scholarly journals Trends in High Density Packaging Technologies. 11. Trend of Enviromental Friendly Flame Retardant Resins. Printed Circuit Board.

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pp. 74-78 ◽  
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Vol 193 (3-4) ◽  
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pp. 1337-1341 ◽  
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A. Van Calster

1992 ◽  
Vol 15 (4) ◽  
pp. 418-425 ◽  
Author(s):  
A. Takahashi ◽  
N. Ooki ◽  
A. Nagai ◽  
H. Akahoshi ◽  
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Vol 130 (2) ◽  
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