Photosensitivity and Chemical Resistance of Ultraviolet Curable Resins Based on Epoxy Acrylate for Applications to Protection Layers

Polymer Korea ◽  
2021 ◽  
Vol 45 (5) ◽  
pp. 704-710
Author(s):  
Baekseo Choi ◽  
Geun Yeong Choe ◽  
Yoon Soo Han
e-Polymers ◽  
2015 ◽  
Vol 15 (6) ◽  
pp. 447-450 ◽  
Author(s):  
Fengguo Liu ◽  
Ying Wang ◽  
Xiangxin Xue ◽  
He Yang

AbstractEpoxy acrylate (EA) and tripropylene glycol diacrylate (TPGDA) are two main components of ultraviolet-curable coatings. In this study, the viscosity of EA-TPGDA binary mixtures at various mass ratios was measured by a rotational viscometer at temperatures between 298.15 and 313.15 K. The temperature dependence of the viscosity of the mixtures is discussed. An empirical correlation between the viscosity and the temperature was obtained based on the Andrade equation. The results indicated that the calculated viscosity values show a good agreement with experimental data. This will contribute to the evaluation of the rheological properties and provide a theoretical basis for the industrial application of coatings.


2017 ◽  
Vol 109 ◽  
pp. 38-44 ◽  
Author(s):  
Fengguo Liu ◽  
Linqing Miao ◽  
Ying Wang ◽  
Xiangxin Xue ◽  
He Yang

2010 ◽  
Vol 4 (3) ◽  
pp. 205-216
Author(s):  
Firdous Habib ◽  
◽  
Madhu Bajpai ◽  

Polymeric materials are exposed to high temperatures that results in lowering of the film integrity. A blend of an epoxy resin with the silicone acrylate resin was developed to provide high heat resistance UV cured coatings. Earlier siliconized epoxy coatings had been developed by conventional curing. But due to environmental awareness, high productivity rate, low process costs and energy saving UV curable coatings are enjoying considerable growth. Thermally stable UV cured coatings used in the present study were developed from silicone acrylate and epoxy acrylate resin with different diluents and photoinitiator. Such coatings provide higher thermal stability (693 K) along with physical and chemical resistance. In addition, such coatings can also be obtained by using functional amino silanes. The resin developed provides a simple and practical solution to improve heat resistance along with physical and chemical resistance of the UV cured coatings. The purpose of this research paper is to develop UV curable heat resistant coatings by the combination of inorganic and organic polymer, taking epoxy acrylate as a base resin.


2000 ◽  
Vol 629 ◽  
Author(s):  
John V. St. John ◽  
Patty Wisian-Neilson

ABSTRACTPoly (methylphenylphosphazene) (PMPP) is an example of a unique class of inorganic polymers with alternating – (P=N)– backbones. Chemical modification of bulk PMPP can result in changes of physical properties such as chemical resistance, onset temperature of thermal degradation, elasticity, and flexibility. Surface modification of PMPP allows tailoring of the chemical properties at the polymer interface while maintaining the integrity of the bulk polymer. In this research, PMPP thin films were treated to form carboxylate or carboxylic acid groups at the surface. Surface modification was monitored by following changes in contact angle. The hydrophobic/hydrophilic interactions of carboxylated PMPP surfaces allow for mesoscale interactions of thin polymer films.


2018 ◽  
Author(s):  
Ong Pei Hoon ◽  
Ng Kiong Kay ◽  
Gwee Hoon Yen

Abstract Chemical etching is commonly used in exposing the die surface from die front-side and die backside because of its quick etching time, burr-free and stress-free. However, this technique is risky when performing copper lead frame etching during backside preparation on small and non-exposed die paddle package. The drawback of this technique is that the copper leads will be over etched by 65% Acid Nitric Fuming even though the device’s leads are protected by chemical resistance tape. Consequently, the device is not able to proceed to any other further electrical measurements. Therefore, we introduced mechanical preparation as an alternative solution to replace the existing procedure. With the new method, we are able to ensure the copper leads are intact for the electrical measurements to improve the effectiveness and accuracy of physical failure analysis.


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