scholarly journals NEW LABORATORY TASK "MEMS - ACCELEROMETER SENSOR"

2009 ◽  
Vol 1 (1) ◽  
pp. 123-129
Author(s):  
František HRUŠKA
Keyword(s):  
Accelerometer Sensor ◽  
Mems Accelerometer ◽  
Laboratory Task

scholarly journals Calibration Analysis of High-G MEMS Accelerometer Sensor Based on Wavelet and Wavelet Packet Denoising

Sensors ◽  
2021 ◽  
Vol 21 (4) ◽  
pp. 1231
Author(s):  
Yunbo Shi ◽  
Juanjuan Zhang ◽  
Jingjing Jiao ◽  
Rui Zhao ◽  
Huiliang Cao
Keyword(s):  
Wavelet Packet ◽  
Estimation Method ◽  
Likelihood Estimation ◽  
Parameter Extraction ◽  
Accelerometer Sensor ◽  
Oscillation Phase ◽  
Mems Accelerometer ◽  
Optimal Tree ◽  
Adaptive Decomposition ◽  
Entropy Criterion

High-G accelerometers are mainly used for motion measurement in some special fields, such as projectile penetration and aerospace equipment. This paper mainly explores the wavelet threshold denoising and wavelet packet threshold denoising in wavelet analysis, which is more suitable for high-G piezoresistive accelerometers. In this paper, adaptive decomposition and Shannon entropy criterion are used to find the optimal decomposition layer and optimal tree. Both methods use the Stein unbiased likelihood estimation method for soft threshold denoising. Through numerical simulation and Machete hammer test, the wavelet threshold denoising is more suitable for the dynamic calibration of a high-G accelerometer. The wavelet packet threshold denoising is more suitable for the parameter extraction of the oscillation phase.

scholarly journals A Novel All-Optical Sensor Design Based on a Tunable Resonant Nanocavity in Photonic Crystal Microstructure Applicable in MEMS Accelerometers

2020 ◽  
Author(s):  
Mojtaba Hosseinzadeh Sani ◽  
Hamed Saghaei ◽  
Mohammad Amin Mehranpour ◽  
Afsaneh Asgariyan Tabrizi
Keyword(s):  
Photonic Crystal ◽  
Optical Sensor ◽  
Free Spectral Range ◽  
Resonant Peak ◽  
Propagation Time ◽  
Navigation Systems ◽  
Accelerometer Sensor ◽  
Mems Accelerometer ◽  
All Optical ◽  
Technical Interest

Abstract In view of the large scientific and technical interest in the MEMS accelerometer sensor and the limitations of capacitive, resistive piezo, and piezoelectric methods, we focus on the measurement of the seismic mass displacement using a novel design of the all-optical sensor (AOS). The proposed AOS consists of two waveguides and a ring resonator in a two-dimensional rod-based photonic crystal (PhC) microstructure, and a holder which connects the central rod of a nanocavity to a proof mass. The photonic band structure of the AOS is calculated with the plane-wave expansion approach for TE and TM polarization modes, and the light wave propagation inside the sensor is analyzed by solving Maxwell’s equations using the finite-difference time-domain method. The results of our simulations demonstrate that the fundamental PhC has a free spectral range of about 730 nm covering the optical communication wavelength-bands. Simulations also show that the AOS has the resonant peak of 0.8 at 1.644µm, quality factor of 3288, full width at half maximum of 0.5nm, and figure of merit of 0.97. Furthermore, for the maximum 200nm nanocavity displacements in the x- or y-direction, the resonant wavelengths shift to 1.618µm and 1.547µm, respectively. We also calculate all characteristics of the nanocavity displacement in positive and negative directions of the x-axis and y-axis. The small area of 104.35 µm2 and short propagation time of the AOS make it an interesting sensor for various applications, especially in the vehicle navigation systems and aviation safety tools.

Optical MEMS accelerometer sensor relying on a micro‐ring resonator and an elliptical disk

2019 ◽  
Vol 13 (7) ◽  
pp. 1102-1106 ◽  
Author(s):  
Ali Kazemi Nasaban Shotorban ◽  
Kian Jafari ◽  
Kambiz Abedi
Keyword(s):  
Ring Resonator ◽  
Optical Mems ◽  
Accelerometer Sensor ◽  
Mems Accelerometer

The Influence of Die-Attach Adhesives on the Packaging of MEMS Accelerometer

2015 ◽  
Vol 645-646 ◽  
pp. 533-537 ◽  
Author(s):  
Peng Peng ◽  
Xiao Ping He ◽  
Lian Ming Du ◽  
Wu Zhou ◽  
Hui Jun Yu ◽  
...  
Keyword(s):  
Thermal Coefficient ◽  
Adhesive Material ◽  
Accelerometer Sensor ◽  
Element Analysis ◽  
Mems Accelerometer ◽  
Capacitive Accelerometer ◽  
Die Attach ◽  
Stress And Deformation ◽  
Output Characteristics ◽  
Significant Factors

The attachment of the micromechanical silicon die to the substrate is one of the most critical steps in the packaging of highly accurate MEMS (microelectro-mechanical systems) accelerometer. The stress and strains, induced during die-attach process because of TCE (thermal coefficient of expansion) mismatches between different materials, will adversely affect the output characteristics of the accelerometer sensor. In this paper, three different materials: OE138, DG-3S and H70E are selected as the die-attach adhesives of a MEMS comb capacitive accelerometer. The stress and deformation of the silicon die, after the accelerometer model is cured from 80 °C to 20 °C, are evaluated with the aid of finite element analysis (FEA). As the results show, Young’s modulus and the thickness of the adhesives are the most significant factors influencing the stress and deformation of the silicon die. Soft adhesive material (OE138) have better stress absorption, and the stress and deformation of the silicon die decrease with the increasing thickness of the adhesive. Consequently, a soft and thick adhesive is recommended for the die-attach packaging of MEMS accelerometer.

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