer Structure for Stealth Technology

Author(s):  
Tamara Indrusiak Silva ◽  
Ketly Pontes Soares ◽  
Iaci Miranda Pereira ◽  
Loan Filipi Calheiros ◽  
Bluma Guenther Soares

The present work evaluates a multilayer structure based on epoxy resin for stealth technology. The structure consists of two absorber layers with nanoferrite and a resistive layer between them containing polyaniline (PANI) with and without carbon nanotube (CNT). The best reflection loss result multilayer structure analyzed was Ni-PANICNT-Fe with RL = –22dB at 11,9 GHz, justified by higher conductivity loss due to the CNT in PANI epoxy composite.

2010 ◽  
Vol 19 (6) ◽  
pp. 096369351001900 ◽  
Author(s):  
Z Špitalský ◽  
S N Georga ◽  
C A Krontiras ◽  
C Galiotis

The dielectric response of oxidized multi-walled carbon nanotube / epoxy resin composites, is investigated with respect to filler content concentration, over a wide temperature and frequency range. Specimens, below the percolation threshold, exhibit similar behaviour to that of the neat epoxy. Two relaxation modes are observed in the low temperature region, attributed to the re-arrangement of small parts of the polymer chain (γ-mode) and the reorientation of polar side groups (β-mode) respectively, where in the high temperature region the evolution of the α-mode is present. Direct current (DC) conduction follows the Vogel – Tamann - Fulcher equation as expected. The dielectric response of specimens, above the percolation threshold, follows the “Random Free Energy Barrier Model”. DC conductivity exhibits Arrhenius temperature dependence with two distinct regions. The activation energies of both regions were evaluated. The contact resistance between two adjacent carbon nanotubes was also calculated. The effective dielectric constant as well as the capacitance of the specimens, above the percolation threshold, can be modulated by means of an applied DC bias voltage.


2006 ◽  
Vol 23 (1) ◽  
pp. 65-75 ◽  
Author(s):  
O. Jacobs ◽  
W. Xu ◽  
B. Schädel ◽  
W. Wu

2005 ◽  
Vol 97 (3) ◽  
pp. 034303 ◽  
Author(s):  
Ayman Bassil ◽  
Pascal Puech ◽  
Georges Landa ◽  
Wolfgang Bacsa ◽  
Sophie Barrau ◽  
...  

Polymers ◽  
2022 ◽  
Vol 14 (2) ◽  
pp. 333
Author(s):  
Amal Nassar ◽  
Mona Younis ◽  
Mohamed Ismail ◽  
Eman Nassar

This work investigated the effects of using a new fabrication technique to prepare polymer composite on the wear-resistant performance of epoxy resin composites under dry friction conditions. Polymer composite samples with different weight contents of silicon carbide (SiC) particles were manufactured. This paper addresses the wear behavior of the obtained samples. With the suggested technique, the samples were prepared from epoxy/silicon carbide particles using a layer of thin kraft paper to prevent the sedimentation of the ceramic particles and to control the weight content of ceramic in the polymer. Kraft paper was used as a layer in the polymer composite. The hardness, wear resistance, and water absorption capacity of the produced epoxy composite samples prepared using the kraft paper technique were evaluated. The morphology of epoxy composite samples showed a significant improvement in the ceramic distribution and enhancement of interface bonding between ceramic and the polymer. The hardness values of the developed polymer composites were enhanced by up to 42.8%, which was obtained at 18 wt.% SiC particles. Increasing the ceramic content in the epoxy also led to the enhancement of wear resistance compared with pure epoxy. The results of the microstructure study also showed that the kraft paper layers helped in maintaining the distribution of the ceramic particles according to the previously specified content in each layer in the sample. Wear tests showed that the wear rate of the polymer composite decreased with the increase in the ceramic content. This study provides a new recycling method for using old kraft paper in polymer composite manufacturing to improve the distribution of ceramic particles in the polymer matrix.


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