scholarly journals Application of Thermo-Viscoelastic Laminated Plate Theory to Predict Warpage of Printed Circuit Boards

10.5772/49978 ◽  
2012 ◽  
Author(s):  
Takaya Kobayashi ◽  
Masami Sato ◽  
Yasuko Mihar
Keyword(s):  
Printed Circuit Boards ◽  
Plate Theory ◽  
Laminated Plate ◽  
Circuit Boards ◽  
Printed Circuit

scholarly journals Application of Thermo-Viscoelastic Laminated Plate Theory to Predict Warpage of Printed Circuit Boards

2009 ◽  
Author(s):  
Takao Mikami ◽  
Takaya Kobayashi
Keyword(s):  
Printed Circuit Boards ◽  
Plate Theory ◽  
Simple Procedure ◽  
Fem Analysis ◽  
Ease Of Use ◽  
Accurate Estimation ◽  
Circuit Boards ◽  
Reflow Process ◽  
Printed Circuit ◽  
Planning And Design

The rapid assembly of printed circuit boards to meet the desired goal of thinning the board creates more complexity in the reflow process, to control the occurrence of warpage in the board. Therefore, certain methods are preferred for simply yet accurately predicting the amount of warpage inevitable in the reflow process. Responding to such a need, the study was carried out aiming to provide a specific numerical method based on the multilayered plate theory, resulting in a simple procedure capable of supplying an accurate estimation of the warped deformation of the board. The estimation results derived from this method were compared with the FEM analysis results and confirmed to be in good agreement. Application of this method is designed for ease of use to estimate the warpage at any stage of planning and design.

Slit Effect of Common Ground Patterns in Affecting Cross-Talk Noise between Two Parallel Signal Traces on Printed Circuit Boards

2008 ◽  
Vol 128 (11) ◽  
pp. 657-662 ◽  
Author(s):  
Tsuyoshi Maeno ◽  
Yukihiko Sakurai ◽  
Takanori Unou ◽  
Kouji Ichikawa ◽  
Osamu Fujiwara
Keyword(s):  
Cross Talk ◽  
Printed Circuit Boards ◽  
Common Ground ◽  
Circuit Boards ◽  
Printed Circuit

Influence of Component Mounting Density on Oscillating Characteristics of Multilayer Printed Circuit Boards

2018 ◽  
Vol 23 (2) ◽  
pp. 141-148
Author(s):  
S.Sh. Rekhviashvili ◽  
◽  
M.O. Mamchuev ◽  
V.V. Narozhnov ◽  
M.M. Oshkhunov ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Oscillating Characteristics

Noise properties of thin-film Ni-P resistors embedded in printed circuit boards

2013 ◽  
Vol 61 (3) ◽  
pp. 731-735
Author(s):  
A.W. Stadler ◽  
Z. Zawiślak ◽  
W. Stęplewski ◽  
A. Dziedzic
Keyword(s):  
Thin Film ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Noise Component ◽  
Printed Circuit ◽  
Resistance Bridge ◽  
Different Types ◽  
Signal Path ◽  
Resistance Fluctuations ◽  
Made In

Abstract. Noise studies of planar thin-film Ni-P resistors made in/on Printed Circuit Boards, both covered with two different types of cladding or uncladded have been described. The resistors have been made of the resistive-conductive-material (Ohmega-Ply©) of 100 Ώ/sq. Noise of the selected pairs of samples has been measured in the DC resistance bridge with a transformer as the first stage in a signal path. 1/f noise caused by resistance fluctuations has been found to be the main noise component. Parameters describing noise properties of the resistors have been calculated and then compared with the parameters of other previously studied thin- and thick-film resistive materials.

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