scholarly journals Mode-I and Mode-II Crack Tip Fields in Implicit Gradient Elasticity Based on Laplacians of Stress and Strain. Part II: Asymptotic Solutions

2020 ◽  
Author(s):  
Carsten Broese ◽  
Jan Frischmann ◽  
Charalampos Tsakmakis

We develop asymptotic solutions for near-tip fields of Mode-I and Mode-II crack problems and for model responses reflected by implicit gradient elasticity. Especially, a model of gradient elasticity is considered, which is based on Laplacians of stress and strain and turns out to be derivable as a particular case of micromorphic (microstrain) elasticity. While the governing model equations of the crack problems are developed in Part I, the present paper addresses analytical solutions for near-tip fields by using asymptotic expansions of Williams’ type. It is shown that for the assumptions made in Part I, the model does not eliminiate the well-known singularities of classical elasticity. This is in contrast to conclusions made elsewhere, which rely upon different assumptions. However, there are significant differences in comparison to classical elasticity, which are discussed in the paper. For instance, in the case of Mode-II loading conditions, the leading terms of the asymptotic solution for the components of the double stress exhibit the remarkable property that they include two stress intensity factors.

2013 ◽  
Vol 750 ◽  
pp. 264-267 ◽  
Author(s):  
Masahiko Makizaki ◽  
Hisao Matsunaga ◽  
Keiji Yanase ◽  
Masahiro Endo

Effect of occasional mode II loading on subsequent mode I fatigue crack growth behavior was investigated by using a thin-walled tube made of 7075-T6511 aluminum alloy. Careful observation of crack growth behavior revealed that the occasional mode II loading has two contradictory effects for crack growth behavior. The first is a retardation effect that is associated with the plastic deformation near crack tip. However, this effect is negligibly small for the crack growth life as a whole. The second is an acceleration effect caused by mode II fatigue crack growth itself. It was found that under relatively high ΔK level, the mode II crack growth was about an order magnitude faster than mode I crack growth. Therefore, to properly evaluate the effect of occasional shear loading in the 7075 alloy, the mode II crack growth should be taken into account.


2017 ◽  
Vol 175 ◽  
pp. 235-246 ◽  
Author(s):  
M.R. Ayatollahi ◽  
M. Zakeri
Keyword(s):  
Mode I ◽  
Mode Ii ◽  

Author(s):  
Nicholas Aerne ◽  
John P. Parmigiani

The need for lightweight components and non-destructive fastening techniques has led to the growth of adhesive use in many industries. Modeling the behavior of adhesives in fastening joints can help in the design process to make an optimized joint. To optimize joints in the design process, the loading conditions, environmental conditions of service, thickness of bond, and bonding procedures all need to be refined for the adhesive of interest. However, in available technical data sheets of adhesives provided by manufactures there is a gap in what is sufficient to accurately model and predict the behavior of real-world adhesive conditions. This body of research presents the results of the effects of temperature, thickness, and working time on adhesive properties. These effects can be observed with test specimens from the loading modes of interest. The loading modes of interest are mode I and mode II loading for the current study. The specimen for mode I loading is the Double Cantilever Beam, and for mode II loading is the Shear Loaded Dual Cantilever Beam. The effect of temperature will be tested by testing each specimen at −20°C, 20°C, and 40°C. Two bond thicknesses for adhesive thickness effects were tested. The working time had a control group bonded in the recommended working time and an expired working time group where the specimens were not joined until 10 minutes had passed from the recommended working time. Triplicates of each specimen at the respective conditions were tested. The adhesive selected for this research was Plexus MA832. The results of the experiment show that adhesive factors such as temperature, thickness, and working time can have degrading effects on adhesive performance in mode I and mode II.


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