scholarly journals Evaluation Method of Common-mode Control Using the CMRR in Power Distribution Interconnection on Printed Circuit Board

2013 ◽  
Vol 16 (4) ◽  
pp. 275-282
Author(s):  
Mutsumi Shimazaki ◽  
Shinya Nishi ◽  
Hideki Asai
Author(s):  
Hansang Lim ◽  
Do-Hwan Jung ◽  
Geono Kwon ◽  
Young Jong Lee ◽  
Jun Seo Park

An automotive junction box distributes electric power to electric systems installed in a vehicle with overcurrent protection. As a larger number of electric systems are installed, the junction box is equipped with more components, functionalities and connections. However, owing to the fuse accessibility, its installation space is so restricted that a downsized design is required for the junction box. The junction box is composed of small signal circuitry for control and monitoring, and large current-carrying circuitry for power distribution which includes many parallel traces. Because of these unique features, widely used techniques for downsizing printed-circuit boards are not applicable. Also, there is no rule for designing large current-carrying parallel traces, and it is difficult to optimize the size of the printed-circuit board for the automotive junction box. This paper presents the design rules for a printed-circuit board when downsizing a junction box. First, the layout strategy for the power distribution components is presented, which is determined by the sum of the squares of the currents flowing through connector pairs. Then, the thermal effects of parallel traces are simulated for different conditions by using thermal analysis software. Based on the results, an analytical estimation of the additional temperature rises due to parallel traces and rules for a thermally effective arrangement of the parallel traces are presented.


Author(s):  
Toshio Tomimura ◽  
Yoshihiro Shiotsu ◽  
Yasushi Koito ◽  
Masaru Ishizuka ◽  
Tomoyuki Hatakeyama

To perform a rational thermal design of a printed circuit board (PCB) with highly anisotropic heat transfer nature in its initial stage, effective thermal conductivities in thickness direction and in in-plane direction must be given depending on the electric circuit of the board. However, a simple evaluation method for the effective thermal conductivities of such PCB has not been developed yet. In this study, as the first step to propose a simple evaluation method, the heat transfer coefficient by natural convection around a horizontal disk, which is indispensable for measuring the effective thermal conductivity, has been evaluated. Furthermore, the thermal conductivity of the glass epoxy resin in in-plane direction has been evaluated by applying the evaluated heat transfer coefficient, and then, the validity of the proposed thermal conductivity measurements of the anisotropic PCB has been confirmed.


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