scholarly journals Sensitivity Analysis of a Circuit Model for Power Distribution Network in a Multilayered Printed Circuit Board

2017 ◽  
Vol 59 (6) ◽  
pp. 1993-2001 ◽  
Author(s):  
Ketan Shringarpure ◽  
Siming Pan ◽  
Jingook Kim ◽  
Jun Fan ◽  
Brice Achkir ◽  
...  
Author(s):  
Hansang Lim ◽  
Do-Hwan Jung ◽  
Geono Kwon ◽  
Young Jong Lee ◽  
Jun Seo Park

An automotive junction box distributes electric power to electric systems installed in a vehicle with overcurrent protection. As a larger number of electric systems are installed, the junction box is equipped with more components, functionalities and connections. However, owing to the fuse accessibility, its installation space is so restricted that a downsized design is required for the junction box. The junction box is composed of small signal circuitry for control and monitoring, and large current-carrying circuitry for power distribution which includes many parallel traces. Because of these unique features, widely used techniques for downsizing printed-circuit boards are not applicable. Also, there is no rule for designing large current-carrying parallel traces, and it is difficult to optimize the size of the printed-circuit board for the automotive junction box. This paper presents the design rules for a printed-circuit board when downsizing a junction box. First, the layout strategy for the power distribution components is presented, which is determined by the sum of the squares of the currents flowing through connector pairs. Then, the thermal effects of parallel traces are simulated for different conditions by using thermal analysis software. Based on the results, an analytical estimation of the additional temperature rises due to parallel traces and rules for a thermally effective arrangement of the parallel traces are presented.


1995 ◽  
Vol 117 (4) ◽  
pp. 275-280 ◽  
Author(s):  
Seo Jin Joo ◽  
Byung Man Kwak

A chip layout problem is formulated as a new class of shape optimal design called a subdomain optimization, where the chips correspond to subdomains whose configuration and location are to be decided. Shape design sensitivity analysis for a perturbed subdomain is made based on the concept of material derivative and adjoint system. Introducing a suitable category of design velocity fields, the change of the configuration is adequately describable. Sensitivities and optimal positions of chips on a printed circuit board are obtained and their accuracy discussed.


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